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Flexible phase-change material for electronic device thermal control

A technology of phase change materials and electronic equipment, applied in heat exchange materials, cooling/ventilation/heating transformation, modification through conduction heat transfer, etc., can solve fracture damage, high surface contact thermal resistance, crystal phase cannot be separated, etc. problem, to increase the use of space and cost, good fit, and improve thermal control performance

Active Publication Date: 2017-10-17
UNIV OF SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the existing preparation technology, the polyolefins used are mostly conventional polymers, such as high-density polyethylene, low-density polyethylene, polypropylene, etc., and the fiber orientation degree of such polymers is low (< 95%), and the molecular chain The arrangement is mostly linear, there is no physical cross-linking form, and the crystal phase cannot be separated, so it has no elasticity and high mechanical strength. The composite phase change material prepared by melting and mixing with the phase change material has a large macroscopic hardness. The tensile mechanical properties are poor, and the tensile failure is directly broken without passing through the yield stage.
[0006] It can be seen from the above that for the existing composite PCM, the greater strength and hardness lead to poor ductility and deformation resistance of PCM, and poor processability
It is prone to damage when it is installed with special structural devices, and it is prone to brittle fracture when it is cut, stretched and compressed. It cannot be processed into a film, and it is often processed into a block or strip.
Therefore, the contact with the controlled component is a solid-solid contact, and there is a problem of high surface contact thermal resistance, especially for devices with irregular structures, the contact thermal resistance is a problem that seriously affects the heat dissipation of the device

Method used

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  • Flexible phase-change material for electronic device thermal control

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] To prepare the flexible phase change material of octadecyl, the specific operation steps are as follows:

[0037] In step (1), 150 g of octadecane and 50 g of olefin block copolymer (OBC) are taken; octadecane is used as a phase change matrix with a phase change temperature of 26.2°C and a latent heat of phase change of 201.6 J / g; OBC is used as a support carrier.

[0038] Step (2), put 150g of octadecane in an oil bath kettle and heat it at a constant temperature at 40°C for about 30 minutes until it completely melts;

[0039] Step (3), add 50g of OBC, the temperature is 170°C, and the speed of the stirrer is set to 30r / min, heat for 30min while stirring, stir the two substances evenly until the OBC is completely melted, and a uniformly mixed molten compound is obtained things. At the same time, the cutter for surface treatment of the phase change material and the mold containing the molten compound were respectively placed on a copper plate at 50°C for preheating.

...

Embodiment 2

[0047] The operation steps for preparing the paraffin-based flexible phase change material are as follows:

[0048] Step (1), take 160g of paraffin, 40g of olefin block copolymer (OBC) and 6g of expanded graphite (EG01). Paraffin is the phase change matrix, the phase change temperature is 52.6°C, and the latent heat of phase change is 210J / g; OBC is the support carrier; EG01 is the thermal conductivity enhancer with a particle size of 282um and an expansion of 550 times. The amount of EG01 is 3% of the total mass of paraffin and OBC.

[0049] Step (2), put 160g of paraffin in an oil bath kettle and heat it at a constant temperature at 60°C for about 30 minutes until it completely melts;

[0050] Step (3), add 40g olefin block copolymer (OBC), set the temperature to 170°C, set the speed of the stirrer to 30r / min, heat for 30min while stirring, stir the two substances evenly until the OBC is completely melted, A molten compound of paraffin wax and OBC mixed uniformly is obtain...

Embodiment 3

[0056] The operation steps of preparing polyethylene glycol-based flexible phase-change materials are as follows:

[0057] Step (1), take 140g of polyethylene glycol, 60g of polyurethane and 10g of carbon nanotubes.

[0058] Polyethylene glycol is the phase change matrix with a relative molecular mass of 10,000, a phase transition temperature of 67.18°C, and a latent heat of phase transition of 187.3 J / g; polyurethane is the supporting carrier; the mass ratio of polyethylene glycol and polyurethane is 70:30. Carbon nanotubes are thermal conductivity enhancers, the model of carbon nanotubes is CNTS107, the diameter is greater than 50nm, and the length is 10~20μm.

[0059] Step (2), put 140g of polyethylene glycol in the kettle body, and heat at 70°C for 30 minutes until the polyethylene glycol is completely melted;

[0060] Step (3), add 60g of polyurethane, set the temperature to 190°C, set the speed of the agitator to 35r / min, turn on the vacuum pump to ensure that the vacuu...

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Abstract

The invention relates to a flexible phase-change material for electronic device thermal control. The flexible phase-change material comprises a phase-change substrate and a support carrier. The support carrier is an elastic polymer. The flexible phase-change material is prepared by the following steps: heating the phase-change substrate and the support carrier in the certain temperature, and placing in the environment of which the temperature is higher than the phase-change temperature after completely fusing and mixing, cooling and rolling. The flexible phase-change material can produce the deformation, such as elastic stretching, bending and torsion, while the temperature is higher than the phase transformation point. The flexible phase-change material is adhered to the surface of the heat production part or filled in clearances between a hot plate and a packaging component while used for the electronic device thermal control. The phase-change material has the good flexibility, so the phase-change material has the performance of a thermal interface material, and is capable of reducing the contract thermal resistance. The flexible phase-change material is capable of solving the problems that the installation is difficult and the contract thermal resistance is larger because the common phase-change material is excessive hard in the thermal control process of the electronic device, and greatly improving the thermal control performance.

Description

technical field [0001] The invention relates to the technical field of phase change materials, in particular to a preparation technology of a composite phase change material and a phase change thermal control technology. Background technique [0002] With the development of aerospace and electronic technology, electronic equipment tends to be highly integrated and high-power, and the heat generated by devices has increased sharply, which has brought great challenges to the heat dissipation of electronic equipment, especially the increasingly compact structure of electronic equipment. Space constraints are imposed on conventional cooling means, making cooling of electronic devices more difficult. One way to solve this problem is to use high thermal conductivity interface materials, such as thermal adhesive, thermal paste, phase change thermal adhesive, etc. Most of the chip heat dissipation is mainly transmitted through contact heat conduction. With the continuous improveme...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/06C08L53/00C08K5/01C08L91/06C08K7/24H05K7/20
CPCC08K5/01C08K2201/011C08L71/02C08L91/06C08L2205/03C09K5/06H05K7/20H05K7/2039C08L53/00C08K7/24C08L75/04
Inventor 程文龙李皖皖年永乐
Owner UNIV OF SCI & TECH OF CHINA
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