Heat-conduction insulation adhesive for high voltage electrical appliances and preparation method thereof

A technology of heat conduction insulation and high-voltage electrical appliances, applied in adhesives, polymer adhesive additives, non-polymer adhesive additives, etc., to achieve good application prospects, low material cost, and easy availability of raw materials

Inactive Publication Date: 2017-10-03
HEFEI SHANGQIANG ELECTRIC TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The performance indicators of the existing phenolic adhesives still cannot meet the above requirements, and there are still problems in the bonding strength, toughness and aging resistance for the bonding between different metals and between metals and plastics.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] A heat-conducting and insulating adhesive for high-voltage electrical appliances of this embodiment includes the following raw materials in parts by weight:

[0033] 40 parts of phenolic resin, 60 parts of epoxy resin, 10 parts of silicon dioxide, 35 parts of mica powder, 15 parts of nitrile latex, 2 parts of zinc naphthenate, 2 parts of polyamide resin, 8 parts of curing agent, 3 parts of accelerator , 9 parts of diluent, 4 parts of coupling agent and 10 parts of insulating heat conducting agent.

[0034] In this embodiment, the epoxy resin is bisphenol A type epoxy resin.

[0035] In this embodiment, the curing agent is an amine curing agent; the accelerator is ethanolamine.

[0036] In this embodiment, the diluent is an inactive diluent acetone; the coupling agent is a silane coupling agent.

[0037] In this embodiment, the insulating and heat-conducting agent is silicon carbide.

[0038] A preparation method of a thermally conductive and insulating adhesive for h...

Embodiment 2

[0043] A heat-conducting and insulating adhesive for high-voltage electrical appliances of this embodiment includes the following raw materials in parts by weight:

[0044] 50 parts of phenolic resin, 70 parts of epoxy resin, 20 parts of silicon dioxide, 45 parts of mica powder, 25 parts of nitrile latex, 4 parts of zinc naphthenate, 4 parts of polyamide resin, 16 parts of curing agent, 5 parts of accelerator , 15 parts of diluent, 8 parts of coupling agent and 20 parts of insulating heat conducting agent.

[0045] In this embodiment, the epoxy resin is bisphenol F epoxy resin.

[0046] In this embodiment, the curing agent is an acid anhydride curing agent; the accelerator is accelerator PX.

[0047] In this embodiment, the diluent is an inactive diluent acetone; the coupling agent is a silane coupling agent.

[0048] In this embodiment, the insulating heat conducting agent is boron nitride.

[0049] A preparation method of a thermally conductive and insulating adhesive for...

Embodiment 3

[0054] A heat-conducting and insulating adhesive for high-voltage electrical appliances of this embodiment includes the following raw materials in parts by weight:

[0055] 45 parts of phenolic resin, 65 parts of epoxy resin, 15 parts of silicon dioxide, 40 parts of mica powder, 20 parts of nitrile latex, 3 parts of zinc naphthenate, 3 parts of polyamide resin, 12 parts of curing agent, 4 parts of accelerator , 12 parts of diluent, 6 parts of coupling agent and 15 parts of insulating heat conducting agent.

[0056] Multifunctional epoxy resin in this embodiment.

[0057] In this embodiment, the curing agent is an amine curing agent; the accelerator is ethanolamine.

[0058] In this embodiment, the diluent is an inactive diluent acetone; the coupling agent is a silane coupling agent.

[0059] In this embodiment, the insulating heat conducting agent includes silicon nitride.

[0060] A preparation method of a thermally conductive and insulating adhesive for high-voltage elect...

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PUM

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Abstract

The invention discloses a heat-conduction insulation adhesive for high voltage electrical appliances. The heat-conduction insulation adhesive comprises, by weight, 40 to 50 parts of phenolic resin, 60 to 70 parts of epoxy resin, 10 to 20 parts of silicon dioxide, 35 to 45 parts of mica powder, 15 to 25 parts of butyronitrile latex, 2 to 4 parts of zinc naphthenate, 2 to 4 parts of polyamide resin, 8 to 16 parts of a curing agent, 3 to 5 parts of an accelerator, 9 to 15 parts of a diluent, 4 to 8 parts of a coupling agent and 10 to 20 parts of an insulating heat transfer agent. The heat-conduction insulation adhesive for high voltage electrical appliances has the advantages of good adhesive properties, high thermal conductivity coefficient, corrosion resistance, high temperature resistance, insulating properties and anti-aging performances, and is particularly suitable for bonding between high-voltage electrical devices. The preparation method realizes a lower cost, utilizes easily available raw materials, has simple processes and has a great practical value and good application prospect.

Description

technical field [0001] The invention relates to the technical field of electrical insulating materials, in particular to a heat-conducting insulating adhesive for high-voltage electrical appliances and a preparation method thereof. Background technique [0002] The main application fields of insulating adhesives are: adhesives for the main insulating mica tape of motors; adhesives for other insulating gluing composite materials, bonding and potting of motors and electrical equipment. With the development of electrical appliances towards high voltage level, high power, large capacity and high performance, insulating adhesives have the following development directions: 1. High heat resistance level and high thermal conductivity; 2. High electrical performance; 3. High mechanical Strength; 4. Low dielectric loss. The emergence of adhesives based on epoxy resin, silicone resin, modified phenolic resin, polyester resin, polyurethane resin and polysulfide rubber has successfully ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J161/06C09J109/04C09J177/00C09J11/04C09J11/06C09J11/08
CPCC09J163/00C08K2003/2227C08K2003/282C08K2003/385C08K2201/014C08L2201/08C08L2205/035C09J11/04C09J11/06C09J11/08C08L61/06C08L9/04C08L77/00C08K13/02C08K3/34C08K3/36C08K5/098C08K3/38C08K3/28C08K3/22C08K3/04
Inventor 程劲松
Owner HEFEI SHANGQIANG ELECTRIC TECH CO LTD
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