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Packing contained polyarylether or polyaryl sulfide composite material, sheet and circuit board containing same

A polyaryl sulfide and composite material technology, which is applied in circuit substrate materials, printed circuits, printed circuit components, etc., can solve the problems of small application space, low filler content, and the toughness of polyphenylene ether cannot reflect the circuit substrate.

Active Publication Date: 2017-07-07
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to prevent the polyphenylene ether particles from swelling, this method needs to use a polar solvent, which has a negative impact on the dielectric properties of the circuit substrate.
In addition, this method will also cause the toughness of polyphenylene ether itself to not be reflected in the circuit substrate
[0008] There are few existing technologies that use polyphenylene sulfide as the main body to apply to circuit substrates. It is generally used as a film material. For example, in CN103849147, elastomers and inorganic fillers are added to polyphenylene sulfide to obtain a composite film with good toughness and heat resistance. Thin films with very low filler content and less room for functionalization

Method used

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  • Packing contained polyarylether or polyaryl sulfide composite material, sheet and circuit board containing same
  • Packing contained polyarylether or polyaryl sulfide composite material, sheet and circuit board containing same
  • Packing contained polyarylether or polyaryl sulfide composite material, sheet and circuit board containing same

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0113] Polyaryl sulfide non-woven fabrics were prepared by meltblown method. That is, use a single-screw extruder (caliber 30mm, L / D=24) to melt polyaryl sulfide composite resin (M2588, Toray Corporation) and introduce it into a special mold with a flow adjustment structure and a heating air introduction structure, and then from Spinning nozzles on the mold (with 10 circular molten resin discharge holes (inner diameter 400 μm) and slit-shaped gas discharge holes (width 1 mm), these molten resin discharge holes are arranged in a row with an effective width of 5 cm, the The gas ejection holes can eject heated air in parallel with the arrangement direction, thereby applying tensile stress to the molten resin.) and stretched to form fibers. And the fibers are collected on the surface of the film substrate to form a non-woven fabric to be finished with a width of about 5 cm. Then the non-woven fabric to be finished is passed between a pair of heating rolls consisting of a metal ro...

preparation example 2

[0122] Polyarylether non-woven fabrics were prepared using the meltblown method. Replace the polyaryl sulfide composite resin with polyaryl ether resin (polyaryl ether PPO630, SABIC Chemicals) and polyamide (PA-6, commercially available), the mixing ratio is 50:50, and adjust the parameters, the following polyarylether nonwoven fabrics were prepared.

[0123] Polyaryl ether composite resin fiber non-woven fabric (average fiber diameter 3μm, unit weight 30g / m 2 , a thickness of 100 μm, a porosity of about 70%, and a diameter of pores between fibers of about 18 μm).

Embodiment 1

[0125] Sheet polyaryl sulfide composite fiber non-woven fabric (average fiber diameter 3 μm, unit weight 40 g / m 2 , thickness 100 μm, porosity is about 70%, the pore diameter between fibers is about 15 μm), in spherical silica powder slurry (spherical silica powder particle diameter D90 is 3 μ m, D50 is about 1 μ m, slurry is 70% methyl ethyl ketone Suspension), then pass through a gap of 0.15mm, scrape off the surface slurry, dry off the solvent, then soak again, pass through the gap and dry off the solvent, repeat three times. Dry the non-woven fabric impregnated with the slurry at 155° C. for 5 minutes in a blast oven, beat the dried non-woven fabric to remove the filler on the surface, and obtain a polyaryl sulfide composite material containing filler. Then stack 6 sheets of polyaryl sulfide composite materials containing fillers, and use a 35 μm copper foil coated with a release agent on both sides (the smooth side of the copper foil faces the non-woven fabric) as a relea...

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Abstract

The invention belongs to the technical field of copper-clad plates, and relates to a packing contained polyarylether or polyaryl sulfide composite material, a sheet and a circuit board containing the same. The packing contained polyarylether or polyaryl sulfide composite material includes a three-dimensional net-structure material and packing spread in pores of the three-dimensional net-structure material, and the three-dimensional net-structure material is mainly formed by mutual lapping or adhering of polyaryl ether fibers or / and polyaryl thioether fibers; the polyaryl ether fibers are obtained from copolymers with the structure indicated in the formula (1) as main repetitive units and / or modified products of the copolymers; and the polyaryl thioether fibers are obtained from copolymers with the structure indicated in the formula (2) as main repetitive units and / or modified products of the copolymers. By the arrangement of the packing contained composite material, the sheet and the circuit board which are obtained are isotropic in X and Y directions in dielectric constant, low in the dielectric constant and dielectric loss and good mechanical performance, voltage withstanding performance and processing performance.

Description

technical field [0001] The invention belongs to the technical field of copper clad laminates, and relates to a filler-containing polyaryl ether or polyaryl sulfide composite material, a sheet and a circuit substrate containing the same. Background technique [0002] In recent years, with the development of high-performance, high-functionality and networking of information and communication equipment, in order to transmit and process large-capacity information at high speed, the operating signal tends to be higher in frequency, and the frequency of use of electronic products continues to increase, requiring substrate materials. The dielectric constant is getting lower and lower, the dielectric loss is required to be smaller and smaller, and the uniformity of the substrate dielectric constant is required to be better. [0003] At present, high-frequency and high-speed circuit substrates use low-dielectric constant resins to obtain good high-frequency performance. These low-die...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L81/02C08K3/36C08K7/06C08K3/24B32B27/02B32B37/10B32B37/06B32B15/14H05K1/03
CPCB32B15/14B32B37/06B32B37/10B32B2262/02B32B2262/0223B32B2262/0253B32B2262/0261B32B2262/0276B32B2262/101B32B2262/106C08J5/18C08J2381/02C08K3/24C08K3/36C08K7/06C08L2203/16C08L2203/20H05K1/0373C08L81/02
Inventor 孟运东方克洪许永静
Owner GUANGDONG SHENGYI SCI TECH