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Bifunctional alkenyl phenoxy compound as well as preparation method thereof and modified soluble bismaleimide resin thereby

A technology of bismaleimide resin and bismaleimide, which is applied in the preparation of carbon-based compounds, the preparation of organic compounds, chemical instruments and methods, etc., can solve the problems of low bonding strength and poor dielectric properties problems, to achieve the effect of increasing charge transfer complexation, excellent thermal stability, and highlighting dilution heat resistance

Active Publication Date: 2017-08-29
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] The present invention aims to solve the problems of poor dielectric properties and low bonding strength at high temperature after curing in existing bismaleimide resins, and provides a difunctional alkenyl phenoxy compound and its preparation method and its improved Soluble Bismaleimide Resin

Method used

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  • Bifunctional alkenyl phenoxy compound as well as preparation method thereof and modified soluble bismaleimide resin thereby
  • Bifunctional alkenyl phenoxy compound as well as preparation method thereof and modified soluble bismaleimide resin thereby
  • Bifunctional alkenyl phenoxy compound as well as preparation method thereof and modified soluble bismaleimide resin thereby

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specific Embodiment approach 1

[0029] Specific embodiment 1: The general structural formula of a difunctional alkenylphenoxy compound in this embodiment is:

[0030]

[0031] The R 1 for

[0032] The R 2for -CH=CH-CH 3 or -CH 2 -CH=CH 2 .

[0033] The beneficial effect of this embodiment is: a difunctional alkenylphenoxy compound prepared in this embodiment. First, the polymerization of diallyl bisphenol A and bis-hormone will first undergo ENE addition and "Diels–Alder" reaction. Due to the presence of weak links with poor heat resistance in the structure of diallyl bisphenol A, such as -C(CH 3 ) 2 -, the lower thermal decomposition temperature and glass transition temperature have seriously affected the high-temperature use effect of Shuangma. After the alkenyl phenoxy compound is polymerized with double horses, the molecular chain has a high degree of phenylation and high structural symmetry, and the ether bond (-O-), carbonyl (C=O), fluorine side group in the molecular structure , The i...

specific Embodiment approach 2

[0037] Specific embodiment two: the preparation method of a kind of difunctional alkenyl phenoxy compound described in this embodiment is carried out according to the following steps:

[0038] Mix p-phenylene fluoride and 2-alkenylphenol to obtain a mixture, then add the mixture and catalyst to the solvent and stir for 10h to 20h to obtain a reaction system, raise the temperature of the reaction system to 60°C to 80°C, and Under the condition of ℃~80℃, react for 1h~5h, then raise the temperature of the reaction system to 110℃~170℃, and under the condition of 110℃~170℃, react for 2h~6h, after the reaction, cool down to room temperature, To obtain a crude product, filter the crude product with a 200-800-mesh drying screen, add ethanol to the filtrate for 3h-5h, filter the precipitated solution to obtain a precipitate, and then wash the precipitate with methanol for 3 to 5 hours times, and finally dry to obtain the difunctional alkenyl phenoxy compound;

[0039] The molar ratio ...

specific Embodiment approach 3

[0040] Specific embodiment three: the difference between this embodiment and specific embodiment two is: the described p-phenylene difluoride is

[0041] Others are the same as in the second embodiment.

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Abstract

The invention relates to a bifunctional alkenyl phenoxy compound as well as a preparation method thereof and modified soluble bismaleimide resin thereby. The invention relates to a compound as well as a preparation method thereof and modified soluble bismaleimide resin thereby. The invention solves the problem that existing bismaleimide resin is poor in dielectric property and low in bonding strength if being cured at a high temperature and high damp and hot. The structural formula is as shown in the description. The preparation method comprises the following steps of: adding p-difluorobenzene, 2-alkenyl phenol and a catalyst into a solvent; raising the temperature to react; and after reaction, performing temperature reduction, filtration, precipitation, filtration, methanol washing and drying. The soluble bismaleimide resin modified by the bifunctional alkenyl phenoxy compound is prepared from bismaleimide, the bifunctional alkenyl phenoxy compound and inorganic filler.

Description

technical field [0001] The invention relates to a compound, a preparation method thereof and a modified bismaleimide resin using the same. Background technique [0002] Thermosetting resins are widely used in aerospace, electronics and other fields. Bismaleimide (BMI) is a typical representative of high-performance thermosetting resins. As a matrix resin, it can meet the requirements of high-speed and high-frequency printed circuit board substrates. . Bismaleimide resin has a higher Tg after curing, and has the advantages of good mechanical properties, heat resistance, heat and humidity resistance, and solvent resistance. Therefore, bismaleimide is a resin for printed wiring boards that is used at a temperature higher than that of epoxy resins. However, after curing itself, the material is brittle and poor in manufacturability, so it must be modified. However, bismaleimide is commonly polymerized with diallyl bisphenol A and N,N'-4,4'-diphenylmethane bismaleimide. Howeve...

Claims

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Application Information

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IPC IPC(8): C07C41/01C07C43/29C07C43/285C07C45/64C07C49/84C08G73/12H01L23/29
CPCH01L23/295C07C41/01C07C43/285C07C43/29C07C45/64C07C49/84C08G73/124
Inventor 刘长威肖万宝曲春艳王德志杨海东宿凯李洪峰张杨冯浩关悦瑜王海民
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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