Compound cyanide-free gold plating solution and preparation method thereof

A cyanide-free gold plating and gold salt technology, applied in liquid chemical plating, metal material coating process, coating, etc., can solve the problems of nickel layer corrosion, unstable, poor plating effect, etc. The effect of low efficiency and prolonging the service life

Active Publication Date: 2016-09-14
SHENZHEN RONGWEIYE ELECTRONICS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Yet because the existence of the sulfur in gold sulfite can increase the corrosion of nickel greatly, can cause the problem that coating corrosion depth is too large, so the gold plating solution of gold sulfite in the prior art has the big defect to the corrosion of nickel layer, In addition, the gold plating solution of gold sulfite in the prior art also has problems such as instability, poor plating effect, and low gold salt utilization rate.

Method used

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  • Compound cyanide-free gold plating solution and preparation method thereof
  • Compound cyanide-free gold plating solution and preparation method thereof
  • Compound cyanide-free gold plating solution and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0043]A kind of composite cyanide-free gold plating solution of the present embodiment is made of sodium gold sulfite, ethylene thiourea, sodium sulfamate, ammonium citrate, anhydrous sodium sulfite, hydroxyethylidene diphosphonic acid, sodium ascorbate, phosphoric acid Sodium dihydrogen, disodium hydrogen phosphate and water.

[0044] Wherein, in the compound cyanide-free gold plating solution, the content of sodium gold sulfite is 2.5g / L, the content of ethylenethiourea is 20g / L, the content of sodium sulfamate is 10g / L, ammonium citrate 5g / L, the content of anhydrous sodium sulfite is 2g / L, the content of hydroxyethylidene diphosphonic acid is 8g / L, the content of sodium ascorbate is 10g / L, the content of sodium dihydrogen phosphate is 12g / L, dihydrogen phosphate The content of sodium is 5g / L.

[0045] Wherein, the pH buffering agent sodium dihydrogen phosphate and disodium hydrogen phosphate make the pH value of the compound cyanide-free gold plating solution be controlle...

Embodiment 2

[0051] A kind of composite cyanide-free gold plating solution of the present embodiment is made of sodium gold sulfite, 2-amino-5-mercapto-1,3,4 thiazole, tetraethylene pentamine, melamine, sodium hypophosphite, amino trisulfite Methylphosphonic acid, diethyltriaminepentaacetic acid, carmine, sodium dihydrogen phosphate, disodium hydrogen phosphate and water.

[0052] Wherein, in the compound cyanide-free gold plating solution, the content of sodium gold sulfite is 2.5g / L, the content of 2-amino-5-mercapto-1,3,4thiazole is 10g / L, tetraethylene penta The content of amine is 8g / L, the content of melamine is 3g / L, the content of sodium hypophosphite is 1.5g / L, the content of aminotrimethylene phosphonic acid is 2g / L, and the content of diethyltriaminepentaacetic acid is 3g / L, the content of carmine is 1g / L, the content of sodium dihydrogen phosphate is 15g / L, and the content of disodium hydrogen phosphate is 5g / L.

[0053] Wherein, the pH buffer agent sodium dihydrogen phosphate...

Embodiment 3

[0059] A kind of composite cyanide-free gold plating solution of the present embodiment is made of sodium gold sulfite, 6-mercaptopurine, thiosemicarbazide, potassium sulfamate, potassium pyrophosphate, sodium hypophosphite, hydroxyethylidene diphosphonic acid, D - Composed of sorbitol, disodium dihydrogen pyrophosphate and water.

[0060] Wherein, in this composite cyanide-free gold plating solution, the content of sodium gold sulfite is 2.5g / L, the content of 6-mercaptopurine is 15g / L, the content of thiosemicarbazide is 10g / L, the content of potassium sulfamate The content is 5g / L, the content of potassium pyrophosphate is 5g / L, the content of sodium hypophosphite is 1.5g / L, the content of hydroxyethylidene diphosphonic acid is 20g / L, and the content of D-sorbitol is 8g / L L, the content of disodium dihydrogen pyrophosphate is 10g / L.

[0061] Wherein, the pH buffer agent disodium dihydrogen pyrophosphate makes the pH value of the compound cyanide-free gold plating solution ...

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Abstract

The invention relates to the technical field of light industry and chemical materials, in particular to a compound cyanide-free gold plating solution and a preparation method thereof. The compound cyanide-free gold plating solution is characterized by being composed of cyanide-free gold salt, soft base type coordination agents, non-soft base type coordination agents, reducing agents, impurity shielding agents, additives, pH buffering agents and water, wherein the content of the cyanide-free gold salt is 0.8-6g/L, the content of the soft base type coordination agents is 8-50g/L, the content of the non-soft base type coordination agents is 3-20g/L, the content of the reducing agents is 1-10g/L, the content of the impurity shielding agents is 5-20g/L, the content of the additives is 1-10g/L and the content of the pH buffering agents is 10-40g/L. The compound cyanide-free gold plating solution is small in corrosion to nickel layers and has the advantages that the stability is good, the plating effect is good and the utilization rate of the gold salt is high. The preparation method has the advantages of being simple and low in production cost.

Description

technical field [0001] The invention relates to the technical field of light industry and chemical materials, in particular to a compound cyanide-free gold plating solution and a preparation method thereof. Background technique [0002] Gold has good physical properties and stable chemical properties, so it is widely used in many industrial fields such as high-end decoration, electronics, instrumentation, and aerospace. The traditional gold plating technology mainly adopts cyanide gold plating. Although the effect of cyanide gold plating is good, the negative impact is also great. It is well known that CN in cyanide - It is highly toxic, not only has hidden dangers to the human body, but also has a great pollution to the environment. In recent years, the country has introduced a series of environmental protection measures, and the application of cyanide-containing gold plating is strictly regulated. The need for technology is becoming more and more urgent. [0003] In ord...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/44
CPCC23C18/44
Inventor 丁启恒吕泽满郝志峰陈世荣余坚
Owner SHENZHEN RONGWEIYE ELECTRONICS
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