Moisture-resistant and heat-resistant high-strength silicone structural adhesive special for photovoltaic assemblies
A photovoltaic module, moisture and heat resistance technology, applied in the direction of adhesives, non-polymer adhesive additives, non-polymer organic compound adhesives, etc. Poor, the rubber pad is easy to age and other problems, to achieve excellent UV resistance, fast curing speed, good performance retention rate
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0028] Preparation of composite coupling agent: 1mol of aminopropyltrimethoxysilane, 1mol of aminopropyltriethoxysilane, 1mol of bis(trimethoxysilylpropyl)amine, 2-(3,4-epoxy ring Hexyl)ethyltrimethoxysilane 2mol, 3-(2,3-epoxypropoxy)propyltrimethoxysilane 4mol, according to the moles of silane coupling agent with amino group and silane coupling agent with epoxy group After mixing evenly at a ratio of 1:2, seal it, heat it in an oven at 70°C for 3 hours, and then cool it to room temperature to prepare a composite coupling agent for future use.
[0029] Preparation of component A: 30 parts by weight of 10,000 cs α, ω-dihydroxy polydimethylsiloxane (107 glue, referred to as hereinafter) , 70 parts by weight of 80,000 cs 107 glue, thixotropic agent alkoxylated 0.5 parts by weight of terminal polyether, 110 parts by weight of nano-calcium carbonate filler processed by fatty acid, 1 part by weight of triallyl isocyanurate, 30 parts by weight of 350cs simethicone plasticizer are add...
Embodiment 2
[0033] Preparation of composite coupling agent: 1 mol of aminopropyltrimethoxysilane, 1mol of aminopropyltriethoxysilane, 1mol of bis(trimethoxysilylpropyl)amine, 1mol of triethoxysilylpropyl Amine 1mol, 3-(2,3-epoxypropoxy)propyltriethoxysilane 4mol, 3-(2,3-epoxypropoxy)propylmethyldimethoxysilane 8mol, according to the amino group The silane coupling agent and the silane coupling agent with epoxy group were mixed evenly in a molar ratio of 1:3, sealed, heated in an oven at 80°C for 2.5 hours, and then cooled to room temperature to prepare a composite coupling agent for use.
[0034] Preparation of component A: 20 parts by weight of 10,000 cs α, ω-dihydroxy polydimethylsiloxane (107 glue, referred to as hereinafter) , 50 parts by weight of 20,000 cs 107 glue, 30 parts by weight of 80,000 cs 107 glue , 2 weight parts of thixotropic agent fumed silicon dioxide, 90 weight parts of nano-calcium carbonate fillers handled by stearic acid, 10 weight parts of methylphenyl silicone re...
Embodiment 3
[0038] Preparation of composite coupling agent: 1mol of aminopropyltrimethoxysilane, 2mol of aminoethylaminopropylpropyltrimethoxysilane, 1.5mol of triethoxysilylethane, bis(trimethoxysilyl Propyl)amine 3mol and 3-(2,3-epoxypropoxy)propylmethyldimethoxysilane 10mol, 3-(2,3-epoxypropoxy)propylmethyldiethoxysilane 5mol, according to the molar ratio of silane coupling agent with amino group and silane coupling agent with epoxy group 1:2, after mixing evenly, airtight, heat in an oven at 90°C for 2h, then cool to room temperature, and prepare a composite coupling agent for later use .
[0039] Preparation of component A: 30 parts by weight of 10,000 cs α, ω-dihydroxy polydimethylsiloxane (107 glue, referred to as hereinafter) , 50 parts by weight of 20,000 cs 107 glue, 20 parts by weight of 80,000 cs 107 glue 1 weight part of thixotropic agent polyether, 100 parts by weight of nano-calcium carbonate filler processed by rosin, 15 parts by weight of methyl MQ silicone resin, 20 par...
PUM
Property | Measurement | Unit |
---|---|---|
particle diameter | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com