Special antistatic heat-conducting binding material for LED (light-emitting diode) lamps and preparation method thereof

A technology for bonding materials and LED lamps, applied in adhesives, wax adhesives, rosin adhesives, etc., can solve the problems of accumulation, affecting LED light efficiency, life and reliability, poor chip heat dissipation, etc., and achieve good heat conduction Performance and antistatic properties, strong bond strength, the effect of meeting application requirements

Inactive Publication Date: 2016-10-26
刘雷
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Poor chip heat dissipation will cause heat accumulation, and organic polymer viscous materials are easy to accumulate charges and generate static electricity. These problems seriously affect the light efficiency, life and reliability of LEDs.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] An antistatic and thermally conductive adhesive material for LED lamps, the main raw materials in parts by weight include: 5-15 parts of phenolic epoxy vinyl ester resin, 5-15 parts of polyethylene terephthalate, 5-15 parts of rosin resin 15 parts, 5-15 parts of acrylic resin, 5-15 parts of antistatic thermal conductivity additive, 5-10 parts of nano-silica powder, 1-3 parts of silane coupling agent, 1-3 parts of tert-butyl hydroquinone 1-3 parts, 1-3 parts of hindered amine light stabilizers; the main raw materials of the antistatic heat-conducting auxiliary agent according to parts by weight include: 25-30 parts of calcium carbonate powder, 10-20 parts of liquid paraffin, 10-20 parts of sulfite part, 5-10 parts of magnesium hydroxide.

[0020] A method for preparing an antistatic and heat-conducting bonding material special for LED lamps, the specific steps are:

[0021] (1) Firstly, vacuum dry the calcium carbonate powder and magnesium hydroxide at 60°C for 24 hours...

Embodiment 2

[0026] An antistatic and thermally conductive bonding material for LED lamps, the main raw materials in parts by weight include: 10 parts of phenolic epoxy vinyl ester resin, 10 parts of polyethylene terephthalate, 10 parts of rosin resin, and 10 parts of acrylic resin 10 parts, 10 parts of antistatic heat conduction additives, 8 parts of nano silicon dioxide powder, 2 parts of silane coupling agent, 2 parts of tert-butyl hydroquinone, 2 parts of hindered amine light stabilizer; Auxiliaries, the main raw materials in parts by weight include: 28 parts of calcium carbonate powder, 15 parts of liquid paraffin, 15 parts of sulfite, and 5 parts of magnesium hydroxide.

[0027] A method for preparing an antistatic and heat-conducting bonding material special for LED lamps, the specific steps are:

[0028] (1) Firstly, vacuum dry the calcium carbonate powder and magnesium hydroxide at 60°C for 24 hours, then disperse the vacuum-dried calcium carbonate powder and magnesium hydroxide i...

Embodiment 3

[0033] An antistatic and thermally conductive bonding material for LED lamps, the main raw materials in parts by weight include: 15 parts of phenolic epoxy vinyl ester resin, 15 parts of polyethylene terephthalate, 15 parts of rosin resin, and 15 parts of acrylic resin 5 parts, 5 parts of antistatic heat conduction additives, 10 parts of nano silicon dioxide powder, 3 parts of silane coupling agent, 3 parts of tert-butyl hydroquinone, 3 parts of hindered amine light stabilizer; The auxiliary agent, the main raw materials in parts by weight include: 30 parts of calcium carbonate powder, 20 parts of liquid paraffin, 20 parts of sulfite, and 10 parts of magnesium hydroxide.

[0034] A method for preparing an antistatic and heat-conducting bonding material special for LED lamps, the specific steps are:

[0035] (1) Firstly, vacuum dry the calcium carbonate powder and magnesium hydroxide at 60°C for 24 hours, then disperse the vacuum-dried calcium carbonate powder and magnesium hyd...

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Abstract

The invention discloses a special antistatic heat-conducting binding material for LED (light-emitting diode) lamps and a preparation method thereof. The special antistatic heat-conducting binding material for LED (light-emitting diode) lamps comprises the following main raw materials in parts by weight: 5-15 parts of phenol formaldehyde epoxy vinyl ester resin, 5-15 parts of polyethylene terephthalate, 5-15 parts of rosin resin, 5-15 parts of acrylic resin, 5-15 parts of antistatic heat-conducting aid, 5-10 parts of nano silicon dioxide powder, 1-3 parts of silane coupling agent, 1-3 parts of tert-butylhydroquinone and 1-3 parts of hindered amine light stabilizer. The antistatic heat-conducting aid comprises the following main raw materials in parts by weight: 25-30 parts of calcium carbonate powder, 10-20 parts of liquid paraffin, 10-20 parts of sulfite and 5-10 parts of magnesium hydroxide. The special antistatic heat-conducting binding material for LED lamps has the advantages of excellent comprehensive properties, favorable processability, high heat conductivity, high antistatic capacity, low cost and the like.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to an antistatic and thermally conductive adhesive material for LED lamps and a preparation method thereof. Background technique [0002] As the fourth-generation lighting source, LED will develop in the field of general lighting in the future. It has become a development goal in the next 10 years to replace traditional lighting sources such as incandescent lamps and fluorescent lamps with solid-state light source LEDs. The problem of anti-static and heat dissipation of high-power LEDs is one of the problems hindering its rapid development. Poor chip heat dissipation will cause heat accumulation, and organic polymer viscous materials can easily accumulate charges and generate static electricity. These problems seriously affect the light efficiency, life and reliability of LEDs. Therefore, how to use new materials to improve the heat dissipation and surface resistance of L...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J191/06C09J163/10C09J167/02C09J193/04C09J133/00C09J11/04C09J11/06
CPCC09J191/06C08K2201/011C08L2201/04C08L2205/035C09J11/04C09J11/06C08L63/10C08L67/02C08L93/04C08L33/00C08K13/06C08K9/04C08K2003/265C08K2003/2224C08K3/36
Inventor 翁志刚孔敏方杰张磊翁志远程颖
Owner 刘雷
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