No-clean liquid aluminum soldering flux and preparation method thereof

A liquid aluminum and flux technology, applied in welding equipment, welding medium, manufacturing tools, etc., can solve the problems of large welding residual corrosion, insufficient welding activity, aluminum exposed on the tin surface, etc., achieving less residue, good solderability, little splash effect

Inactive Publication Date: 2017-06-09
QINGDAO SENMEIKE CHEM TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The inventor provides a no-cleaning liquid aluminum flux, which solves the problems of less hanging tin, exposed aluminum on the tin surface, insufficient soldering activity, and large soldering residual corrosion.

Method used

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Examples

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preparation example Construction

[0024] The preparation method of described hydroxylamine fluoride, comprises the following steps:

[0025] 1) In terms of weight percentage, take 1-5% of ethylenediamine, 3-30% of ethanolamine, 20-90% of diethanolamine and 5-80% of triethanolamine, and mix them uniformly to obtain a mixture;

[0026] 2) The resulting mixture is neutralized to a pH value of 6.5-8 with hydrofluoric acid;

[0027] 3) Evaporate the above neutralized product at a temperature of 140-160° C. for 3.5-4.5 hours.

[0028] The metal active salt is one or more of tin fluoride, stannous fluoride, stannous fluoroborate, stannous chloride, zinc fluoride, zinc fluoroborate, zinc chloride and bismuth chloride combination.

[0029] The activator is one or a combination of diethylamine hydrochloride, triethylamine hydrochloride, lithium fluoride, sodium fluoride, magnesium fluoride and aluminum fluoride.

[0030] The solvent is one or a combination of water, ethanol, isopropanol, ethylene glycol, and propylen...

Embodiment 1

[0041] The preparation method of hydroxylamine fluoride, it may further comprise the steps:

[0042] 1) According to weight percentage, take ethylenediamine 1%, ethanolamine 30%, diethanolamine 64% and triethanolamine 5%, mix and stir evenly to obtain a mixture;

[0043] 2) the resulting mixture is neutralized to a pH value of 6.5 with hydrofluoric acid;

[0044] 3) Evaporate the neutralized product above for 4.5 hours at a temperature of 140° C. to remove moisture therein and prevent subsequent welding spatter.

Embodiment 2

[0046] The preparation method of hydroxylamine fluoride, it may further comprise the steps:

[0047] 1) Take 5% of ethylenediamine, 3% of ethanolamine, 84% of diethanolamine and 8% of triethanolamine according to weight percentage, mix and stir evenly to obtain a mixture;

[0048] 2) the resulting mixture is neutralized to a pH value of 7 with hydrofluoric acid;

[0049] 3) Evaporate the neutralized product above for 3.5 hours at a temperature of 160° C. to remove moisture therein and prevent subsequent welding spatter.

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PUM

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Abstract

The invention relates to a no-cleaning liquid aluminum flux and a preparation method thereof, comprising the following steps: 1) weighing 60-85% of hydroxylamine fluoride, 5-30% of a metal active salt, 1- 5%, 0.1-5% of the corrosion inhibitor, mix evenly to obtain the active substance, and set aside; 2) According to weight percentage, weigh 15-30% of the above active substance and 70-85% of the solvent, set aside; 3) Mix the above-mentioned weighed solvent and active substance, and keep stirring during the mixing process, then raise the temperature to 50-60°C, stir for 8-12 minutes, put them in a closed plastic container for storage, and obtain the no-cleaning liquid aluminum auxiliary flux. The no-cleaning liquid aluminum flux of the invention has good solderability and high welding efficiency; it has little spatter during welding and almost no spatter, saving solder; there is very little residue after welding, no need to clean solder joints, and it has a long service life.

Description

technical field [0001] The invention relates to a flux, in particular to a no-cleaning liquid aluminum flux for aluminum soft soldering products in the electronic industry field and a preparation method thereof. Background technique [0002] At present, the rapid development of the electronic and electrical industry has put forward higher requirements for the matching soldering materials. At the same time, the importance of human health has been paid more and more attention to. A series of measures are used to improve the earth's environment on which human beings depend. The United Nations Environmental Protection Agency has also proposed a deadline to change substances harmful to the atmospheric environment. However, due to the high reliability requirements of some products in the electronic and electrical industry, the existing fluxes must be cleaned after welding to ensure the performance of the products due to performance reasons. Most of the cleaning agents used now are...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/362
CPCB23K35/362
Inventor 李春梅
Owner QINGDAO SENMEIKE CHEM TECH CO LTD
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