Electro-conductive paste comprising silver particles with silver oxide and organic additive
A technology of organic additives, silver particles, applied in conductive materials, circuits, electrical components, etc. dispersed in non-conductive inorganic materials, can solve problems such as reduced efficiency and battery damage
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Embodiment 1
[0214] Example 1 - Preparation of paste for solar cells
[0215] Appropriate amounts of silver particles with AgO content (0.07% by weight O content), lauric acid and stearic acid were mixed in a Kenwood Major Titanium mixer to coat the silver particles with fatty acid. Grind an appropriate amount of organic vehicle (Table 1), to a d of 2 µm 50 The glass frit, zinc oxide (Sigma Aldrich GmbH, product number 204951) and ethyl cellulose (DOWEthocel4, 48.7% hydroxyethoxylated) were added to the mixer and mixed. The paste was passed through a 3-roll mill Exact 80E with stainless steel rollers several times until homogeneous, with a first gap of 120 μm and a second gap of 60 μm, with the gap gradually reduced to a first gap of 20 μm and a second gap of 10 μm. Viscosity was measured as described above and an appropriate amount of organic vehicle having the composition given in Table 1 was added to adjust the paste viscosity to a target of about 16 to about 20 Pas. The weight % of t...
Embodiment 2
[0220] Example 2 - Solar Cell Preparation and Efficiency, Fill Factor, Open Circuit Voltage, Contact Resistance and Series Resistance Measurements
[0221] The paste was applied on a single-crystal Cz-n-type silicon wafer with a boron-doped front side and a phosphorus-doped back side. Wafer has 156×156mm 2 size and pseudo-square shape. The wafer has SiN with a thickness of about 75 nm on both sides x Anti-reflection / passivation layer. The solar cells used were structured by alkaline etching. The example pastes were screen printed on the p-doped side of the wafer using a semi-automatic screen printer X1SL from AsysGroup, EKRA Automatisierungssysteme with the following screen parameters: 290 mesh, 20 μm wire thickness, 18 μm screen Emulsion, 72 gridlines, 60μm gridline opening, 3 busbars, 1.5mm busbar width. A commercially available Ag paste SOL9600A, available from Heraeus Precious Metals GmbH & Co. KG, was printed on the back n-doped side of the device using the same prin...
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Abstract
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