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A kind of high thermal conductivity diamond-metal composite material and preparation method thereof

A technology of metal composite materials and composite materials, which is applied in the field of high thermal conductivity diamond-metal composite materials and its preparation, can solve the problem that composite materials cannot be applied well, affect the thermal conductivity of the composite material matrix, and the thermal conductivity of the interface layer is low And other issues

Active Publication Date: 2018-03-06
NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For diamond-aluminum composites, most researchers pay too much attention to the improvement of the thermal conductivity of the composites, ignoring the fact that the easily hydrolyzed Al phase during the preparation of the composites 4 C 3 The formation of composite materials leads to poor interfacial stability of composite materials in humid air, which ultimately leads to the failure of the prepared composite materials to obtain better applications in practice.
For diamond-copper (silver) composite materials with poor bonding strength at the two-phase interface, in the existing preparation process conditions, carbide elements (such as B, W, Cr, Ti, Mo, Si) are often introduced at the interface between the two. etc.) to obtain better bonding ability, but the thermal conductivity of the interface layer is generally low, and improper control of the thickness of the interface layer will affect the thermal conductivity of the composite material matrix to a certain extent, resulting in a decrease in the thermal conductivity of the composite material

Method used

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  • A kind of high thermal conductivity diamond-metal composite material and preparation method thereof
  • A kind of high thermal conductivity diamond-metal composite material and preparation method thereof
  • A kind of high thermal conductivity diamond-metal composite material and preparation method thereof

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preparation example Construction

[0108] The invention provides a kind of preparation method of described composite material, described method comprises the steps:

[0109] a-1) providing a homogeneous mixture A composed of diamond particles, boron raw material and organic solution;

[0110] a-2) under vacuum, heat-treat the mixture A to obtain a diamond composite;

[0111] b-1) providing a mixture B of the diamond composite body and metal raw material obtained in step a-2);

[0112] b-2) hot pressing and sintering the mixture B to obtain the composite material according to claim 1.

[0113] Specifically, based on the total weight of the mixture A, the content of diamond particles is 80-99wt%; and / or

[0114] The content of the boron raw material is 1-15wt%.

[0115] Typically, based on the total weight of the mixture A, the content of diamond particles is 85-99wt%, preferably 85-95wt%.

[0116] Typically, based on the total weight of the mixture A, the content of the boron raw material is 1-12wt%, prefera...

Embodiment 1

[0140] 1.1 Preparation of diamond composite 1

[0141] Diamond particles with an average particle diameter of about 200 μm, a small amount of boron powder and a 5% polyvinyl alcohol aqueous solution are uniformly mixed to form a mixture. Wherein, calculated by the total weight of the mixture, the mass fraction of the B powder is 10%, and the mass fraction of the diamond particles is 85%. Put the mixture into a vacuum carbon tube furnace, and evacuate to a vacuum degree of 10 -2 Pa, raise the temperature to 1300°C at a heating rate of 10°C / min, keep the temperature for 60min, and then cool to room temperature with the furnace. The high-temperature-treated mixture is taken out, passed through 30-mesh, 60-mesh, 80-mesh, 100-mesh, and 150-mesh sieves to remove excess boron powder, and obtain a diamond composite 1 with a boride layer grown on the surface.

[0142] result

[0143] The surface morphology and composition of the diamond composite 1 were tested.

[0144] figure 1 I...

Embodiment 2

[0152] 2.1 Preparation of diamond composite 2

[0153] Diamond particles with an average particle diameter of about 300 μm, a small amount of boron powder and a polyethylene glycol aqueous solution with a concentration of 5% are uniformly mixed to form a mixture. Wherein, according to the total weight of the mixture, the mass fraction of B powder is 10%, and the mass fraction of diamond is 80%. Put the above mixture into a vacuum carbon tube furnace, and evacuate to a vacuum degree of 10 -2 Pa, raise the temperature to 1250°C at a heating rate of 10°C / min, keep the temperature for 60min, and then cool to room temperature with the furnace. Take out the high-temperature-treated mixture, pass through sieves of 30 mesh, 60 mesh, 80 mesh, 100 mesh, and 150 mesh respectively to remove excess boron powder, and obtain a diamond composite 2 with a boride layer grown on the surface.

[0154] 2.2 Preparation of diamond-aluminum composite material 2

[0155] Put the diamond composite 2...

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Abstract

The invention relates to a diamond-metal composite material. Specifically, the composite material includes a metal matrix and a diamond composite body, wherein the diamond composite body includes diamond particles and a surface coating compounded on the surface of the diamond particles. The invention also discloses the preparation method and application of the composite material. The method is simple, effective and feasible, low in cost, and the obtained composite material has excellent performance, and has great market prospects in the field of electronic package heat sinks.

Description

technical field [0001] The invention relates to the field of diamond composite materials, in particular to a high thermal conductivity diamond-metal composite material and a preparation method thereof. Background technique [0002] With the continuous miniaturization of electronic products and the development of high integration and high power, thermal damage during the operation of high-power devices causes devices to fail to work normally, accounting for more than 60% of the loss rate of the entire electronic device. Therefore, heat sink materials with high thermal conductivity and matching the thermal expansion coefficient of electronic devices have received extensive attention. [0003] The third-generation thermal conductivity materials with high thermal conductivity carbon nanotubes and diamond as the reinforcing phase and metals such as Al, Cu, and Ag as the matrix are being continuously developed, but there are still some problems. For diamond-aluminum composites, m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C26/00C22C1/05
Inventor 马洪兵白华江南张军安西村一仁邹煌辉
Owner NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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