Halogen-free flame-retardant resin composition as well as bonding sheet and copper clad laminate with same

Abstract

The invention relates to a halogen-free flame-retardant resin composition as well as a bonding sheet and copper clad laminate with same. By the weight parts of organic solids, and the sum of weight parts of (A), (B) and (C) is 100, the halogen-free flame-retardant resin composition comprises the following components: (A) 50-80 parts of benzoxazine resin, (B) 10-40 parts of a polyepoxy compound, (C) 1-15 parts of a phenolic aldehyde curing agent, (D) 0-20 parts of a phosphorus-containing flame retardant, and (E) a curing promoter and (F) packing as well, wherein the benzoxazine resin at least comprises 35-65% by weight of 4,4-bisphenol F benzoxazine resin and 15-35% of phenolic aldehyde benzoxazine resin. The prepreg and the laminate made of the halogen-free flame-retardant resin composition provided by the invention have relatively high glass-transition temperature, good thermal resistance, low water absorption capacity and relatively good resin flowability, and conventional preparation processes of electronic circuit base materials and downstream PCBs (Printed Circuit Boards) can be met.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a halogen-free flame-retardant resin composition, an adhesive sheet and a copper-clad laminate using the composition. Background technique [0002] Traditional copper-clad laminates for printed circuits mainly use brominated epoxy resin, and bromine is used to realize the flame-retardant function of the board. However, in recent years, carcinogens such as dioxin and dibenzofuran have been detected in the combustion products of electronic and electrical equipment wastes containing halogens such as bromine and chlorine, and highly toxic substances may be released during the combustion process of halogen-containing products hydrogen halide. On July 1, 2006, the EU's two environmental protection directives "Regarding Waste Electrical and Electronic Equipment" and "Restricting the Use of Certain Hazardous Substances in Electrical and Electronic Equipment" came into effect. ...

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Problems solved by technology

[0005] However, in the above several schemes, bisphenol F is used as raw material to synthesize dihydrobenzoxazine resin or commercialized bisphenol F benzoxazine resin is used, and bisphenol F type benzoxazine is used in the resin system When the resin content exceeds 50% of the organic solids, the fluidity of the resin system decreases, which seriously affects the substrate and downstream PCB manufacturing process

[0006] CN1484674A discloses to use the mixture of bisphenol F benzoxazine and novolac type benzoxazine (its ratio is 11:89, the peak area ratio that GPC obtains), on the basis of a large amount of experimental data, it is found that when novolac type benzoxazine When the proportion of oxazine resin exceeds 40%, the fluidity of the system is low, and it is difficult to meet the existing process requirements of the electronic circuit substrate or PCB industry, but its excellent comprehensive performance can be used in other industries such as coatings

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