High thermal stability density silicon carbide ceramic circuit board substrate material and preparation method thereof

Abstract

The invention discloses a high thermal stability density silicon carbide ceramic circuit board substrate material, which has lower sintering temperature and lower coefficient of thermal expansion by compositing and using micron grade silicon carbide powder, cordierite powder and nanometer level alumina powder, enables various materials to uniformly disperse and coat because polyethylene glycol composite solvents containing nano ceramic powder transparent liquid are strong in wettability and bonding ability for power, achieves effective melting enhancing effects, is compact and tight in prepared green bodies, can obtain high relative density and high thermal stability composite ceramic substrates in relatively lower sintering temperature, and is safe and environmentally friendly and large in utilization potentiality.

Description

technical field [0001] The invention relates to the technical field of preparing silicon carbide ceramics, in particular to a highly thermally stable densified silicon carbide-based ceramic circuit board substrate material and a preparation method thereof. Background technique [0002] As the power and density of electronic components increase, the calorific value per unit volume also increases, and the requirements for the comprehensive performance of circuit substrates are getting higher and higher. Among them, ceramic substrates have good comprehensive performance in terms of insulation, thermal conductivity and Thermal expansion, chemical stability and other aspects are outstanding, and are gradually widely used in substrate materials. Among them, alumina and beryllium oxide are mainly used as substrate materials for a long time. However, alumina ceramic sheets have low thermal conductivity and thermal expansion. The coefficient does not match with Si and other shortcomi...

AI Technical Summary

Problems solved by technology

[0002] As the power and density of electronic components increase, the calorific value per unit volume also increases, and the requirements for the comprehensive performance of circuit substrates are getting higher and higher. Among them, ceramic substrates have good comprehensive performance in terms of insulation, thermal conductivity and Thermal expansion, chemical stability and other aspects are outstanding, and are gradually widely used in substrate materials. Among them, alumina and beryllium oxide are mainly used as substrate materials for a long time. However, alumina ceramic sheets have low thermal conductivity and thermal expansion. The coefficient does not match with Si and other shortcomings. Although the comprehensive performance of beryllium oxide ceramics is relatively good, its production cost is high and toxic. Although the comprehensive performance of aluminum nitride ceramics is relatively good, the production cost is high and the application is also limited. Silicon carbide as a substrate material has obvious advantages in terms of performance

[0003] Although the application prospects of silicon carbide ceramic substrates are broad, in the actual production process, there are problems such as low sintering density, low utilization rate of raw materials, and insulation to be improved, which restrict the large-scale use of such materials. Further improvements in the production process