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Method for preparing soldering flux for no-clean solder paste

A flux and no-cleaning technology, applied in the direction of welding equipment, welding medium, manufacturing tools, etc., can solve the problems of poor protection and wetting performance, fried tin residue, strong corrosion, etc., to achieve protection and wetting Good performance, lower surface tension, less corrosive effect

Inactive Publication Date: 2017-01-25
CHANGZHOU YAHUAN ENVIRONMENTAL PROTECTION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention: Aiming at the disadvantages of the current no-cleaning flux, such as low activity, poor protection and wettability, prone to "fried tin", more residues after soldering, and strong corrosiveness, it provides A kind of skimmed milk powder and sucrose as nutrients, inoculated with Lactobacillus bulgaricus, fermented under anaerobic conditions, producing acidic substances, used as active substances of flux, and hydrolyzing protein in milk powder into amino acids, used as corrosion inhibitor of flux , and then mixed with acetic acid-sodium acetate buffer solution to precipitate unhydrolyzed protein, remove it by centrifugation, and then concentrate to obtain an acidic concentrated solution, then use ethylene glycol and ethanol as solvents, and glycerol monostearate as a film-forming agent , tea saponin and sodium dodecylbenzene sulfonate are used as emulsifiers, mixed with acidic concentrated solution to prepare flux for no-clean solder paste, which can effectively improve the activity of solder paste, enhance the protection and wettability of solder paste

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0016] First, weigh 800g of skimmed milk powder and 80g of sucrose successively, pour them into a fermenter filled with 4800mL of deionized water, and then inoculate Lactobacillus bulgaricus into the fermenter according to the inoculum size of 8%, and then inject it into the fermenter at a rate of 3mL / min. Introduce nitrogen into the interior until all the air is replaced. Under the conditions of temperature 35°C and rotation speed 180r / min, ferment at constant temperature and airtight for 36 hours. Under the following conditions, sterilize for 20 minutes to obtain the sterilized fermented product; then measure 200 mL of the sterilized fermented product obtained above, add it to the beaker, and then place the beaker in a magnetic stirrer with a digital speed measurement and constant temperature, adjust the temperature to 40 ° C, and the speed to be 200r / min, under the condition of constant temperature stirring, 200mL of acetic acid-sodium acetate buffer solution with a pH of 4....

example 2

[0019] First, weigh 900g of skimmed milk powder and 90g of sucrose successively, pour them into a fermenter filled with 5400mL of deionized water, and then inoculate Lactobacillus bulgaricus into the fermenter according to the inoculum size of 9%, and then inject it into the fermenter at a rate of 4mL / min. Introduce nitrogen into the interior until all the air is replaced. Under the conditions of temperature 37°C and rotation speed 190r / min, ferment at constant temperature and airtight for 42 hours. Under the following conditions, sterilize for 23 minutes to obtain a sterilized fermented product; then measure 250 mL of the sterilized fermented product obtained above, add it to a beaker, and then place the beaker in a magnetic stirrer with a digital speed measurement and constant temperature, adjust the temperature to 43 ° C, and the speed to be 250r / min, under the condition of constant temperature stirring, 250mL of acetic acid-sodium acetate buffer solution with a pH of 4.7 wa...

example 3

[0022] First, weigh 1000g of skimmed milk powder and 100g of sucrose successively, pour them into a fermenter filled with 6000mL of deionized water, then inoculate Lactobacillus bulgaricus into the fermenter according to the inoculation amount of 10%, and then inoculate Lactobacillus bulgaricus into the fermenter at a rate of 5mL / min. Introduce nitrogen into the interior until all the air is replaced. Under the conditions of temperature 38°C and rotation speed 200r / min, ferment at constant temperature and airtight for 48 hours. Under the same conditions, sterilize for 25 minutes to obtain the sterilized fermented product; then measure 300mL of the sterilized fermented product obtained above, add it to a beaker, and then place the beaker in a magnetic stirrer with a digital speed measurement and constant temperature, adjust the temperature to 45°C, and the speed to be 300r / min, under the condition of constant temperature stirring, 300mL of acetic acid-sodium acetate buffer solut...

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Abstract

The invention discloses a method for preparing soldering flux for no-clean solder paste and belongs to the technical field of soldering flux preparation. According to the method, skim milk powder and sucrose are taken as nutrient substances, lactobacillus bulgaricus is inoculated, fermentation is performed under anaerobic conditions to generate an acidic material, and the acidic material serves as an active material for the soldering flux, protein in milk powder is hydrolyzed to be amino acid to serve as a corrosion inhibition ingredient of the soldering flux; the protein is mixed with an acetic acid-sodium acetate buffer solution, so that un-hydrolyzed protein precipitates and is removed through centrifugal separation, acidic concentrate is obtained through concentration; ethylene glycol and ethanol serve as solvents, glyceryl monostearate serves as a film-forming agent, tea saponin and sodium dodecylbenzene sulfonate serve as emulsifying agents, and ethylene glycol, ethanol, glyceryl monostearate, tea saponin and sodium dodecylbenzene sulfonate are mixed with the acidic concentrate to obtain the soldering flux for the no-clean solder paste. The method has the advantages that the method is simple in preparation steps, the obtained soldering flux is high in activity and good in protectiveness and wettability and has no tin explosion; after the welding, there is no residue, no cleaning is needed, and the corrosivity is small.

Description

technical field [0001] The invention relates to a preparation method of flux for no-cleaning solder paste, and belongs to the technical field of flux preparation. Background technique [0002] With the rapid development of the electronics industry and fierce competition in the market, solder manufacturers hope to produce products with excellent soldering performance and low price. As an auxiliary material of solder paste, flux can not only provide excellent soldering performance, but also directly affect the printing performance and storage life of solder paste. Flux is a chemical substance that can help and promote the soldering process in the soldering process, and at the same time has a protective effect and prevents oxidation reactions. Flux can be divided into solid, liquid and gas. The main functions are "assisting heat conduction", "removing oxides", "reducing the surface tension of the material to be welded", "removing oil stains on the surface of the material to b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363
CPCB23K35/3612B23K35/362
Inventor 高玉梅邹宇帆许洪祥
Owner CHANGZHOU YAHUAN ENVIRONMENTAL PROTECTION TECH
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