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A low-viscosity, high-thermal-conductivity epoxy-modified silicone potting compound and its application

A technology of silicone potting and epoxy modification, applied in the direction of adhesives, non-polymer adhesive additives, adhesive additives, etc., can solve the problems of reducing the final viscosity of the system, complex system components, and high production costs. Improve bonding performance, extend operating time, and good fluidity

Active Publication Date: 2020-05-22
HUNAN BOOM NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The technical solution includes olefin-containing polysiloxane, hydrogen-containing polysiloxane, silicon-hydrogen reaction catalyst, reaction inhibitor, beryllium-containing silicon carbide fiber or four-needle zinc oxide whisker, the system composition is complex, and beryllium silicon carbide fiber or Raw materials for four-needle zinc oxide whiskers are difficult to obtain. In addition, the filler needs to be modified with a silane coupling agent to improve the affinity between the filler and the organic phase and reduce the final viscosity of the system. The process is complicated and the production cost is high.

Method used

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  • A low-viscosity, high-thermal-conductivity epoxy-modified silicone potting compound and its application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] Stir and mix 100 parts of epoxy silicone oil (epoxy value 0.05) with a viscosity of 50 mpa s, 400 parts of 50 μm spherical alumina, 150 parts of 10 μm spherical alumina, 70 parts of 2 μm spherical alumina, and 20 parts of 200 nm zinc oxide After uniformity, it was ground by a three-roll machine for 3 times, and then vacuumed and degassed to obtain component A.

[0050] Mix 30 parts of polypropylene glycol diglycidyl ether, 30 parts of methyl hexahydrophthalic anhydride, and 0.2 part of tris-(dimethylaminomethyl)phenol, mix and stir evenly, pass through a 300-mesh filter, seal and pack to form component B.

[0051] Mix components A and B uniformly at room temperature at a mass ratio of 100:10, and then cure in an oven at 125°C / 1h. See Table 1 for specific test data.

Embodiment 2

[0053] Compared with Example 1, the difference is that spherical alumina of 20 μm is used instead of spherical alumina of 50 μm, and other things remain unchanged. The specific test data are shown in Table 1.

Embodiment 3

[0055] Compared with Example 1, the difference is that the epoxy silicone oil (epoxy value 0.05) with a viscosity of 400mpa s is used to replace the epoxy silicone oil (epoxy value 0.05) with a viscosity of 50mpa s, and the others remain unchanged. The specific test data is shown in the table 1.

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Abstract

The invention discloses a low-viscosity and high-thermal conductivity epoxy modified organosilicone pouring sealant. The low-viscosity and high-thermal conductivity epoxy modified organosilicone pouring sealant comprises a component A and a component B, wherein the component A is prepared by mixing 100 parts of epoxy modified polysiloxane, 550-700 parts of an alumina filler and 1-25 parts of a zinc oxide filler, the zinc oxide filler is compounded from a spherical aluminum oxide A with the grain size of 20-50 mum, a spherical aluminum oxide B with the grain size of 5-10 mum, and a spherical aluminum oxide C with the grain size of 1-2 mum; the component B is prepared by mixing a diluent, a curing agent and an accelerant at the weight ratio of (20-35):(25-45):(0.01-0.5). In addition, the invention further discloses the application of the organosilicone pouring sealant, and the component A and the component B are mixed and cured at the weight ratio of 100:(10-20). The viscosity is as low as 2000-6000 mpa.s, the flowability is excellent, the thermal conductivity is 2.0-3.0 W.m<1>.k<1>, the cured material is excellent in mechanical property, and can be widely used in the fields of automobiles, chips, LED packaging and the like having higher requirements on heat conduction property.

Description

technical field [0001] The invention belongs to the technical field of potting materials, and in particular relates to a low-viscosity, high-thermal conductivity epoxy-modified silicone potting glue and its preparation and application. Background technique [0002] The potting adhesives commonly used in the market are mainly epoxy resin and silicone. Epoxy resin is a kind of thermosetting resin, which has the characteristics of low price, excellent adhesion, mechanical properties, electrical insulation, etc., and is widely used in the fields of adhesives, coatings, electrical insulation materials, and composite materials. However, due to the high cross-linking structure of pure epoxy resin, there are disadvantages such as brittleness, fatigue, insufficient heat resistance, poor toughness, and large internal stress, which make it difficult to meet the high-performance requirements of high-power electronic components. Silicone has the advantages of low-temperature flexibility...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/06C09J11/04
CPCC08K3/22C08K7/18C08K13/04C08K2003/2296C08K2201/003C08K2201/014C09J11/04C09J183/06C08L71/00
Inventor 李荣黄小忠
Owner HUNAN BOOM NEW MATERIALS