Halogen-free high temperature resistant resin
A high-temperature-resistant resin and resin technology, applied in the field of resin materials, can solve problems such as corrosion of metal components, achieve the effects of avoiding pollution, improving thermal stability, and low curing shrinkage
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Embodiment 1
[0020] The halogen-free high-temperature-resistant resin of this embodiment is prepared by mixing the following raw materials uniformly at room temperature: 45g of halogen-free flame-retardant resin, 100g of thermosetting epoxy resin, 115g of curing agent, and 1g of accelerator; The glass transition temperature is not less than 180°C; the halogen-free flame-retardant resin is resorcinol tetraphenyl diphosphate, the thermosetting epoxy resin is AFG-90 epoxy resin, and the curing agent is methyl hexahydrophthalic anhydride. The agent is dimethylbenzylamine.
Embodiment 2
[0022] This example is the same as Example 1, except that the halogen-free high temperature resistant resin is phosphorus-containing hydroquinone epoxy resin, bis(3-glycidyl) phenyl phosphate, DOPO type phosphorus-containing resistor Flame-retardant epoxy resin, ODOPB type phosphorus-containing flame-retardant epoxy resin, O, O, O-triglycidyl phenyl silicate, diglycidyloxydimethylsilane, [2-(3,4- Epoxycyclohexyl)ethyl]diphenylsilane, methylphenyl polysiloxane resin, bisphenol A type benzoxazine resin, bisphenol F type benzoxazine resin, MDA type benzoxazine resin , phenolphthalein type benzoxazine resin or dicyclopentadiene type benzoxazine resin, or phosphorus-containing hydroquinone epoxy resin, resorcinol tetraphenyl diphosphate, bis(3-glycidyl) phenyl phosphate ester, DOPO type phosphorus flame retardant epoxy resin, ODOPB type phosphorus flame retardant epoxy resin, O, O, O-triglycidyl phenyl silicate, diglycidyloxy dimethyl Silane, [2-(3,4-epoxycyclohexyl)ethyl]diphenyl...
Embodiment 3
[0024] The halogen-free high-temperature-resistant resin of this embodiment is prepared by mixing the following raw materials uniformly at room temperature: 5 kg of halogen-free flame-retardant resin, 100 kg of thermosetting epoxy resin, 99 kg of curing agent, and 5 kg of accelerator; the halogen-free flame-retardant resin is O, O, O-triglycidyl phenyl silicate, the thermosetting epoxy resin is 30kg TDE-85 epoxy resin and 70kg AG-80 epoxy resin, the curing agent is curing agent DDM, curing agent DDS and curing agent DADMT is a mixed curing agent mixed according to the mass ratio of 20:15:65, and the accelerator is undecyl imidazole.
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Abstract
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