Binder resin for inorganic particle-dispersed pastes and inorganic particle-dispersed paste

Abstract

Provided are a binder resin for inorganic particle-dispersed pastes, said binder resin having both good printing properties and high adhesiveness, and an inorganic particle-dispersed paste. The binder resin for inorganic particle-dispersed pastes is a resin that contains a mixture prepared by mixing X parts by mass of polyvinyl acetal with Y parts by mass of a cellulose derivative in such a manner as to satisfy the requirement 0.2<=X / (X+Y) <=0.8, wherein, when the resin is mixed with spherical nickel particles having an average particle size of 0.3[mu]m, barium titanate particles having an average particle size of 0.05 [mu]m, a nonionic surfactant, dihydroterpineol and a mineral spirit at a preset ratio and kneaded to give a paste and a strain of 0.02 and a strain of 0.2 are applied to the paste at an angular frequency of 6.284 rad / s, the phase difference value delta caused by the strains and the resultant stresses is larger than 45 degrees, and the ratio of the viscosity at a shear rate of 4 (1 / s) of the paste to the viscosity at a shear rate of 40 (1 / s) thereof is not greater than 4.5.

Description

technical field [0001] The present invention relates to a binder resin and an inorganic particle dispersion paste for an inorganic particle dispersion paste, and particularly to a binder resin and an inorganic particle dispersion paste having predetermined rheological properties. Background technique [0002] In multilayer electronic components, such as multilayer ceramic capacitors (MLCC), the increase in capacity and size are rapidly advancing. [0003] In MLCC, ceramic green sheets containing high dielectric materials such as barium titanate and layers formed of conductive paste mainly containing conductive materials, binder resins, and solvents are alternately laminated in multiple layers. After firing, a chip with dielectric layers and electrode layers stacked alternately was obtained. With the increase in the capacity of MLCCs, multilayering and thinning of each layer are required, but various manufacturing problems arise from this. In particular, there is a problem ...

AI Technical Summary

Problems solved by technology

In particular, there is a problem that the film strength of the electrode layer and the adhesion of the electrode layer to the dielectric material sheet are insufficient, so defects are generated, or the electrode layer is peeled off from the interface of the dielectric layer.

In addition, there is also a problem that the dispersibility of the conductive material in the binder resin decreases due to the micronization of the conductive material, so that the formed electrode becomes non-uniform, and the capacity of the obtained MLCC decreases and the electrical short circuit is likely to occur.

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