A kind of grinding wheel block and preparation method thereof, polishing grinding wheel
A grinding wheel and abrasive technology, applied in the field of superhard materials and products, can solve the problem of lack of research on the surface finish of grinding results, and achieve the effects of improving polishing efficiency and surface finish, enhancing flexibility and toughness, and high grinding efficiency
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Embodiment 1
[0032] The grinding wheel block of this embodiment is composed of the following components in volume percentage: 20% of diamond abrasive, 20% of phenolic resin, 20% of polyvinyl butyral resin, 37% of cerium oxide, and 3% of copper powder.
[0033] The preparation method of the present embodiment grinding wheel block comprises the following steps:
[0034] 1) Mix 600# diamond abrasive, 30-60 μm phenolic resin powder, 30-60 μm polyvinyl butyral resin powder, 5-10 μm cerium oxide powder and 6-10 μm copper powder in a three-dimensional drum mixer, Sieve, press with 160 ℃, 2MPa on hot press for 30 minutes, obtain molded product; The microscopic structure of described cerium oxide powder is random structure, and its structure is as follows: figure 1 shown;
[0035] 2) Put the molded product obtained in step 1) into a hardening oven for curing, and keep it warm for 130 minutes at 150°C to obtain it.
[0036] The polishing grinding wheel of this embodiment includes a grinding wheel ...
Embodiment 2
[0040] The grinding wheel block of this embodiment is composed of the following components in volume percentage: 22% diamond abrasive, 22% phenolic resin, 22% polyvinyl butyral resin, 31% cerium oxide, and 3% copper powder.
[0041] The preparation method of the grinding wheel block of this embodiment is the same as that of Embodiment 1.
[0042] The polishing grinding wheel of this embodiment includes a grinding wheel base and an abrasive layer, the abrasive layer is the above-mentioned grinding wheel block, and the grinding wheel base is a rubber base. The grinding wheel block is bonded to the rubber matrix of the corresponding size with epoxy resin, and it is shaped and sharpened by the cylindrical grinder.
[0043] The polishing grinding wheel of this embodiment can be used for processing zirconia ceramic materials whose smoothness is required to be Ra0.2.
[0044] After grinding the zirconia ceramic plate on the M7120 surface grinder, according to the feeding speed of 0.02...
Embodiment 3
[0046] The grinding wheel block of this embodiment is composed of the following components in volume percentage: 18% diamond abrasive, 18% phenolic resin, 18% polyvinyl butyral resin, 42% cerium oxide, and 4% copper powder.
[0047] The preparation method of the grinding wheel block of the present embodiment comprises the following steps:
[0048] 1) Mix 1000# diamond abrasive, 30-40μm phenolic resin powder, 30-60μm polyvinyl butyral resin powder, 6-10μm cerium oxide powder and 6-10μm copper powder in a three-dimensional drum mixer, Sieve, press with 150 ℃, 3MPa on hot press for 30 minutes, obtain molded product; The microscopic structure of described cerium oxide powder is quadrilateral structure, and its structure is as follows: figure 2 shown;
[0049] 2) Put the molded product obtained in step 1) into a hardening oven for curing, and keep it warm for 110 minutes at 160°C to obtain it.
[0050] The polishing grinding wheel of this embodiment includes a grinding wheel bas...
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Abstract
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