Copper foil for wiring board

A wiring substrate, copper foil technology, applied in conductive materials, metal/alloy conductors, conductive materials, etc., can solve the problems of insufficient softening and high flexibility, and achieve high bending and flexibility. Effect

Active Publication Date: 2017-12-01
FURUKAWA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to its excellent thermal stability at 300°C, it cannot be softened sufficiently at the curing temperature of polyimide, and cannot meet the high flexibility required for FPC applications.

Method used

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  • Copper foil for wiring board
  • Copper foil for wiring board
  • Copper foil for wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0084] Hereinafter, the present invention will be described in further detail based on examples, but the present invention is not limited to these.

[0085] Example

[0086] (Production of copper foil)

[0087] Examples 1 to 8 use #2000 abrasive paper to polish the surface, use a cathode made of polished titanium, and use the electrolyte described below at a bath temperature of 30 to 75°C and a current density of 30 to 100 A / dm 2 Electricity was applied to the thickness shown in Table 1 to produce electrolytic copper foil.

[0088] (Electrolyte composition)

[0089] With copper sulfate 200-500g / L and sulfuric acid 20-200g / L as the basic plating solution composition, the electrolyte solution was prepared by adding the additives described in Table 1 to the basic plating solution. In addition, the organic additive A uses the structure of Chemical Formula 2, the additive represented by 2-mercapto-5-benzimidazole sulfonic acid, and the structure of Chemical Formula 3, which is represented b...

Embodiment 9

[0095] Example 9 is a rolled copper alloy foil manufactured by casting and rolling methods. The raw materials of copper, chromium (Cr), tin (Sn), and zinc (Zn) are melted in a high-frequency furnace, and then cast at a cooling rate of 0.5 to 150°C / sec to obtain an ingot. The ingot contains an alloy composition of 0.3 mass% (mass%) of Cr (chromium), 0.3 mass% of Sn (tin), and 0.1 mass% of zinc, and the remainder is a substance formed by copper and inevitable impurities.

[0096] Then, the obtained ingot was subjected to a homogenization heat treatment at a temperature of 1000°C for 8 hours, and then directly hot rolled at 600 to 1050°C. Here, the temperature range of 600 to 1050°C for hot rolling is the temperature range from the start to the end of hot rolling. The processing rate is 85-97%.

[0097] Furthermore, at least between 600°C and 200°C at a cooling rate of 30°C / sec, cooling by water cooling, performing intermediate cold rolling with a work rate of 80-99.8%, and performi...

Embodiment 2

[0128] The ratio of Tmax to normal tensile strength of Example 2 exceeds 70%, and the transportability and flexibility when heated at 300°C are slightly worse, but the performance can still withstand practical use.

[0129] Compared with Example 9 using rolled copper foil, Example 4 using electrolytic copper foil showed excellent results in both the handling test and the number of bending.

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Abstract

Provided is a copper foil which is a thin foil of no more than 18m in thickness that is required for a copper foil for a printed wiring board such as a flexible copper clad laminate (FCCL) or a flexible printed circuit board (FPC), for which foil breakage or wrinkling does not occur when using roll-to-roll conveyance, which is sufficiently softened after heat treatment at a polyimide curing temperature, and which demonstrates high bendability and flexibility. The copper foil for a printed wiring board, the copper foil being copper or an alloy of copper and having a thickness of no more than 18m, is characterized by the following: a temperature Tmax, at which a gradient (S) of tensile strength represented by formula (1) becomes largest, is 150°C-370°C in a range of no more than 400°C; in such a case, a gradient (Smax) is at least 0.8; and the tensile strength after heat treatment for one hour at Tmax is 80% or less of normal strength. Formula (1): S=(Ts(T-50)-Ts(T)) / 50 Here, Ts(T) is the tensile strength after heat treatment for one hour at T°C.

Description

Technical field [0001] The present invention relates to a copper foil for wiring substrates. Background technique [0002] The flexible wiring board (FPC) is formed by bonding polyimide and copper foil to form FCCL (Flexible Copper Clad Laminates), and then print a wiring pattern on the copper foil surface of FCCL (resist coating process) ), and etching to remove unnecessary copper foil (etching process). Furthermore, if necessary, the copper foil can be thinned by soft etching, or a drill can be used to perform processes such as hole-filling plating and other processes to make a product. [0003] There are two manufacturing methods for FCCL, namely the casting method and the lamination method. [0004] The casting method is to coat the polyimide precursor, namely polyamic acid, on the copper foil as the support, and then dry it at a temperature of about 130°C to volatilize the solvent. Repeat this process several times to make the surface of the copper foil on the In the process,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D1/04H01B1/02H05K1/09
CPCC25D1/04H01B1/026H05K1/0393H05K1/09H05K2201/0355
Inventor 绘面健斋藤贵广筱崎健作藤泽季实子
Owner FURUKAWA ELECTRIC CO LTD
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