Special heat-resisting and flame-retarding epoxy resin adhesive for stone material
An epoxy resin and adhesive technology, applied in the direction of epoxy resin glue, adhesive type, polymer adhesive additives, etc., can solve the problems of short storage time, easy combustion, poor impact toughness of cured products, etc.
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Embodiment 1
[0015] A special heat-resistant and flame-retardant epoxy resin adhesive for stone proposed by the present invention, its raw materials include: 85 parts of modified epoxy resin, 5 parts of polyamic acid, poly 2,6-dimethyl-1 , 15 parts of 4-phenylene ether, 5 parts of acrylonitrile-styrene-acrylate copolymer, 20 parts of polyethersulfone, 2 parts of hydroxyl-terminated liquid nitrile rubber, 12 parts of dicyandiamide, 3 parts of benzoxazine, linear 10 parts of phenolic resin, 1 part of liquid methyl tetrahydrophthalic anhydride, 5 parts of curing accelerator, 2 parts of nano-aluminum hydroxide, 5 parts of silicon micropowder, 5 parts of ferric oxide, 8 parts of nano-titanium dioxide, and 2 parts of hexagonal boron nitride .
Embodiment 2
[0017] A special heat-resistant and flame-retardant epoxy resin adhesive for stone proposed by the present invention, its raw materials include: 70 parts of modified epoxy resin, 20 parts of polyamic acid, poly 2,6-dimethyl-1 , 3 parts of 4-phenylene ether, 12 parts of acrylonitrile-styrene-acrylate copolymer, 5 parts of polyethersulfone, 10 parts of hydroxyl-terminated liquid nitrile rubber, 2 parts of dicyandiamide, 12 parts of benzoxazine, linear 2 parts of phenolic resin, 5 parts of liquid methyl tetrahydrophthalic anhydride, 1 part of curing accelerator, 10 parts of nano-aluminum hydroxide, 2 parts of silicon micropowder, 15 parts of ferric oxide, 2 parts of nano-titanium dioxide, and 11 parts of hexagonal boron nitride .
Embodiment 3
[0019] A special heat-resistant and flame-retardant epoxy resin adhesive for stone proposed by the present invention, its raw materials include by weight: 82 parts of modified epoxy resin, 8 parts of polyamic acid, poly 2,6-dimethyl-1 , 11 parts of 4-phenylene ether, 7 parts of acrylonitrile-styrene-acrylate copolymer, 16 parts of polyethersulfone, 4.8 parts of hydroxyl-terminated liquid nitrile rubber, 10 parts of dicyandiamide, 6 parts of benzoxazine, linear 7 parts of phenolic resin, 3.2 parts of liquid methyl tetrahydrophthalic anhydride, 4 parts of curing accelerator, 4 parts of nano-aluminum hydroxide, 4.3 parts of silicon micropowder, 7 parts of ferric oxide, 7 parts of nano-titanium dioxide, and 4 parts of hexagonal boron nitride ;
[0020] Wherein, the modified epoxy resin is prepared according to the following process: heat 100 parts of epoxy resin to 55°C in parts by weight, then add 5 parts of tetraethyl orthosilicate and 0.05 part of catalyst, heat to 120°C and th...
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