Cleaning-free lead-based high-temperature soldering paste and preparation method thereof

A high-temperature soldering, no-cleaning technology, used in soldering equipment, soldering media, manufacturing tools, etc., can solve the problems of not fully meeting the quality requirements of high-reliability hybrid integrated circuits, unfavorable solder paste wetting base metal, and difficult to guarantee reliability. , to achieve the effect of low cost, high reliability and reasonable ratio

Active Publication Date: 2017-10-27
BEIJING INST OF NONFERROUS METALS & RARE EARTH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to its low melting point (melting point 179°C / 183°C), it is used to solder devices that work in a long-term high-temperature environment (up to 125°C), and reliability is difficult to guarantee
With the improvement of the quality requirements of components for the new generation of equipment, this kind of solder can no longer fully meet the quality requirements of high-reliability hybrid integrated circuits
At the same time, the decomposition temperature of the activator in the flux is usually 120-140 °C, and it is basically decomposed at 230 °C, and the working life is shortened, which is not conducive to the solder paste wetting the base material, and the coking and carbonization of the flux after welding are serious. It is easy to produce welding holes, and it is very difficult to clean after welding

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Step 1: Raw material weighing and alloy casting

[0036] Weigh 160 grams of Sn, 10 grams of Ag, 75 grams of Sb and 755 grams of Pb respectively; place the weighed Pb, Sn, Sb, and Ag metal raw materials in a graphite crucible, and utilize an intermediate frequency induction furnace for melting. After the metal is melted, Casting to make alloy ingots;

[0037] Step 2: Solder Alloy Powder Preparation

[0038] Using the vacuum atomization method, using argon as the atomizing gas, place the alloy prepared in step 1 at a pressure of 0.2 MPa and a temperature of 320°C to atomize the alloy powder, and pass the alloy powder through Screening to obtain solder alloy powder with a particle size of 20 μm to 25 μm;

[0039] Step 3: Flux Preparation

[0040] By weight percentage, take 5% chlorosalicylic acid, 5% polyethylene glycol 2000, 20% dimethyl alkyl betaine, 5% modified hydrogenated castor oil, 65% polymerized rosin B-140 (40wt%) and the mixed solution of diethylene glycol ...

Embodiment 2

[0044] Step 1: Raw material weighing and alloy casting

[0045] Weigh 80 grams of Sn, 5 grams of Ag, 37.5 grams of Sb and 377.5 grams of Pb respectively; place the weighed Pb, Sn, Sb, and Ag metal raw materials in a graphite crucible, and use an intermediate frequency induction furnace for melting. After the metal is melted, Casting to make alloy ingots;

[0046] Step 2: Solder Alloy Powder Preparation

[0047] Using the vacuum atomization method, using argon as the atomizing gas, place the alloy prepared in step 1 at a pressure of 0.3 MPa and a temperature of 300°C to atomize the alloy powder, and pass the alloy powder through Screening to obtain solder alloy powder with a particle size of 15 μm to 20 μm;

[0048] Step 3: Flux Preparation

[0049] By weight percentage, get 6% chlorosalicylic acid, 8% polyethylene glycol 2000, 25% dimethyl alkyl betaine, 6% modified hydrogenated castor oil, 55% polymerized rosin B-140 (70wt%) and the mixed solution of diethylene glycol mon...

Embodiment 3

[0053] Step 1: Raw material weighing and alloy casting

[0054] Weigh 192 grams of Sn, 12 grams of Ag, 90 grams of Sb and 906 grams of Pb respectively; place the weighed Pb, Sn, Sb, and Ag metal raw materials in a graphite crucible, and utilize an intermediate frequency induction furnace for melting. After the metal is melted, Casting to make alloy ingots;

[0055] Step 2: Solder Alloy Powder Preparation

[0056]Using the vacuum atomization method, using argon as the atomizing gas, place the alloy prepared in step 1 at a pressure of 0.5 MPa and a temperature of 340°C to atomize the alloy powder, and pass the alloy powder through Screening to obtain solder alloy powder with a particle size of 5 μm to 15 μm;

[0057] Step 3: Flux Preparation

[0058] Percentage by weight, respectively get 10% chlorosalicylic acid, 10% polyethylene glycol 2000, 30% dimethyl alkyl betaine, 10% modified hydrogenated castor oil, 40% polymerized rosin B-140 (50wt%) and the mixed solution of dieth...

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Abstract

The invention discloses cleaning-free lead-based high-temperature soldering paste and a preparation method thereof and belongs to the technical field of hybrid integrated circuits. The soldering paste is prepared from, by weight, 85%-90% of brazing filler metal alloy powder and 10%-15% of brazing flux. The brazing filler metal alloy powder is prepared from, by weight, 15.5%-16.5% of Sn, 7.0%-8.0% of Sb, 0.8-1.2% of Ag and the balance Pb. The brazing flux is prepared from, by weight, 5%-10% of activator, 5%-10% of paste forming agent, 20%-30% of wetting agent, 5%-10% of thixotropic agent and 40%-65% of solvent. The cleaning-free lead-based high-temperature soldering paste is prepared through the steps of brazing filler metal alloy smelting, brazing filler metal alloy powder preparation, brazing flux preparation and soldering paste preparation. The soldering paste is high in melting temperature, has good wettability for a metal coating, and is good in brazing manufacturability, long in working life and suitable for soft brazing of electronic device silver cladding, gold cladding and copper.

Description

technical field [0001] The invention belongs to the technical field of hybrid integrated circuits, and in particular relates to a no-cleaning lead-based high-temperature solder paste and a preparation method thereof. Background technique [0002] At present, in hybrid integrated circuits, Sn62Pb36Ag2 / Sn63Pb37 solder is mostly used for device welding. Due to its low melting point (melting point 179°C / 183°C), it is difficult to guarantee reliability when it is used to solder devices that work in a long-term high-temperature environment (up to 125°C). With the improvement of the quality requirements of components for the new generation of equipment, this kind of solder can no longer fully meet the quality requirements of high-reliability hybrid integrated circuits. At the same time, the decomposition temperature of the activator in the flux is usually 120-140 °C, and it is basically decomposed at 230 °C, and the working life is shortened, which is not conducive to the solder p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/362B23K35/40
Inventor 黄晓猛张国清唐超孙瑞涛王峰
Owner BEIJING INST OF NONFERROUS METALS & RARE EARTH
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