Surface treatment process for blackened copper foil

A surface treatment and blackening copper technology, which is applied in the surface treatment process of copper foil and the surface treatment process of blackened copper foil, can solve the problems of increased density of copper foil, side erosion, and decrease of denseness of copper foil. Achieve good corrosion resistance and etching performance, simple and easy process, and simplify the production process

Active Publication Date: 2017-05-31
SHANDONG JINBAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The corrosion resistance, oxidation resistance, high temperature diffusion and other properties of the copper foil surface coating for FPC must be in an appropriate range, and cannot be too strong or too weak. The stronger the corrosion resistance of the copper foil surface coating, the less etching will occur when the PCB is etched online. Clean, short circuit will occur when making high-density fine electronic circuits; if the corrosion resistance is too weak, side corrosion will occur, and lines will fall off when making ultra-fine pitch circuits. When the permanent copper-clad laminate is micro-etched, micro-etching will be dirty, which will affect the subsequent film production. If the anti-oxidation property is too weak, copper foil oxidation will occur.
If the surface roughness of copper foil is too small, the density of copper foil will increase, the peel strength of copper foil on FCCL will decrease, and the bending resistance will increase; if the roughness of copper foil is too large, the density of copper foil will decrease, and the density of copper foil on FCCL will decrease. The peel strength increases, the bending resistance decreases, and the back side may be pressed through when pressing a double-sided sheet, causing a short circuit
[0004] my country is the second largest exporter of printed circuit boards after Japan. Due to the large gap in the production technology of domestic high-grade electrolytic copper foil compared with the United States and Japan, the domestic high-grade copper foil mainly relies on imports. , for high-tech and high value-added copper foil for FCCL, among many domestic manufacturers, none of them can produce in batches, and almost all copper foil for FCCL is imported from Japan, South Korea, Taiwan, etc.

Method used

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  • Surface treatment process for blackened copper foil
  • Surface treatment process for blackened copper foil
  • Surface treatment process for blackened copper foil

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] A surface treatment process of blackened copper foil, which uses 12 μm electrolytic copper foil as an electrode, and specifically goes through the following steps:

[0033] 1) Coarsening: Dissolve copper sulfate and nickel sulfate in water, then add sulfuric acid to it, and mix well to form a prepared roughening solution. Place copper foil in the roughening solution for electroplating. The control process parameters are: Cu 2+ 16g / L, Ni 2+ 5g / L,H 2 SO 4 220g / L, temperature 20℃, current density 32A / dm 2 , plating time 15s;

[0034] 2) Blackening: Dissolve the additives potassium tartrate, copper sulfate, and zinc sulfate in water respectively, and dissolve cobalt sulfate in water, and then add all the solutions to the additive solution and mix evenly and keep stirring to adjust the pH value. The control parameters are as follows: Cu 2+ 7g / L, Zn 2+ 4g / L, Co 2+ 20g / L, pH 6.5, potassium tartrate 67g / L, temperature 42℃, current density 5A / dm 2 , plating time 10s;

...

Embodiment 2

[0039] The difference between this example and Example 1 is that 18 μm LP copper foil is used as the electrode, and the process parameters of each step are controlled as follows:

[0040] 1) Coarsening: Cu 2+ 20g / L, Ni 2+ 7g / L,H 2 SO4 150g / L, temperature 34℃, current density 26A / dm 2 , Plating time 8s.

[0041] 2) Blackening: Cu 2+ 10g / L, Zn 2+ 6g / L, Co 2+ 8g / L, Ni 2+ 8g / L, pH 5.0, tartaric acid 5g / L, temperature 38℃, current density 12A / dm 2 , Plating time 8s.

[0042] 3) Anti-oxidation: Cr 6+ 3g / L, Zn 2+ 3.5g / L, K 4 P 2 o 7 120g / L, PH 9.5, temperature 32°C, current density 5A / dm 2 , plating time 2s.

[0043] 4) Silane coupling agent: 3-aminopropyltrimethoxysilane 2g / L, temperature 30°C, treatment time 3s.

[0044] 5) Drying: the temperature is 220°C, and the processing time is 4s.

Embodiment 3

[0046] The difference between this embodiment and embodiment 1 is that the process parameters of each step are controlled as follows:

[0047] 1) Coarse Cu 2+ 26g / L, Ni 2+ 8g / L, H 2 SO 4 120g / L, temperature 36℃, current density 20A / dm 2 , Plating time 5s.

[0048] 2) Blackening: Cu 2+ 20g / L, Zn 2+ 10g / L, Co 2+ 10g / L, Ni 2+ 20g / L, PH 4.2, potassium citrate 10g / L, ammonium citrate 25g / L, temperature 30°C, current density 20A / dm 2 , Plating time 12s.

[0049] 3) Anti-oxidation: Cr 6+ 6g / L, Zn 2+ 5g / L, K 4 P 2 o 7 155g / L, PH 9.2, temperature 29℃, current density 10A / dm 2 , Plating time 1.6s.

[0050] 4) Silane coupling agent: 3-aminopropyltriethoxysilane 3g / L, temperature 26°C, treatment time 4s.

[0051] 5) Drying: the temperature is 100°C, and the processing time is 6s.

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PUM

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Abstract

The invention relates to a surface treatment process for a blackened copper foil. An electrolytic copper foil or rolled copper foil is adopted as an anode, continuous forward operation is performed, a basic process flow is: coursing, blackening, preventing oxidation, adding silane coupling agent and drying. The blackened copper foil prepared by the process has well corrosion resistance and etching resistance, and also has excellent normal temperature and high temperature oxidation resistance. For the copper foil with a roughness Rz being smaller than or equal to 5mu m, the process is very suitable for manufacturing a flexible copper-clad plate and a high frequency circuit board.

Description

technical field [0001] The invention relates to a surface treatment process of copper foil, in particular to a surface treatment process of blackened copper foil, which belongs to the technical field of production process of copper foil. Background technique [0002] Copper foil is one of the main raw materials for PCB production. According to different manufacturing processes, it is mainly divided into electrolytic copper foil and rolled copper foil. Rolled copper foil has great advantages in elongation, bending resistance and other properties. In the past, flexible printed circuit board (FPC) manufacturers mostly used rolled copper foil. In recent years, with the improvement of electrolytic copper foil production technology, some Japanese copper foil manufacturers have developed a variety of high-quality electrolytic copper foils that can meet the requirements of FPC. Due to the advantages of electrolytic copper foil manufacturing technology and price, electrolytic copper...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D7/06C25D3/56C25D5/34
CPCC25D3/56C25D5/34C25D7/0614
Inventor 王学江王维河杨祥魁徐策徐树民刘建广徐好强冯秋兴姜晓亮朱义刚
Owner SHANDONG JINBAO ELECTRONICS
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