Preparation method of micro-nano bending structure

Abstract

The invention provides a preparation method of a micro-nano bending structure, and belongs to the field of nanotechnologies. The method comprises the steps of preparing a suspending material on a substrate; rotationally coating photoresist on the suspending material, and preparing a predetermined pattern through exposing the photoresist; transferring the predetermined pattern to the suspending material through etching; removing the photoresist, and performing material deposition on the suspending material to acquire a dual-layer suspending film structure of the suspending material and the deposited material; and irradiating the dual-layer suspending film structure with ion beams to deform, so as to acquire the micro-nano bending structure. According to the preparation method of the micro-nano bending structure provided by the invention, the limitations of three-dimensional processing methods such as folding on the machining of large area and hundred-nanometer structure scales and on the flexibility of the structure space can be broken, and thus the three-dimensional machining method which is flexible and strong in controllability is acquired.

Description

technical field [0001] The invention relates to the field of micro-nano technology, in particular to a method for preparing a micro-nano curved structure. Background technique [0002] With the development of electronic devices and optical devices, three-dimensional curved structures have been increasingly used in the devices we use. For example, in optical metamaterials, two-dimensional or planar optical metamaterials are difficult to couple with the magnetic field component of light, so in many cases they cannot give full play to the control advantages of optical metamaterials, while three-dimensional optical metamaterials are not suitable for light. Incidence can then respond to its magnetic field component. Three-dimensional metamaterials are a good way to obtain the response of metamaterials to the magnetic component of light. When making electronic devices, three-dimensional electronic devices have a smaller volume, so higher integration can be obtained, and at the s...

AI Technical Summary

Problems solved by technology

Although these approaches can form three-dimensional structures, there are some problems in these methods. For example, the usual dry or wet etching process has high requirements on the substrate, and is selective for materials, and cannot be processed flexibly. structure, and the spatial orientation difference of the structure, etc.

However, the manual folding method is difficult to achieve three-dimensional structure processing on the order of microns and nanometers, and at the same time requires high time and cost.

With the continuous expansion of the demand for micro-nano-scale three-dimensional structures, the above methods can no longer meet the needs of current scientific research and processing.

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