Copper conductive slurry and preparation method and application thereof

A technology of conductive paste and paste, which is applied in the direction of conductive materials dispersed in non-conductive inorganic materials, conductive layers on insulating carriers, etc., can solve the problems of poor performance and high cost of electronic pastes, and achieve high conductivity, Ease of sintering and large contact area

Active Publication Date: 2017-07-25
江西安缔诺科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a copper conduct

Method used

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  • Copper conductive slurry and preparation method and application thereof
  • Copper conductive slurry and preparation method and application thereof
  • Copper conductive slurry and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0035] Example 1

[0036] Weigh ethylene glycol ethyl ether, diethylene glycol, 2.5g, 3.5g, 1g of glycerin into the beaker, then weigh 0.85g of PVP, 0.8g of ascorbic acid, and stir with a magnetic stirrer for 60 minutes to obtain a uniform solution. Weigh micron copper powder (The average particle size is 1μm, the polyhedron shape is nearly spherical structure) 35g, gradually added to the above solution and stirred, and finally a copper paste with a certain viscosity is obtained. The obtained copper slurry was mixed and dispersed on a three-roll mill for 10 minutes to obtain a uniform copper slurry.

[0037] The copper paste is printed on ordinary copy paper and PET film (Novele TM On IJ-220), the printed pattern is 1mm wide and 150mm long, baked in an oven at 100°C for 20 minutes, flash sintered using pulsed xenon lamps, pulse width 2ms, three pulses, sintering energy 8J / cm 2 , The test resistance of the paper-based sample is 2.5Ω, the equivalent square resistance is 16.6mΩ / □, ...

Example Embodiment

[0038] Example 2

[0039] Weigh ethylene glycol ether, diethylene glycol, 2.5g, 3.5g, 1g of glycerin into the beaker, then weigh 0.8g PVP, 1.0g ascorbic acid, stir with a magnetic stirrer for 60 minutes to obtain a uniform solution, weigh micron copper powder (Average particle size 1μm, polyhedral shape is nearly spherical structure) 38g, nano copper powder (average particle size 80nm) 2g, after premixing, gradually add to the above solution and stir, and finally obtain a copper slurry with a certain viscosity. The obtained copper slurry was mixed and dispersed on a three-roll mill for 10 minutes to obtain a uniform copper slurry.

[0040] The copper paste is printed on ordinary copy paper and PET film (Novele TM On IJ-220), the printed pattern is 1mm wide and 150mm long, flash sintering with pulsed xenon lamp, pulse width 2ms, three pulses, sintering energy 7.5J / cm 2 , The test resistance of the paper-based sample is 3.2Ω, the equivalent square resistance is 21.3mΩ / □, and the t...

Example Embodiment

[0041] Example 3

[0042] Weigh ethylene glycol ether, diethylene glycol, glycerin 4.5g, 3.5g, 1.5g into the beaker, then weigh 1.2g PVP, 1.0g ascorbic acid, stir with a magnetic stirrer for 60 minutes to obtain a uniform solution, weigh micron copper 32g powder (average particle size 1μm, polyhedral shape nearly spherical structure), 8g nano-copper powder (average particle size 80nm), premixed and gradually added to the above solution and stirred to finally obtain a copper slurry with a certain viscosity. The obtained copper slurry was mixed and dispersed on a three-roll mill for 10 minutes to obtain a uniform copper slurry.

[0043] The copper paste is printed on ordinary copy paper and PET film (Novele TM On IJ-220), the printed pattern is 1mm wide and 150mm long, flash sintering with pulsed xenon lamp, pulse width 2ms, three pulses, sintering energy 6.8J / cm 2 , The test resistance of the paper-based sample is 3.3Ω, the equivalent square resistance is 22.0mΩ / □, and the test r...

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Abstract

The invention provides copper conductive slurry. The copper conductive slurry is prepared from the following raw materials and components in parts by weight: 70wt% to 90wt% of approximately spherical micron copper powder of polyhedron appearance, 0.01wt% to 3wt% of a stabilizer, 0.1wt% to 5wt% of a binder and 9wt% to 30wt% of a solvent. In the invention, the slurry adopts the proximately spherical micron copper powder with high single crystal content, and the copper powder is large in contact area, easy to sinter and high in specific conductance; the used copper powder is 0.5 to 3 microns in particle size, and can meet the using requirement of fine circuits; flash sintering is directly carried out after silk-screen printing, and the copper conductive slurry is simple in technology and is applicable to large-scale production; the stabilizer is added in the system, copper oxide is reduced in the sintering process, the content of the copper oxide in a copper line is reduced, a conductive circuit with low copper oxide content is obtained, and the conductive slurry adopts the aqueous binder, so that the copper conductive slurry has the characteristics of being environmentally-friendly, energy-saving and easy to clean.

Description

technical field [0001] The invention relates to an electronic paste, in particular to a flash lamp sintered electronic paste based on micron copper powder and its preparation method and application. Background technique [0002] The traditional copper plate etching process is complicated to prepare flexible circuits, and at the same time, the processing process pollutes the environment. However, the metal conductive paste is directly printed on the substrate by screen printing technology, and then sintered and solidified by the flash lamp. It has a series of large-area, flexible, easy-to-batch, low-cost, and green environmental protection. advantage. Flash lamp sintering is a new type of printed electronics technology. It uses broad-spectrum, high-energy pulsed light to solidify and sinter nanomaterial paste and obtain the physical properties of printed electronic devices. The principle is mainly the interaction between high-energy photons and nanoparticles , so that the n...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01B5/14
CPCH01B1/22H01B5/14
Inventor 韩瑞侯李明刘锋冯涛
Owner 江西安缔诺科技有限公司
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