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Stereoscopic light-cured rapid-formed high-temperature-resistant photosensitive resin and preparation method thereof

A technology of stereolithography and photosensitive resin, which is applied in the field of high temperature resistant photosensitive resin and its preparation, can solve the problems of poor quality stability, single category, rare resin, etc., and achieve the best market effect, economic value and dimensional stability Good, good surface effect

Inactive Publication Date: 2017-07-14
塑成科技(北京)有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The currently usable resins are far from meeting the demand. Due to technical limitations, the country still relies on a large number of imports. Although domestic enterprises produce, the quality stability is not good, and the single category seriously restricts its application, especially for resins used in special fields. even rarer

Method used

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  • Stereoscopic light-cured rapid-formed high-temperature-resistant photosensitive resin and preparation method thereof
  • Stereoscopic light-cured rapid-formed high-temperature-resistant photosensitive resin and preparation method thereof
  • Stereoscopic light-cured rapid-formed high-temperature-resistant photosensitive resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] A high-temperature-resistant photosensitive resin for stereolithography rapid prototyping and a preparation method thereof. The preparation method is to weigh each component according to the mass ratio and add them to a stirrer respectively, and mix and stir the materials in the stirrer while heating, Keep the temperature of the material at 50° C., mix and stir for 20 minutes, and obtain a high temperature resistant photosensitive resin after mixing evenly.

[0037] The mass ratio of each raw material is: 65g bisphenol F type cyanate ester resin, 45g aromatic urethane acrylate, 30g cyclohexyl methacrylate, benzoin dimethyl ether 1.8g, 0.5g dibutyltin dilaurate, 0.5g Polyoxypropylene polyoxyethylene glyceryl ether, 0.3g silicone modified polysiloxane.

[0038] The prepared high-temperature-resistant photosensitive resin is printed with a test sample by Formlabs' From 2 model to obtain a cured product, and the cured product is subjected to a post-processing process to obt...

Embodiment 2

[0044] A high-temperature-resistant photosensitive resin for stereolithography rapid prototyping and a preparation method thereof. The preparation method is to weigh each component according to the mass ratio and add them to a stirrer respectively, and mix and stir the materials in the stirrer while heating, Keep the temperature of the material at 65° C., mix and stir for 30 minutes, and obtain a high-temperature-resistant photosensitive resin after mixing evenly.

[0045] The mass ratio of each raw material is: 45g dicyclopentadiene cyanate resin, 35g alicyclic urethane acrylate, 20g cyclotrimethylolpropane methylal acrylate, 1.2g benzoin dimethyl ether, 0.5g dilaurel Dibutyltin dibutyltin, 0.3g polyoxypropylene polyoxyethylene glyceryl ether, 0.2g organosilicon-modified polysiloxane.

[0046] The prepared high-temperature-resistant photosensitive resin is printed with a test sample by Formlabs' From 2 model to obtain a cured product, and the cured product is subjected to a p...

Embodiment 3

[0052] A high-temperature-resistant photosensitive resin for stereolithography rapid prototyping and a preparation method thereof. The preparation method is to weigh each component according to the mass ratio and add them to a stirrer respectively, and mix and stir the materials in the stirrer while heating, Keep the temperature of the material at 75° C., mix and stir for 45 minutes, and obtain a high temperature resistant photosensitive resin after mixing evenly.

[0053] The mass ratio of each raw material is: 1000g bisphenol A cyanate resin, 790g polyester acrylate, 500g isobornyl acrylate, 11.3g benzophenone, 15.2g dibutyltin dilaurate, 6.4g polyoxygen Propylene polyoxyethylene glyceryl ether, 5.3g polymethylphenylsiloxane, 20g chromate dye additive, 7.9g amino acid surfactant.

[0054] The prepared high-temperature-resistant photosensitive resin is printed with a test sample by Formlabs' From 2 model to obtain a cured product, and the cured product is subjected to a post-...

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Abstract

The invention relates to stereoscopic light-cured rapid-formed high-temperature-resistant photosensitive resin and a preparation method thereof. The high-temperature-resistant photosensitive resin contains the following components in parts by mass: 10-70 parts of a resin raw material, 10-40 parts of acrylate, 1-5 parts of a free radical initiator, 0.5-5 part of an aid and 5-50 parts of an active diluent, wherein the resin raw material is cyanate ester resin, epoxy resin or bismaleimide. The preparation method comprises the steps of weighing the components in parts by mass, heating, and uniformly stirring and mixing, so as to obtain the high-temperature-resistant photosensitive resin. The heat distortion temperature of a curing product of the high-temperature-resistant photosensitive resin can reach above 200 DEG C at a pressure density of 0.45MPa, and the high-temperature-resistant photosensitive resin has excellent high temperature resistance, can meet performance requirements on manufacturing of multiple products and further has excellent market effects and economic values. The preparation method is simple and efficient, and the obtained resin has a good surface forming effect, good dimensional stability, strong usability and stable quality.

Description

technical field [0001] The invention relates to a resin and a preparation method thereof, in particular to a stereolithography rapid prototyping high temperature resistant photosensitive resin and a preparation method thereof. Background technique [0002] Stereolithography rapid prototyping is a way of additive manufacturing, and it is the earliest practical rapid prototyping technology, using liquid photosensitive resin as raw material. The process is to firstly design a three-dimensional solid model through CAD, use a discrete program to slice the model, and design the scanning path. The generated data will precisely control the movement of the laser scanner and the lifting table; the laser beam is scanned by the numerical control device. A laser with a specific wavelength and intensity is selected to irradiate the surface of the liquid photosensitive resin according to the designed scanning path. After a layer of resin in a specific area of ​​the surface is cured from a ...

Claims

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Application Information

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IPC IPC(8): C08L51/08C08L79/04C08L63/00C08L79/08C08F283/00C08F220/18C08F220/28C08F283/01C08F220/10C08F220/34C08F222/14C08F283/10C08F283/04
CPCC08F283/008C08F283/01C08F283/045C08F283/105C08L51/08C08L63/00C08L2201/08C08L2205/035C08L2205/03C08L2205/025C08L79/04C08F220/28C08L79/085C08F220/282C08F222/102C08F220/34C08F220/18
Inventor 王雁国张洪波赵茜王冬冬陈双双博尔金海伦张凌竹
Owner 塑成科技(北京)有限责任公司
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