Supersaturated brazing filler metal and preparation method thereof

A technology of solder and silver-based solder, applied in welding equipment, manufacturing tools, metal processing equipment, etc., can solve the problems affecting the popularization and application of silver-based solder, the difficulty of processing the solder, and the difficulty in meeting the needs of beneficial elements in microstructure and properties. problems, to achieve the effect of saving content, short implementation time, and reducing raw material costs

Active Publication Date: 2016-02-24
NORTH CHINA UNIV OF WATER RESOURCES & ELECTRIC POWER
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, In (or Sn or Ga or binary alloys) in silver copper indium, silver copper gallium, silver copper tin, silver copper zinc tin, silver copper zinc indium, silver copper zinc gallium and other solders produced by the above melting and alloying method There are limits to the content of elements, otherwise the solder is difficult to process, which will affect the popularization and application of silver-based solder
[0006] With the continuous development and application of new materials and new technologies in the industry and the higher requirements of structural parts for brazing joints, the requirements for beneficial elements in solders including silver-based solders are getting higher and higher. Only traditional The smelting and alloying method to regulate the microstructure and properties of solder has been difficult to meet the demand for beneficial elements in industrial production

Method used

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  • Supersaturated brazing filler metal and preparation method thereof

Examples

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Comparison scheme
Effect test

preparation example Construction

[0019] The preparation method of supersaturated solder of the present invention is:

[0020] First put the metal material of the base solder into the HRJ-13 smelting furnace, and prefabricate the base solder through casting, annealing, extrusion, rolling or drawing; then use the conventional electroforming process on the surface of the base solder Electroforming metal layer (electroforming equipment model EFT6300), after the electroforming process is completed, the metal layer is infiltrated into the base solder by using the temperature gradient diffusion method of the protective atmosphere. The specific operation steps are: first put it into 25~250 °C VDF-7160 vacuum drying oven for 0.5~10min (the reaction principle is the thermal motion of atoms), and then put it into the HTL-30 heat treatment furnace at 20~230°C for 2~30h (metallurgical reaction, forming a compound phase) ), and then cooled with the furnace to obtain supersaturated solder.

Embodiment 1

[0023] A supersaturated silver-based solder is prepared, the base solder is BAg60Cu, the metal layer is an indium electroforming layer, and the transition layer is composed of an AgIn compound phase and a CuIn compound phase. The weight percentages of the base solder, the transition layer and the metal layer are as follows, the base solder is 87.5%, the transition layer is 11.9%, and the metal layer is 0.6%.

[0024] First put 600g of metal silver and 400g of copper into the melting furnace, and prefabricate it into a sheet-shaped matrix solder BAg60Cu with a thickness of 0.35mm through casting, annealing, extrusion, rolling or drawing; The front and back sides of the solder are electroformed with indium (the thickness of one side is 21 μm); after the electroforming process is completed, the indium metal layer is infiltrated into the BAg60Cu matrix solder by using the temperature gradient diffusion method of the protective atmosphere. The BAg60Cu solder of the indium electrofo...

Embodiment 2

[0027] A supersaturated silver-based solder is prepared, the base solder is BAg50Cu, the metal layer is an indium-tin alloy electroforming layer, and the transition layer is composed of AgCuSn compound phase, AgCuIn compound phase, CuIn compound phase and CuSn compound phase. The weight percentages of the base solder, the transition layer and the metal layer are as follows: 90.0% of the base solder, 9.5% of the transition layer, and 0.5% of the metal layer.

[0028] First put 500g of metallic silver and 500g of copper into the melting furnace, and form it through casting, annealing, extrusion, rolling or drawing, and prefabricate it into a sheet-shaped matrix solder BAg50Cu with a thickness of 0.30mm; then use the alloy electroforming indium tin process Electrocast indium tin on the front and back of the BAg50Cu matrix solder (thickness on one side is 16 μm); after the alloy electroforming process is completed, use the temperature gradient diffusion method of the protective atm...

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Abstract

The invention discloses supersaturated brazing filler metal. The supersaturated brazing filler metal comprises base brazing filler metal and a metal electroforming layer covering the base brazing filler metal, and a transition layer formed by diffusion reaction between solid solutions in the base brazing filler metal and the metal electroforming layer is arranged between the base brazing filler metal and the metal electroforming layer. A preparation method comprises the steps of placing raw metal material of the base brazing filler metal into a smelting furnace and prefabricating the raw metal material to form the base brazing filler metal through casting, annealing, extruding and rolling or drawing formation; electroforming the metal layer on the surface of the base brazing filler metal through the electroforming process, placing the base brazing filler metal into a vacuum drying oven of 25-250 DEG C for permeation for 0.5-10 minutes after the electroforming process is completed, placing the permeated base brazing filler metal into a thermal treatment furnace of 20-230 DEG C for diffusion for 2-30 hours and finally cooling the base brazing filler metal naturally in the furnace so as to obtain the supersaturated brazing filler metal. The supersaturated brazing filler metal is low in melting temperature and good in wettability and can be applied to the medium-temperature brazing field after being machined into strip shapes or thread shapes or rod shapes. The preparation method provides a new technological approach for manufacturing and producing of the brazing filler metal.

Description

technical field [0001] The invention relates to brazing materials, in particular to a supersaturated brazing filler metal, and also relates to a preparation method of the supersaturated brazing filler metal. Background technique [0002] Brazing is one of the important methods of material connection. During the brazing process, the liquid phase formed by the molten solder or the diffusion between the base metal connection surface and the solder is filled between the base metals under capillary action. The gap, and the base metal interacts with the solder, then cools and solidifies to form a metallurgical bond. [0003] As a filler material for brazing, brazing material refers to a metal or alloy that melts and fills the gap between the base metal when the heating temperature is lower than the melting point of the base metal. The performance of brazing filler metals determines the quality and performance of brazing joints to a large extent. Therefore, the development of new ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/20B23K35/40
CPCB23K35/001B23K35/0222B23K35/40
Inventor 王星星王博韩林山韦乐余唐明奇龙伟民李兰伟
Owner NORTH CHINA UNIV OF WATER RESOURCES & ELECTRIC POWER
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