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Plastic-based binder for injection molding of copper and copper alloys and method of injection molding for copper and copper alloy parts

An injection molding and copper alloy technology, which is applied in the field of copper and copper alloy parts processing, can solve the problems of long degreasing time, large equipment, and low efficiency, and achieve high product stability, high degreasing efficiency, and small footprint Effect

Inactive Publication Date: 2017-04-05
深圳市卡德姆科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the solvent degreasing process has the following disadvantages: long degreasing time and low efficiency, strict degreasing environment requirements, high storage cost of degreasing solvent, large equipment, difficult disposal of solvent waste after degreasing, and easy deformation of degreasing products, etc., which affect the overall performance of the product

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] The adhesive system of this embodiment is a plastic-based adhesive system, consisting of the following components: polyoxymethylene POM 84%, high-density polyethylene HDPE 6%, ethylene-vinyl acetate copolymer EVA 5.5%, stearic acid SA 4% , Antioxidant 0.5%, the above components are blended, and the components are uniform, to obtain a plastic-based binder; the bronze powder D90 particle size used is 400 mesh, and the powder loading is 63vol%.

[0035] The specific process steps of the present embodiment are as follows:

[0036] Step 1. Put the D90 400-mesh bronze powder and the plastic-based binder into the mixer in turn, and mix at a mixing temperature of 165-175°C for 1-1.5 hours, with a speed of 10-20r / min at the initial stage After the plastic-based binder is melted, the rotation speed is 20-30r / min, and then the mixed powder-plastic combination is granulated in a granulator, so that the feed is further mixed evenly;

[0037] Step 2. Inject the feed material prepare...

Embodiment 2

[0042] The adhesive system of this embodiment is a plastic-based adhesive system, consisting of the following components: polyoxymethylene POM 84%, high-density polyethylene HDPE 6%, ethylene-vinyl acetate copolymer EVA 5.5%, stearic acid SA 4% , Antioxidant 0.5%, the above-mentioned components are blended, and the components are uniform, and the plastic-based adhesive is obtained; the particle size of the brass powder used is 500 mesh, and the powder loading is 56 vol%.

[0043] The specific process steps of the present embodiment are as follows:

[0044] Step 1. Put the brass powder with a particle size of 500 mesh and the plastic-based binder in turn into the mixer, and mix at a mixing temperature of 165-175°C for 1.2-1.8 hours, with a speed of 10-20r / min at the initial stage. After the plastic-based binder is melted, the rotation speed is 30-40r / min, and then the kneaded powder-plastic combination is granulated in a granulator to further mix the feed material evenly;

[004...

Embodiment 3

[0050] The adhesive system of this embodiment is a plastic-based adhesive system, consisting of the following components: polyoxymethylene POM 84%, high-density polyethylene HDPE 6%, ethylene-vinyl acetate copolymer EVA 5.5%, stearic acid SA 4% , Antioxidant 0.5%, the above components are blended, and achieve uniform composition, to obtain a plastic-based adhesive. The used pure copper powder D90 has a particle size of 400 mesh, and the powder loading is 63 vol%.

[0051] The specific process steps of the present embodiment are as follows:

[0052] Step 1. Put the pure copper powder with a D90 particle size of 400 mesh and the plastic-based binder into the mixer in sequence, and mix at a mixing temperature of 165-175°C for 0.8-1.2 hours, and the speed is at the initial stage of 10-20r / min, after the binder is melted, the speed is 25-35r / min, and then the kneaded powder-plastic combination is granulated in a granulator, so that the feed is further mixed evenly;

[0053] Step...

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Abstract

The present invention discloses a plastic-based binder for injection molding of copper and copper alloys. The plastic-based binder is obtained by blending polyoxymethylene (POM), high-density polyethylene (HDPE), ethylene-vinyl acetate copolymer (EVA), stearic acid (SA), and an antioxidant together in a certain ratio. The present invention also discloses a method of injection molding for copper and copper alloy parts using a plastic-based binder, which comprises: preparing of the plastic-based binder, mixing and granulating, injection molding, and debinding using an oxalic acid catalyst, thermal debinding, and sintering. Using the plastic-based binder provided by the present invention for injection molding of copper and copper alloy parts, the debinding efficiency can be improved, while the production cost can be reduced. Therefore, the plastic-based binder is suitable for preparation of high-precision complicated copper and copper alloy parts.

Description

technical field [0001] The invention relates to the technical field of copper and copper alloy parts processing, more specifically, the invention relates to a plastic-based adhesive for injection molding of copper and copper alloys and injection molding with high performance, high dimensional accuracy, and complex structure Method for copper and copper alloy parts. Background technique [0002] Copper is the earliest metal widely used by humans, and it is also one of the most widely used metals at present. Copper alloys are widely used in friction materials, oil bearings, electrical contacts and other conductive materials, mechanical parts, etc. due to their high electrical conductivity, thermal conductivity, and strong corrosion resistance. , electronic communications and other industries play a very important role. [0003] The current method of preparing copper and its alloy parts by injection molding process is mainly based on wax-based binder system. For example: the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F3/22B22F1/00B22F3/10
CPCB22F3/1025B22F3/225B22F1/103B22F1/10
Inventor 侯春树张松曾虹高建芳
Owner 深圳市卡德姆科技有限公司
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