Heat conduction insulation coating
A technology of heat conduction insulation and coating, applied in the direction of coating, etc., can solve the problems of poor mechanical properties of coatings, increase costs, and affect the service life of coatings, etc., and achieve the effects of improving electrical properties, increasing sealing, and improving heat resistance
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Embodiment 1
[0018] A thermally conductive insulating coating, the composition of which is as follows in parts by mass: 10 parts of epoxy-modified silicone resin, 2 parts of modified silicon nitride, 3 parts of modified alumina, 20 parts of acetone, 1 part of cobalt naphthenate, mica powder 8 parts, 2 parts of calcium dihydrogen phosphate, 1.8 parts of polyamide epoxy curing agent, 0.8 parts of potassium sodium tartrate, 1.2 parts of leveling agent.
[0019] Among them, the leveling agent is polyether polyester modified organosiloxane
[0020] Wherein, the preparation method of modified silicon nitride is as follows: put γ-glycidyl etheroxypropyl trimethylsilane in a beaker, add distilled water and oxalic acid, adjust the pH value to 3.6-4, stir and dissolve, add acetone and Nano-silicon oxide, stirred at 30°C for 6 hours, and modified silicon nitride was obtained after standing for 6 hours; the ratio of nano-silicon oxide to acetone was 1g of silicon nitride plus 30ml of acetone, γ-glycid...
Embodiment 2
[0022] A thermally conductive insulating coating, the composition of which is as follows in parts by mass: 12 parts of epoxy-modified silicone resin, 3 parts of modified silicon nitride, 3.5 parts of modified alumina, 21 parts of acetone, 1.2 parts of cobalt naphthenate, mica powder 9 parts, 3 parts of calcium dihydrogen phosphate, 2 parts of polyamide epoxy curing agent, 1 part of potassium sodium tartrate, 1.3 parts of leveling agent.
[0023] Among them, the leveling agent is a mixture of polyether polyester modified organosiloxane and alkyl modified organosiloxane, the mass ratio of which is 1:1.1.
[0024] Wherein, the preparation method of modified silicon nitride is as follows: put γ-glycidyl etheroxypropyl trimethylsilane in a beaker, add distilled water and oxalic acid, adjust the pH value to 4-4.2, stir and dissolve, add acetone and Nano-silicon oxide, stirred at 30°C for 6h, and after standing for 6h, modified silicon nitride was obtained. The ratio of nano-silicon ...
Embodiment 3
[0026] A thermally conductive insulating coating, the composition of which is as follows in parts by mass: 15 parts of epoxy-modified silicone resin, 4 parts of modified silicon nitride, 5 parts of modified alumina, 25 parts of acetone, 1.5 parts of cobalt naphthenate, mica powder 10 parts, 5 parts of calcium dihydrogen phosphate, 2.5 parts of polyamide epoxy curing agent, 1.2 parts of potassium sodium tartrate, 1.8 parts of leveling agent.
[0027] Among them, the leveling agent is a mixture of polyether polyester modified organosiloxane and alkyl modified organosiloxane, the mass ratio of which is 1:1.2.
[0028] Wherein, the preparation method of modified silicon nitride is as follows: put γ-glycidyl etheroxypropyl trimethylsilane in a beaker, add distilled water and oxalic acid, adjust the pH value to 4.2-4.5, stir and dissolve, add acetone and Nano-silicon oxide, stirred at 30°C for 6 hours, and after standing for 6 hours, modified silicon nitride was obtained. The ratio ...
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