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High-thixotropy conductive silver paste

A technology of conductive silver paste and thixotropy, which is applied to conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problems of hydrogenated castor oil being easily affected by temperature, poor moisture resistance of polyurea compounds, and low viscosity of polyethylene wax. Achieve the effect of excellent coating performance, good light fastness, and increased viscosity

Active Publication Date: 2016-11-16
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The thixotropy of conductive silver paste has a great influence on the yield of circuit printing, such as viscosity, cohesiveness, adhesion, leveling, film forming, and volatility of solvents, etc. will all affect the printing performance of the circuit, resulting in The phenomenon that the conductive circuit falls off from the substrate makes the conductive circuit scrapped, so the thixotropy of the conductive silver paste needs to be improved
[0004] Although there are many rheological additives that can improve the thixotropic properties of the product at this stage, each rheological additive has some limitations. For example, organic bentonite and fumed silica will affect the gloss of the slurry, and hydrogenated castor oil is susceptible to temperature. Influence, the moisture resistance of polyurea compound is poor, and the viscosity of polyethylene wax is small, so none of the above methods have achieved ideal results

Method used

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Examples

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Effect test

preparation example Construction

[0029] The preparation method of described highly thixotropic conductive silver paste comprises the following steps:

[0030] 1) Mix epoxy resin, curing agent, accelerator, coupling agent, diluent and defoamer, wherein the epoxy resin is 20-30 parts by weight, the curing agent is 3-5 parts by weight, and the accelerator is 0.1 -0.3 parts by weight, 0.3-0.5 parts by weight of coupling agent, 3-4 parts by weight of diluent and 0.02 parts by weight of defoamer;

[0031] 2) Put the mixture obtained in step 1) into a three-roll grinder and grind for three to four passes;

[0032] 3) Add 60-70 parts by weight of metal silver powder and 0.5-1.5 parts by weight of thixotropic additive to the mixture obtained in step 2), and stir evenly with a glass rod;

[0033] 4) Put the mixture obtained in the step 3) into a three-roll mill and grind until the slurry is uniform.

Embodiment 1

[0035] 1) Bisphenol A type epoxy resin, tertiary amine triethanolamine, 2-ethyl-4-methylimidazole, 3-aminopropyltriethoxysilane, dodecyl to tetradecyl glycidyl ether and Tributyl phosphate is mixed, wherein, epoxy resin is 27 parts by weight, curing agent is 4 parts by weight, accelerator is 0.2 parts by weight, coupling agent is 0.4 parts by weight, thinner is 3.3 parts by weight and defoamer is 0.01 -0.03 parts by weight;

[0036] 2) Put the mixture obtained in step 1) into a three-roll grinder and grind for three to four passes;

[0037] 3) adding 64 parts by weight of flaky silver powder and 0.5 parts by weight of amide-modified hydrogenated castor oil to the mixture obtained in step 2), and stirring evenly with a glass rod;

[0038] 4) Put the mixture obtained in the step 3) into a three-roll mill and grind until the slurry is uniform.

Embodiment 2

[0040] 1) Bisphenol A type epoxy resin, tertiary amine triethanolamine, 2-ethyl-4-methylimidazole, 3-aminopropyltriethoxysilane, dodecyl to tetradecyl glycidyl ether and Tributyl phosphate is mixed, wherein, epoxy resin is 27 parts by weight, curing agent is 4 parts by weight, accelerator is 0.2 parts by weight, coupling agent is 0.4 parts by weight, thinner is 3.3 parts by weight and defoamer is 0.01 -0.03 parts by weight;

[0041] 2) Put the mixture obtained in step 1) into a three-roll grinder and grind for three to four passes;

[0042] 3) adding 64 parts by weight of flaky silver powder and 0.8 parts by weight of amide-modified hydrogenated castor oil to the mixture obtained in step 2), and stirring evenly with a glass rod;

[0043] 4) Put the mixture obtained in the step 3) into a three-roll mill and grind until the slurry is uniform.

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Abstract

The invention discloses a high-thixotropy conductive silver paste. The high-thixotropy conductive silver paste is prepared according to the following method. The method comprises the following steps: mixing 20 to 30 percent of matrix resin, 3 to 5 percent of a curing agent, 0.1 to 0.3 percent of an accelerant, 0.3 to 0.5 percent of a coupling agent, 3 to 4 percent of a thinning agent and 0.01 to 0.03 percent of a defoaming agent, adding 60 to 70 percent of metallic silver powder and 0.5 to 1.5 percent of a thixotropic addition agent into the mixture after the mixture is ground, and continuing to grind the mixture until the mixture is uniform after uniform stirring. The silver paste disclosed by the invention is high in thixotropy and levelling property and poor in printability, so that the quality and production efficiency of electronic packaging products can be improved greatly.

Description

technical field [0001] The invention belongs to the field of metal and electronic materials, and relates to a highly thixotropic conductive silver paste and a preparation method thereof. Background technique [0002] Conductive silver paste is a key functional material required by the electronic components, integrated circuits and solar cell industries, with huge market demand and great potential for technological progress. In the existing field of electronic pastes, silver-based pastes have the characteristics of high conductivity, stable performance, and strong bonding strength with substrates, and are widely used in the production of electronic components such as integrated circuits, multi-chip components, and membrane switches. [0003] The thixotropy of conductive silver paste has a great influence on the yield of circuit printing, such as viscosity, cohesiveness, adhesion, leveling, film forming, and volatility of solvents, etc. will all affect the printing performance...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22
CPCH01B1/22
Inventor 周健王大鹏郝建屠富强薛烽白晶
Owner SOUTHEAST UNIV
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