No-clean lead-free solder scaling powder and preparation method thereof

A lead-free solder and flux technology, applied in the direction of welding equipment, welding/cutting medium/material, welding medium, etc. Solve problems such as poor wettability, achieve less post-soldering residue, less residue on the board surface, and improve solderability

Inactive Publication Date: 2017-09-22
合肥市闵葵电力工程有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The most obvious performance difference between lead-free solder and lead-containing solder is that lead-free solder itself has poor wetting ability, and the soldering temperature used is high.
Therefore, fluxes suitable for lead-containing solders are not suit

Method used

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  • No-clean lead-free solder scaling powder and preparation method thereof

Examples

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Comparison scheme
Effect test

Embodiment １

[0022] A no-cleaning lead-free soldering flux, which includes the following raw materials in parts by weight: 20 parts of the super-grade rosin resin, 5 parts of organic acid activators, 2.5 parts of nonionic surfactants, 1 part of antioxidant, wetting 0.8 parts of strengthening agent, 1 part of corrosion inhibitor, 80 parts of organic solvent.

[0023] Wherein, the super-grade rosin resin is one or a mixture of polymerized rosin, hydrogenated rosin, disproportionated rosin, polyacid-modified rosin, acrylic acid-modified rosin and modified water-soluble rosin.

[0024] Wherein, the organic acid active agent is one or a mixture of two or more of succinic acid, glutaric acid, itaconic acid, o-hydroxybenzoic acid, sebacic acid, pimelic acid, malic acid and succinic acid.

[0025] Wherein, the nonionic surfactant is octylphenol polyoxyethylene ether, fatty alcohol polyoxyethylene ether, isooctylphenol polyoxyethylene ether, nonionic fluorosurfactant, perfluorooctylamide quaternary...

Embodiment 2

[0034] A no-cleaning lead-free soldering flux, which comprises the following raw materials in parts by weight: 10-30 parts of super-grade rosin resin, 2 parts of organic acid active agent, 0.5 part of nonionic surfactant, 0.1 part of antioxidant, wetting 0.1 part of strengthening agent, 0.05 part of corrosion inhibitor, 75 parts of organic solvent.

[0035] Wherein, the super-grade rosin resin is one or a mixture of polymerized rosin, hydrogenated rosin, disproportionated rosin, polyacid-modified rosin, acrylic acid-modified rosin and modified water-soluble rosin.

[0036] Wherein, the organic acid active agent is one or a mixture of two or more of succinic acid, glutaric acid, itaconic acid, o-hydroxybenzoic acid, sebacic acid, pimelic acid, malic acid and succinic acid.

[0037]Wherein, the nonionic surfactant is octylphenol polyoxyethylene ether, fatty alcohol polyoxyethylene ether, isooctylphenol polyoxyethylene ether, nonionic fluorosurfactant, perfluorooctylamide quatern...

Embodiment 3

[0046] A no-cleaning lead-free solder flux, which comprises the following raw materials in parts by weight: 30 parts of super-grade rosin resin, 8 parts of organic acid active agent, 5 parts of nonionic surfactant, 2 parts of antioxidant, and wetting enhancer 1.5 parts, 0.5 parts of corrosion inhibitor, 85 parts of organic solvent.

[0047] Wherein, the super-grade rosin resin is one or a mixture of polymerized rosin, hydrogenated rosin, disproportionated rosin, polyacid-modified rosin, acrylic acid-modified rosin and modified water-soluble rosin.

[0048] Wherein, the organic acid active agent is one or a mixture of two or more of succinic acid, glutaric acid, itaconic acid, o-hydroxybenzoic acid, sebacic acid, pimelic acid, malic acid and succinic acid.

[0049] Wherein, the nonionic surfactant is octylphenol polyoxyethylene ether, fatty alcohol polyoxyethylene ether, isooctylphenol polyoxyethylene ether, nonionic fluorosurfactant, perfluorooctylamide quaternary ammonium sal...

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Abstract

The invention discloses no-clean lead-free solder scaling powder. The scaling powder comprises the following raw materials in parts by weight: 10-30 parts of special-grade rosin resin, 2-8 parts of an organic acid activating agent, 0.5-5 parts of a nonionic surfactant, 0.1-2 parts of an antioxidant, 0.1-1.5 parts of a wetting enhancer, 0.05-0.5 part of a corrosion inhibitor and 75-85 parts of an organic solvent. A preparation method comprises the following steps: weighing the various raw materials in parts by weight, placing the raw materials in a stirrer, and blending the raw materials to obtain a mixture; and heating and stirring the mixture, and leaving the mixture standstill for 3-5 hours after the temperature of the mixture reaches the room temperature to obtain the no-clean lead-free solder scaling powder. The no-clean lead-free solder scaling powder has high wetting ability to lead-free solder; the weldability of the lead-free solder can be improved; the no-clean lead-free solder scaling powder can adapt to welding temperatures of various lead-free solders and does not corrode lead-free solder alloy; and after welding, the number of residues is small, the insulation resistance is high, the lead-free solder does not need to be cleaned, and therefore, the no-clean lead-free solder scaling powder is perfect for the lead-free solder.

Description

technical field [0001] The invention relates to the technical field of lead-free solder, in particular to a no-cleaning lead-free solder flux and a preparation method thereof. Background technique [0002] Various electronic products that are closely related to human life and work benefit human beings, but also increasingly endanger human health and the ecological environment due to the use of lead-containing solder in electronic products. Waste of Electrical and Electronic Equipment (WEEE), led by the European Union, called for an end to the use of lead-containing materials in the electronics assembly industry in 2006. The National Electronics Manufacturing Institute (NEMI) of the United States has implemented a special project called "NEMI's Soldering Lead-Free Program" to systematically study the use of lead-free assembly in the electronics industry; Japan's major consumer electronics manufacturers have also promised to fully implement it as soon as possible. To realize ...

Claims

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Application Information

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IPC IPC(8): B23K35/36B23K35/362
CPCB23K35/3613B23K35/362
Inventor 何飞
Owner 合肥市闵葵电力工程有限公司
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