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A kind of diamond substrate and preparation method thereof

A technology for diamond and diamond micropowder is applied in the field of diamond substrate and its preparation, which can solve the problem of high price of single crystal diamond, and achieve the effects of high mechanical strength, increased growth rate, and improved deposition quality.

Active Publication Date: 2020-08-21
湖北碳六科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This is especially true for the growth of single crystal diamond. So far, single crystal diamond has to be used as a substrate to synthesize single crystal diamond, but the price of single crystal diamond is still very expensive

Method used

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  • A kind of diamond substrate and preparation method thereof
  • A kind of diamond substrate and preparation method thereof
  • A kind of diamond substrate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] The invention provides a method for preparing a novel diamond substrate, which specifically includes the following steps:

[0052] 1) First weigh 1.5g of diamond powder with a particle size of 2μm, and then weigh 0.3g of the prepared polyimide solution with a mass fraction of 7.5%, so that the diamond powder accounts for the total amount of diamond powder and polyimide. The percentage of mass is 98.5%, figure 1 ;

[0053]Polyimide solution: Produced by Changzhou Furunte Plastic New Material Co., Ltd. (thermoplastic PAA-1), the solvent is N-methylpyrrolidone (NMP), the solid content is 19%, environmental protection, non-dangerous goods, adhesive high sex.

[0054] 2) Mix the above mixed mixture in a DAC 150.1 FVZ type mixer, the mixing time is 1min, and the mixing speed is 3000r / min;

[0055] 3) Put the above mixed mixture into a size of 30×30mm 2 In the aluminum sheet-tin foil mold, the aluminum sheet and the tin foil mold have been cleaned with alcohol before use....

Embodiment 2

[0062] 1) First weigh 1.5g of diamond powder with a particle size of 20μm, and then weigh 0.3g of the prepared polyimide solution with a mass fraction of 7.5%, so that the diamond powder accounts for the total amount of diamond powder and polyimide. The percentage of mass is 98.5% (this ratio is one of the more ideal ratios obtained through experiments conducted at different mass ratios, and the fluctuation range of this ratio can be considered ideal within the range of 98.5% ± 0.5%) ;

[0063] 2) Put the above mixed mixture into a mixer for mixing, the mixing time is 1min, and the mixing speed is 3000r / min;

[0064] 3) Put the above mixed mixture into a size of 30×30mm 2 In the aluminum sheet-tin foil mold, the aluminum sheet and the tin foil mold have been cleaned with alcohol before use;

[0065] 4) Put the mold containing the mixture into the oven. Since the adhesive used is polyimide adhesive, according to the relevant literature research and the verification process of...

Embodiment 3

[0071] 1) First weigh 1.5g of diamond powder with a particle size of 200μm, and then weigh 0.2g of the prepared polyimide solution with a mass fraction of 7.5%, so that the diamond powder accounts for the total amount of diamond powder and polyimide. The percentage of mass is 99%;

[0072] 2) Put the above mixed mixture into the mixer and mix it for 1min, and the mixing speed is 3000r / min;

[0073] 3) Put the above mixed mixture into a size of 30×30mm 2 In the aluminum sheet-tin foil mold, the aluminum sheet and the tin foil mold have been cleaned with alcohol before use;

[0074] 4) Put the mold containing the mixture into the oven. Since the adhesive used is polyimide adhesive, according to the relevant literature research and the verification process of this experiment, the temperature rise program is set as shown in Table 1;

[0075] 5) Demoulding the solidified diamond and polyimide mixture;

[0076] 6) Grind the above-mentioned mixture after demoulding on SiC sandpape...

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Abstract

The invention relates to the technical field of preparation of diamond substrates and particularly relates to a diamond substrate and a preparation method thereof. The diamond substrate comprises the following components in parts by weight: 95-99.5 parts of polyimide and 0.5-5 parts of diamond micro-powder, wherein the grain diameter of the diamond micro-powder is 0.05-1000 microns; and the concentration of a polyimide solution is 5%-20%. The preparation method comprises the following steps: adding the polyimide solution into the diamond micro-powder and uniformly mixing to obtain a mixture; filling the mixture into a drying oven and heating and condensing; putting the dried and condensed diamond micro-powder on different types of abrasive paper; and cooling to a room temperature to obtain the diamond substrate. The diamond substrate has the beneficial effects that the cost of an original substrate material needing to be used is low, and equipment and a process are simple.

Description

technical field [0001] The invention relates to the technical field of diamond substrate preparation, in particular to a diamond substrate and a preparation method thereof. Background technique [0002] Diamond has excellent physical and chemical properties, the highest hardness among all known substances, the highest thermal conductivity at room temperature, wide band gap (5.5eV), the highest sound propagation velocity, and high semiconductor The doping property and the optical transparency from the far-infrared region to the ultraviolet region make it have broad application prospects in many fields such as machining, microelectronics, and optics. However, the number of natural diamonds is scarce, and the high-temperature and high-pressure synthetic diamonds are not only expensive, but also the particle size of synthetic diamonds is limited, which prevents the excellent performance of diamonds from being fully utilized. In 1982, Matsumto et al. used chemical vapor depositi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C30B29/04C04B35/532C30B28/14
CPCC04B35/532C04B2235/48C04B2235/612C04B2235/6562C04B2235/6567C30B28/14C30B29/04
Inventor 武迪郑大平肖景阳郑灿
Owner 湖北碳六科技有限公司
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