Method for preparing high-efficiency near-ultraviolet LED with asymmetric current expansion layer by using MOCVD
A high-brightness, near-ultraviolet technology, used in semiconductor devices, electrical components, circuits, etc., can solve the problem of output power only input power
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 2
[0019] figure 1 It is a vertical cross-sectional view of a high-brightness near-ultraviolet LED with an asymmetric structure current spreading layer prepared by MOCVD technology in Example 1 of the present invention. figure 1 Al 2 o 3 Substrate 101, n-GaN 102, n-AlInGaN current spreading layer 103, InGaN / AlGaN multi-quantum well active layer 104, p-AlGaN electron blocking layer 105, p-GaN 106. Wherein, the In composition and the Al composition of the n-type current spreading layer are smaller than the In composition and the Al composition of the InGaN / AlGaN multi-quantum well active region; figure 2 It is a vertical plane view of a high-brightness near-ultraviolet LED with an asymmetric structure current spreading layer prepared by MOCVD technology in Example 2 of the present invention. figure 2 Al 2 o 3 Substrate 201, n-GaN 202, n-AlInGaN / AlGaN superlattice structure current spreading layer 203, InGaN / AlGaN multi-quantum well active layer 204, p-AlGaN electron blocking...
Embodiment 1
[0021] Use Aixtron company, tightly coupled vertical reaction chamber MOCVD growth system. Trimethylgallium (TMGa), trimethylindium (TMIn), trimethylaluminum (TMAl) were used as Group III sources during the growth process, ammonia (NH 3 ) as a Group V source, silane (SiH 4 ) as an n-type dopant source, dimagnesocene (Cp 2 Mg) as a p-type dopant source, first Al in the MOCVD reaction chamber 2 o 3 The substrate 101 is heated to 1080-1100 degrees Celsius at H 2 Under treatment for 5 minutes, and then cooled to 530-550 degrees Celsius in Al 2 o 3 On the substrate, the reaction chamber pressure is 500torr, under the hydrogen (H2) atmosphere, the GaN buffer layer after three-dimensional growth of 20-30 nanometers is grown, and the 2-4 micron thick n-GaN102 is grown at 1000-1500 degrees Celsius, in nitrogen (N 2 ) atmosphere, grow 15-30 nm thick n-Al at 750-850 degrees Celsius x In y Ga 1-x-y N current spreading layer 103, the electron concentration increases from 10 to 10 ...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com