Pasty thermal-conduction wave-absorbing electromagnetic material and preparation method thereof

An electromagnetic material and a paste-like technology are applied in the field of paste-like heat-conducting and wave-absorbing electromagnetic materials and their preparation, and can solve the problems of inability to achieve good heat dissipation effect, low thermal conductivity and magnetic permeability, poor thermal conductivity and wave-absorbing efficiency, and the like. To achieve the effect of improving the absorbing efficiency, good interface wettability and good absorbing effect

Inactive Publication Date: 2018-02-13
GUANGZHOU GOLDEN SOUTH MAGNETIC MATERIAL +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thermal pad can only solve the problem of heat dissipation, but cannot solve the problem of EMI/RFI interference, and since the thermal pad has already occupied the thickness space, there is no extra thickness space to set the absorbing material
Even if there is space to fit the absorbing material, there will be the following disadvantages: 1) take up the space of the mechanism; 2) the thermal conductivity of the two materials is different, the interface thermal resistance is large, and the good heat dissipation effect cannot be achieved when they are bonded together; 3) the two materials Materials are used together, and the cost increases; 4) Neither heat-conducting sheet nor wave-absorbing sheet can be used in a small space
[0003] At present, researchers have developed composite materials with both heat conduction and wave absorption functions, but all ...

Method used

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  • Pasty thermal-conduction wave-absorbing electromagnetic material and preparation method thereof
  • Pasty thermal-conduction wave-absorbing electromagnetic material and preparation method thereof
  • Pasty thermal-conduction wave-absorbing electromagnetic material and preparation method thereof

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preparation example Construction

[0041] The preparation method of the above-mentioned pasty heat-conducting and wave-absorbing electromagnetic material comprises the following steps:

[0042] 1) Add insulating and heat-conducting particles, electromagnetic absorbers and additives to the solvent, mix well, react at a constant temperature of 70-90°C for 1-10 hours, filter to remove the solvent, wash and dry the filtered solid to obtain heat-conducting wave-absorbing mixed powder body;

[0043] 2) Mix the silicone oil and the heat-conducting and wave-absorbing mixed powder evenly to obtain a paste;

[0044] 3) Grinding and dispersing the paste, performing densification and defoaming, to obtain a defoaming paste;

[0045] 4) Stir the defoaming paste in a vacuum state for 3-8 hours to obtain a paste-like heat-conducting and wave-absorbing electromagnetic material.

[0046] Preferably, the solvent described in step 1) is toluene, xylene, ethanol, isopropanol, pentane, hexane, octane, ether, propylene oxide, methy...

Embodiment 1

[0051] A paste-like heat-conducting and wave-absorbing electromagnetic material, the raw material composition of which is shown in the following table:

[0052] Table 1 The raw material composition list of a kind of pasty heat-conducting wave-absorbing electromagnetic material

[0053]

[0054]

[0055] The preparation method of the above-mentioned pasty heat-conducting and wave-absorbing electromagnetic material comprises the following steps:

[0056] 1) MgO powder, Fe-Si-Al-Ni alloy powder, dispersant, thickener, stabilizer, coupling agent and polymerization inhibitor are added to absolute ethanol (quality is Fe-Si-Al-Ni alloy powder quality 1.2 times of ), mixed evenly, reacted at a constant temperature of 70°C for 10 hours, filtered to remove absolute ethanol, washed and dried the filtered solid to obtain a heat-conducting and wave-absorbing mixed powder;

[0057] 2) Mix the simethicone oil and the heat-conducting and wave-absorbing mixed powder evenly to obtain a p...

Embodiment 2

[0061]A paste-like heat-conducting and wave-absorbing electromagnetic material, the raw material composition of which is shown in the following table:

[0062] Table 2 The raw material composition table of a kind of pasty heat-conducting wave-absorbing electromagnetic material

[0063] raw material

Mass percentage (%)

Simethicone oil (25℃, 5000cps)

28

AlN powder (D 50 : 4μm)

5

Permalloy powder (flaky, D 50 : 40μm)

65

Dispersant

1.5

coupling agent

0.5

[0064] The preparation method of the above-mentioned pasty heat-conducting and wave-absorbing electromagnetic material comprises the following steps:

[0065] 1) Add AlN powder, permalloy powder, dispersant and coupling agent to toluene (1.5 times the mass of permalloy powder), mix well, react at a constant temperature of 80°C for 5h, filter to remove toluene, and filter toluene The solid is washed and dried to obtain a heat-conducting and wave-absorbing mi...

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Abstract

The invention discloses a pasty thermal-conduction wave-absorbing electromagnetic material. The material is prepared from, by mass, 10-30% of silicone oil, 5-20% of insulating heat-conducting particles, 50-70% of electromagnetic absorbent and 1-10% of auxiliary agent; a preparation method of the material is simple and is completed by evenly mixing all the materials according to an order. The pastythermal-conduction wave-absorbing electromagnetic material has the advantages of being good in interfacial wettability, low in interfacial thermal resistance, high in thermal conduction efficiency, quick in heat dissipation, high in magnetic permeability, good in wave absorbing effect, simple in preparation method and low in cost.

Description

technical field [0001] The invention relates to a paste-like heat-conducting and wave-absorbing electromagnetic material and a preparation method thereof. Background technique [0002] With the improvement of the degree of integration, electronic equipment is becoming thinner and thinner, and its functions and performance are becoming more and more powerful, but heat dissipation and electromagnetic interference problems also follow. Heat dissipation problems and electromagnetic interference problems may occur in any part of electronic equipment, which may affect the performance of the equipment in the slightest, and cause the equipment to crash or be damaged in severe cases. Some chips with digital control / power amplification function generate a lot of heat, and usually need to use thermal pads to effectively export or conduct heat to the heat dissipation module to ensure that the chip does not overheat. However, the thermal pad can only solve the problem of heat dissipatio...

Claims

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Application Information

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IPC IPC(8): H05K9/00C09K5/08
Inventor 汪小明李凯徐昊史慧刚刘忠庆张莉斯海文
Owner GUANGZHOU GOLDEN SOUTH MAGNETIC MATERIAL
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