Preparation method of polyimide

A technology of polyimide and prepolymer, which is applied in the field of polyimide preparation, can solve the problems of difficult balance between expansion coefficient and mechanical strength, difficult processing and forming, and insufficient film strength, so as to achieve easy long-term storage and improve mechanical strength. performance, the effect of improving transparency
CN107652433BActive Publication Date: 2020-07-07HUBEI DINGLONG CO LTD +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
HUBEI DINGLONG CO LTD
Publication Date
2020-07-07

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Abstract

The invention discloses a preparation method of polyimide. The method comprises the following steps: ensuring that dianhydride and diamine are reacted in an ionic liquid according to a molar ratio of1 to 1, mixing an obtained prepolymer solution with water-soluble acrylic resin and saturated polyester resin solution with the molar ratio of 2 to 1, ensuring that reaction is performed for 1 to 2h at 80 to 120 DEG C, feeding an organic solvent to perform backflow, mixing the obtained premixed solution with methanol or deionized water, precipitating, filtering and drying, and dissolving the obtained prepolymer powder into a polar solvent; curing the prepolymer glue solution on a flat plate, performing curing for 1h at 80 DEG C, performing curing for 2h at 100 DEG C, performing curing for 3h at 150 DEG C, performing curing for 2h at 200 DEG C, performing curing for 1h at 230 DEG C, and cooling the prepolymer glue solution to a room temperature so as to obtain a polyimide film. According tothe method, through the blending and curing of the prepolymer solution, the water-soluble acrylic resin and the saturated polyester resin solution, a polyimide material with good heat resistance andheat stability and small thermal expansion coefficient is obtained.
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Description

technical field

[0001] The invention relates to the technical field of polymer materials. More particularly, the present invention relates to a kind of preparation method of polyimide. Background technique

[0002] Polyimide has excellent mechanical properties, heat resistance, low temperature resistance, flame retardancy, solvent resistance and electrical properties. It can be used as a structural composite material and is widely used in aerospace, aviation, precision machinery, microelectronic devices and Transparent conductive film, TFT substrate and flexible printed circuit substrate, etc.

[0003] Polyimide is usually synthesized in two steps: the first step is the formation of polyamic acid (PAA) by dianhydride and diamine in a polar aprotic reaction solvent; the second step is the thermal imidization of PAA to poly There are mainly the following problems in the preparation process of imide: due to the rigid chain characteristics, polyimide has a high melting tempera...

Claims

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