Spinel-type tetragonal phase CuFe2O4 ferromagnetic film and preparation method thereof
A ferromagnetic thin film, spinel-type technology, applied in the field of spinel-type tetragonal CuFe2O4 ferromagnetic thin-film and its preparation, can solve the problem of preparing spinel-type tetragonal equivalence, and achieve precise controllable chemical composition, reaction The effect of low temperature and easy reaction
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Embodiment 1
[0029] Step 1, copper nitrate and ferric nitrate are dissolved in ethylene glycol methyl ether at a molar ratio of 1:2, after stirring for 30 minutes, acetic anhydride is added to obtain a stable CuFe nitrate with a Fe ion concentration of 0.3mol / L 2 o 4 Precursor, CuFe 2 o 4 The volume ratio of ethylene glycol methyl ether and acetic anhydride in the precursor solution is 4:1;
[0030] Step 2, place the FTO / glass substrate in detergent, acetone, and ethanol in sequence for ultrasonic cleaning, rinse the FTO / glass substrate with a large amount of distilled water after each ultrasonic cleaning for 10 minutes, and finally dry it with nitrogen. Then put the FTO / glass substrate into an oven to bake until dry, take it out and let it stand at room temperature. Then place the clean FTO / glass substrate in an ultraviolet light irradiation instrument for 40 minutes to make the surface of the FTO / glass substrate reach "atomic cleanliness". Spin Coating of CuFe on FTO / Glass Substrate ...
Embodiment 2
[0034] Step 1, copper nitrate and ferric nitrate are dissolved in ethylene glycol methyl ether at a molar ratio of 1:2, after stirring for 30 minutes, acetic anhydride is added to obtain a stable CuFe nitrate with a Fe ion concentration of 0.3mol / L 2 o 4 Precursor, CuFe 2 o 4 The volume ratio of ethylene glycol methyl ether and acetic anhydride in the precursor solution is 4:1;
[0035] Step 2, place the FTO / glass substrate in detergent, acetone, and ethanol in sequence for ultrasonic cleaning, rinse the FTO / glass substrate with a large amount of distilled water after each ultrasonic cleaning for 10 minutes, and finally dry it with nitrogen. Then put the FTO / glass substrate into an oven to bake until dry, take it out and let it stand at room temperature. Then place the clean FTO / glass substrate in an ultraviolet light irradiation instrument for 40 minutes to make the surface of the FTO / glass substrate reach "atomic cleanliness". Spin Coating of CuFe on FTO / Glass Substrate ...
Embodiment 3
[0039] Step 1, dissolve copper nitrate and iron nitrate in ethylene glycol methyl ether at a molar ratio of 1:2, stir for 35 minutes, and then add acetic anhydride to obtain a stable CuFe nitrate with a Fe ion concentration of 0.35mol / L. 2 o 4 Precursor, CuFe 2 o 4 The volume ratio of ethylene glycol methyl ether and acetic anhydride in the precursor solution is 3.5:1;
[0040] Step 2, place the Si substrate in detergent, acetone, and ethanol in sequence for ultrasonic cleaning, rinse the Si substrate with a large amount of distilled water after each ultrasonic cleaning for 10 minutes, and finally dry it with nitrogen. Then put the Si substrate into an oven to bake until dry, take it out and let it stand at room temperature. Then place the clean Si substrate in an ultraviolet light irradiator for 40 minutes to make the surface of the Si substrate reach "atomic cleanliness". Spin-coating CuFe on Si substrate by spin-coating method 2 o 4 Precursor for preparing CuFe 2 o ...
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