Pasty thermal-conduction wave-absorbing electromagnetic material and preparation method thereof

Abstract

The invention discloses a pasty thermal-conduction wave-absorbing electromagnetic material. The material is prepared from, by mass, 10-30% of silicone oil, 5-20% of insulating heat-conducting particles, 50-70% of electromagnetic absorbent and 1-10% of auxiliary agent; a preparation method of the material is simple and is completed by evenly mixing all the materials according to an order. The pastythermal-conduction wave-absorbing electromagnetic material has the advantages of being good in interfacial wettability, low in interfacial thermal resistance, high in thermal conduction efficiency, quick in heat dissipation, high in magnetic permeability, good in wave absorbing effect, simple in preparation method and low in cost.

Description

technical field [0001] The invention relates to a paste-like heat-conducting and wave-absorbing electromagnetic material and a preparation method thereof. Background technique [0002] With the improvement of the degree of integration, electronic equipment is becoming thinner and thinner, and its functions and performance are becoming more and more powerful, but heat dissipation and electromagnetic interference problems also follow. Heat dissipation problems and electromagnetic interference problems may occur in any part of electronic equipment, which may affect the performance of the equipment in the slightest, and cause the equipment to crash or be damaged in severe cases. Some chips with digital control / power amplification function generate a lot of heat, and usually need to use thermal pads to effectively export or conduct heat to the heat dissipation module to ensure that the chip does not overheat. However, the thermal pad can only solve the problem of heat dissipatio...

AI Technical Summary

Problems solved by technology

However, the thermal pad can only solve the problem of heat dissipation, but cannot solve the problem of EMI / RFI interference, and since the thermal pad has already occupied the thickness space, there is no extra thickness space to set the absorbing material

Even if there is space to fit the absorbing material, there will be the following disadvantages: 1) take up the space of the mechanism; 2) the thermal conductivity of the two materials is different, the interface thermal resistance is large, and the good heat dissipation effect cannot be achieved when they are bonded together; 3) the two materials Materials are used together, and the cost increases; 4) Neither heat-conducting sheet nor wave-absorbing sheet can be used in a small space

[0003] At present, researchers have developed composite materials with both heat conduction and wave absorption functions, but all of them have deficiencies. For example, CN 104559131 A discloses a high heat conduction, wave absorption and heat dissipation composite material, which is a solid sheet structure and cannot It is used in the narrow space of components, and its thermal conductivity and magnetic permeability are low, and its thermal conductivity and wave absorption performance are not good; CN204168707 U discloses a self-adhesive high thermal conductivity wave-absorbing material, which is a solid sheet structure and cannot be used in Components are used in a small space, their thermal conductivity and magnetic permeability are low, their thermal conductivity and wave absorption performance are not good, and their wave-absorbing layer is set on the outer layer, so they cannot directly contact with electronic components, and their efficiency of absorbing electromagnetic interference is poor.

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