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A kind of fluid type chip level underfill glue and preparation method thereof

An underfill and chip-level technology, applied in the direction of adhesives, adhesive types, epoxy resin glue, etc., can solve the problems of poor moisture resistance, poor heat resistance, large internal stress, etc., and achieve low moisture absorption, bending mold The effect of high volume and fast flow speed

Active Publication Date: 2018-11-06
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, most of the underfills currently have shortcomings such as high brittleness, low reliability, large internal stress, poor heat resistance, and poor moisture resistance, which can only meet the requirements of secondary packaging.

Method used

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  • A kind of fluid type chip level underfill glue and preparation method thereof
  • A kind of fluid type chip level underfill glue and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] A method for preparing a fluid chip-level underfill, the steps are as follows:

[0040] (1) Weigh 80g of bisphenol A epoxy resin E51, 100g of novolac epoxy resin DEN 431 and 5g of carbon black, put them into the reaction kettle and stir at a speed of 1000rpm for 0.5~1h, mix well, grind them and put them into the reaction kettle middle;

[0041] (2) Weigh 20g of liquid carboxyl-terminated nitrile rubber, 10g of fatty alcohol polyoxyethylene ether and 5g of γ-mercaptopropyltrimethoxysilane, put them into the reaction kettle and stir at a speed of 1000rpm for 1-2h, and mix well;

[0042] (3) Weigh 700g of silicon micropowder with an average particle size of 7.5μm, put it into the reaction kettle and stir it at a speed of 1000rpm for 2-4 hours, mix well, put it into the reaction kettle after grinding, and control the temperature at 40-80℃ , let stand for 3~8h;

[0043] (4) Control the temperature at 20-25°C, weigh 80g of methyltetracyanophthalic anhydride, put it into the...

Embodiment 2

[0045] A method for preparing a fluid chip-level underfill, the steps are as follows:

[0046] (1) Weigh 120g of bisphenol F-type epoxy resin EPIKOTE 983U, polycyclic aromatic epoxy resin EPICLONHP4700 100g and carbon black 5g, put them into the reaction kettle and stir at a speed of 1000rpm for 0.5~1h, after mixing evenly, put into In the reactor;

[0047] (2) Weigh 30g of methylphenylethylene silicone rubber, 10g of aliphatic amine polyoxyethylene ether and 5g of β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, put them into the reaction kettle and stir for 1 ~2h, mix well;

[0048] (3) Weigh 630g of silica powder with an average particle size of 1.5μm, put it into the reactor and stir it at a speed of 1000rpm for 2-4 hours, mix well, put it into the reactor after grinding, and control the temperature at 40-80°C , let stand for 3~8h;

[0049] (4) Control the temperature at 20-25°C, weigh 100g of the modified aromatic amine, put it into the reaction kettle to evacuate it, sti...

Embodiment 3

[0051] A method for preparing a fluid chip-level underfill, the steps are as follows:

[0052](1) Weigh 160g of bisphenol A type epoxy resin E44, 100g of polycyclic aromatic epoxy resin EPICLON HP4500 and 5g of carbon black, put them into the reaction kettle and stir at a speed of 1000rpm for 0.5~1h, after mixing evenly, put them in after grinding In the reactor;

[0053] (2) Weigh 20g of dimethylphenylethylene silicone rubber, 5g of aliphatic amine polyoxyethylene ether and 10g of β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and put them into the reaction kettle to Stir at a speed of 1000rpm for 1 to 2 hours, and mix well;

[0054] (3) Weigh 560g of silicon micropowder with an average particle size of 5 μm, put it into the reaction kettle and stir it at a speed of 1000rpm for 2 to 4 hours, mix evenly, put it into the reaction kettle after grinding, and control the temperature at 40 to 80°C. Stand still for 3-8 hours;

[0055] (4) Control the temperature at 20-25°C, weigh ...

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Abstract

A fluid chip-level underfill resin and manufacturing method thereof. The underfill resin comprises the following components in parts by weight: 18-30 parts of an epoxy resin; 1-3 parts of a toughener; 0.1-1 parts of a wetting and dispersing agent; 0.1-1 parts of a coupling agent; 0.1-0.5 parts of a carbon black; 50-70 parts of a filler; and 8-15 parts of a curing agent. The resin features a low coefficient of thermal expansion, high flexural modulus, and low hygroscopicity. Adding the wetting and dispersing agent effectively reduced resin viscosity and improved resin flow rate, ensuring uniform distribution of the filler and a reliability of a packaged component.

Description

technical field [0001] The invention belongs to the technical field of filling glue preparation, in particular to a flow type chip-level bottom filling glue and a preparation method thereof. Background technique [0002] With the rapid development of the electronic packaging industry, more stringent requirements are put forward for electronic packaging materials. Since the coefficient of thermal expansion of the chip made of silicon material is much lower than that of the substrate, in order to protect the chip, solder balls and solder joints and enhance the reliability of the chip, underfill is widely used in electronic packaging materials. The underfill is usually made of epoxy resin system, which has excellent properties such as high toughness, corrosion resistance, high viscosity and good insulation. However, most of the underfills currently have shortcomings such as high brittleness, low reliability, high internal stress, poor heat resistance, and poor moisture resista...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J163/02C09J11/04C09J11/06C09J11/08
CPCC09J163/00
Inventor 闫善涛王建斌陈田安解海华
Owner YANTAI DARBOND TECH
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