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Polyimide resin, a preparing method thereof and a polyimide composite material

A technology of polyimide resin and polyimide, applied in its preparation method and polyimide composite material, polyimide resin field, can solve the problem of poor processing performance, heat resistance and resistance of polyimide Problems such as poor solvent resistance and low material utilization rate, etc., achieve excellent mechanical properties, excellent performance, and improve processing performance

Active Publication Date: 2017-06-30
吉林省亚安新材料有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The processing performance of polyimide is poor, and it needs to use a special sintering method to prepare the blank, and then make the product through secondary machining, which not only has low material utilization rate but also is expensive
The resin has poor heat resistance and solvent resistance due to the bisphenol A residue
[0005] Therefore, in view of the disadvantages of poor processability in the existing polyimide resins mentioned above, it is urgent to develop a thermoplastic polyimide resin with good processability

Method used

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  • Polyimide resin, a preparing method thereof and a polyimide composite material
  • Polyimide resin, a preparing method thereof and a polyimide composite material
  • Polyimide resin, a preparing method thereof and a polyimide composite material

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preparation example Construction

[0054] The present invention also provides a preparation method of polyimide resin, including the following steps:

[0055] Mixing aromatic dianhydride and aromatic diamine in an organic solvent to perform imidization reaction to obtain polyimide;

[0056] The aromatic dianhydride includes bisphenol A type diether dianhydride;

[0057] The aromatic diamine includes bis(aminophenyl) phenylphosphonate.

[0058] In the present invention, it is preferable to dissolve the aromatic dianhydride and the aromatic diamine in an organic solvent to carry out a polymerization reaction to obtain a polyamic acid solution;

[0059] Then the polyamic acid solution is imidized to obtain polyimide.

[0060] In the present invention, the aromatic dianhydride and aromatic diamine are preferably dissolved in an organic solvent, and the polymerization reaction is carried out by means of mechanical stirring. The temperature of the polymerization reaction is preferably -10°C-50°C, more preferably 0- 45°C, most ...

Embodiment 1

[0075] Add 33.334g (0.1075mol) of 4,4'-diphenyl ether dianhydride and 6.215g of bisphenol A diether dianhydride to a three-necked round bottom flask equipped with mechanical stirring, nitrogen protection, water and reflux device. (0.01194mol), 4,4′-diaminodiphenyl ether 21.626g (0.108mol), phenylphosphonic acid bis(p-aminophenyl) ester 4.082g (0.012mol), isophthalic anhydride 0.163g (0.0011mol) , N,N-dimethylacetamide (DMAc) 880g, reacted at room temperature for 5 hours to obtain a polyamic acid solution.

[0076] 500 g of xylene was added to the obtained polyamic acid solution, refluxed with water at 150° C. for 4 hours, and filtered to obtain polyimide powder. The polyimide powder was washed 3 times with acetone, dried at 110° C. for 10 hours, broken through a 100-mesh sieve, and finally light yellow polyimide molding powder was obtained. It was measured that the lowest melt viscosity of the molding powder at 340°C was 2600 Pa·s, the glass transition temperature was 252°C, and...

Embodiment 2

[0078] Into a three-necked round bottom flask equipped with mechanical stirring, nitrogen protection, water and condensing reflux device was added 17.476g (0.0594mol) of 4,4'-biphthalic anhydride, and 30.917g of bisphenol A diether dianhydride ( 0.0594mol), 4,4'-diaminodiphenyl ether 21.626g (0.108mol), phenylphosphonic acid bis(p-aminophenyl) ester 4.082g (0.012mol), phthalic anhydride 0.355g (0.0024mol), 900 g of N,N-dimethylacetamide (DMAc) was reacted at room temperature for 5 hours to obtain a polyamic acid solution.

[0079] 350 g of xylene was added to the obtained polyamic acid solution, refluxed with water at 155°C for 3 hours, and filtered to obtain polyimide powder. The polyimide powder was washed 3 times with acetone, dried at 110° C. for 10 hours, broken through a 100-mesh sieve, and finally light yellow polyimide molding powder was obtained. The lowest melt viscosity of the molding powder at 349°C was measured to be 2450pa·s, the glass transition temperature was 24...

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Abstract

The invention provides polyimide resin. The polyimide resin is prepared from a mixture comprising an aromatic dianhydride and an aromatic diamine. The aromatic dianhydride includes a bisphenol A diether dianhydride. The aromatic diamine includes bis(aminophenyl) phenylphosphinate. The bisphenol A diether dianhydride and the phosphorus-containing bis(aminophenyl) phenylphosphinate are introduced into a polyimide structure so as to significantly improve processing performance of the polyimide resin. In embodiments, the lowest melt viscosity of the polyimide resin is 50-5000 Pa.s, and the processing temperature range of the polyimide resin is 300-380 DEGC. The resin has excellent mechanical performance, the tensile strength of the resin is greater than 70 MPa, and the bending strength is greater than 100 MPa. A preparing method of the polyimide resin and a polyimide composite material are also provided by the invention.

Description

Technical field [0001] The invention belongs to the technical field of polymer materials, and particularly relates to a polyimide resin, a preparation method thereof, and a polyimide composite material. Background technique [0002] Polyimide resin is an organic polymer material with high heat resistance, high strength, organic solvent resistance and radiation resistance. Since it was developed, it has maintained a leading position in the field of heat-resistant materials. After decades of development, polyimide resin has developed into a wide variety of polymer materials with complete functions. It is widely used in aviation, aerospace, electronics, automobiles, machinery and other fields. [0003] The structure of polyimide resin can be divided into two categories: thermosetting and thermoplastic. The preparation of thermosetting resins has harsh technical conditions, high manufacturing costs, and long molding time, and its application is greatly restricted. Compared with the...

Claims

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Application Information

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IPC IPC(8): C08G73/10C08L79/08C08K3/04C08K7/06C08K7/14
CPCC08G73/1071C08K3/04C08K7/06C08K7/14C08L79/08
Inventor 邱雪鹏矫龙赵勇代学民王汉夫
Owner 吉林省亚安新材料有限公司
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