Composite modified epoxy resin structural adhesive, composite modifier and preparation method of structural adhesive

A technology of epoxy resin and structural adhesive, applied in the direction of epoxy resin adhesive, adhesive, adhesive type, etc., can solve the problems of harsh reaction conditions, unfavorable mass production, and high cost of modifiers, and achieve easy on-site construction and curing. The effect of shortening time and increasing reactivity

Active Publication Date: 2020-12-11
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The modifiers traditionally used to modify epoxy resin structural adhesives have high cost, high viscosity, and harsh reaction conditions, which are not conducive to mass production in real life

Method used

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  • Composite modified epoxy resin structural adhesive, composite modifier and preparation method of structural adhesive
  • Composite modified epoxy resin structural adhesive, composite modifier and preparation method of structural adhesive
  • Composite modified epoxy resin structural adhesive, composite modifier and preparation method of structural adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] The mass fraction is 2.0-2.5% polyurethane prepolymer compound preparation:

[0027] a. Take 15-16g of polyether polyol, put it into a petri dish with a diameter of 10cm, and dry it under vacuum at 100-110°C for 1-2 hours.

[0028] b. Put the dried polyether polyol and 6-7g of PAPI into a three-necked flask, and react at 50-60° C. for 1-1.5 hours under nitrogen atmosphere. During the reaction, measure the isocyanate content according to the international standard ISO.14896-2009 every 10-20 minutes. When the mass of isocyanate drops to 2.0-2.5%, add the polymerization inhibitor benzoyl chloride and stop after 15 minutes reaction. The measured isocyanate mass fraction is 2.1%, and the obtained component is a polyurethane prepolymer composite of polyether polyol, PAPI, polyurethane prepolymer. The Fourier transform infrared spectrogram of this polyurethane prepolymer composite is as follows figure 2 .

Embodiment 2

[0030] Preparation of epoxy resin structural adhesive with polyurethane prepolymer compound mass fraction of 4%:

[0031] After fully mixing 0.6g of polyurethane prepolymer compound prepared by implementing 1 with 12.0g bisphenol A type epoxy resin and 1.0g reactive diluent, component A was prepared, and then with 1.4g of component B (curing agent) Mix evenly, pour it into a mold coated with a release agent, let it solidify naturally, it will dry in 30-90 minutes at room temperature, and demould after 24 hours (including 24 hours) after it is completely cured, and the demoulding curing is 120 hours (including 120 hours) Hours) can be tested for mechanical properties. The tensile strength is 30MPa, the tensile shear strength is 14MPa, and the elongation at break is 11%. The scanning electron microscope picture of the tensile fracture surface is as follows image 3 (b).

Embodiment 3

[0033] Preparation of epoxy resin structural adhesive with polyurethane prepolymer compound mass fraction of 9%:

[0034] The polyurethane prepolymer compound 13.5g that example 1 prepares and 110.5g bisphenol A type epoxy resin, 10.0g reactive diluent fully mix and make component A, then with the component B (curing agent) of 16.0g Mix evenly, pour it into a mold coated with a release agent, let it naturally solidify, surface dry at room temperature for 30-90 minutes, demould after 24 hours (including 24 hours) after it is completely cured, and remove the mold for 120 hours (including 120 hours) Hours) can be tested for mechanical properties. The tensile strength is 36MPa, the tensile shear strength is 16MPa, and the elongation at break is 24%. The scanning electron microscope picture of the tensile fracture surface is as follows image 3 (c).

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Abstract

The invention belongs to the technical field of adhesives, and in particular relates to a composite modified epoxy resin structural adhesive and preparation methods of a composite modifier and the structural adhesive. The structural adhesive is composed of an A component and a B component, wherein the A component comprises the following materials in parts by weight: 60-75 parts of bisphenol A epoxy resin, 5-15 parts of the polyurethane prepolymer complex, and 8-15 parts of an activated diluent; and the B component comprises the following material in parts by weight: 8-15 parts of a curing agent. The preparation method of the polyurethane prepolymer complex comprises the step of an incomplete reaction of a polyether polyol and polyphenyl polymethylene polyisocyanate, and the preparation method of the structural adhesive comprises the step of uniform stirring of the A component and the B component. The epoxy resin structural adhesive provided by the invention overcomes the defects that epoxy resin is hard and brittle on the basis of retaining good adhesion, low shrinkage, dielectric properties, excellent heat resistance and good chemical stability of the epoxy resin, so that the adhesive has the advantages of room-temperature curing, strong adhesion, hardness and toughness and the like.

Description

technical field [0001] The invention provides a polyether polyol, PAPI, bisphenol A epoxy resin, etc. Bisphenol A type epoxy resin and reactive diluent are evenly mixed to prepare A component, and then evenly mixed with B component (curing agent) to prepare epoxy resin structural adhesive, which belongs to the technical field of adhesive preparation. Background technique [0002] Epoxy resin, in a broad sense, refers to any high-quality resin that contains two or more epoxy groups and can react with the amine groups in the curing agent to form an insoluble and infusible three-dimensional space network structure. molecular prepolymers. [0003] Because epoxy resin has excellent properties such as strong adhesion, small shrinkage, excellent dielectric properties, heat resistance, and good chemical stability, it has been well developed in the field of adhesives. [0004] Although there are many kinds of epoxy resins, there are glycidyl ether epoxy resins, glycidyl ester epoxy...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J175/08C09J11/08C08G18/76C08G18/48
CPCC08G18/48C08G18/7664C09J11/08C09J163/00C08L75/08
Inventor 祁争健陈会敏闫力强
Owner SOUTHEAST UNIV
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