Single-component high-temperature glue and preparation method thereof

A high-temperature adhesive and component technology, applied in adhesives, epoxy resin glue, non-polymer adhesive additives, etc., can solve problems such as unsuitable structural viscosity, poor product consistency, insufficient viscosity strength, etc., to achieve quality Good consistency, long life, and wide range of applicable materials

Pending Publication Date: 2018-07-24
SHENZHEN PROSPER DOBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problems of insufficient viscosity and strength of the existing silica gel type high-temperature glue products, unsuitable structural viscosity, low use efficiency of two-component epoxy resin high-temperature glue products, short high-temperature life, and poor product consistency, the present invention provides a single-component One-part epoxy resin high-temperature glue and preparation method thereof

Method used

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  • Single-component high-temperature glue and preparation method thereof
  • Single-component high-temperature glue and preparation method thereof
  • Single-component high-temperature glue and preparation method thereof

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preparation example Construction

[0033] The preparation method of the single-component high-temperature glue provided by the present invention has the following steps:

[0034] Step 1: Weigh the Portions

[0035] Weigh each component according to the ratio of the single-component high-temperature glue, wherein, according to the needs, select the component of the auxiliary agent, and determine the proportion of each component;

[0036] Step 2: Stir once

[0037] Put the modified maleimide resin, liquid epoxy resin, reactive diluent, and antioxidant into the reaction kettle, and stir at a speed of 40-100rpm under nitrogen at 80-100°C until completely mixed. dissolve into a homogeneous liquid;

[0038] Step 3: Second Stirring

[0039] If a dispersing paddle is installed in the reactor, the homogeneous liquid can be dispersed, and the dispersing speed is 100-3000rpm. Then cool down the homogeneous liquid to 50-60°C, add the pigments and fillers, coupling agents and defoamers, and stir in vacuum for 30-60min; ...

Embodiment 1

[0052] The present embodiment is formulated from the following raw materials in weight percentage:

[0053]

[0054] According to the above weight percentage formula, the process steps of preparing one-component high-temperature adhesive are as follows:

[0055] (1) Resin miscibility: Bisphenol A epoxy resin E-51, amino epoxy resin AG-70, glycerol triglycidyl ether, N,N'-(4,4'-methylene di Phenyl)bismaleimide and Irganon 245 were put into a double-row mixer, and stirred at 80 rpm for 40 minutes under nitrogen at 100°C, and all materials were mixed into a homogeneous liquid. Lower the temperature to 50°C, add, anti-tear powder, fumed silica, alumina powder, 3-mercaptopropyltriethoxysilane, BYK A-550 and stir in vacuum for 40min at a stirring speed of 80rpm and a dispersion speed of 1500rpm. Cool down to 25°C, add dicyandiamide and 2-ethyl-4-methylimidazole, stir in vacuum for 40 minutes, and set aside.

[0056] (2) Grinding: Grind the mixture in step (1) on a three-roll ma...

Embodiment 2

[0062] The present embodiment is formulated from the following raw materials in weight percentage:

[0063]

[0064] According to the above weight percentage formula, the process steps of preparing one-component high-temperature adhesive are as follows:

[0065] (1) Resin miscibility: Bisphenol A epoxy resin E-41, bisphenol F epoxy resin NPEF-170, trimethylolpropane triglycidyl ether, N,N'-m-phenylene bismaleyl The imine and antioxidant 1010 were put into the mixer, and stirred at 60 rpm and 100°C under nitrogen for 60 minutes, and all the materials were mixed into a homogeneous transparent liquid. Lower the temperature to 50°C, add carbon black, fumed silica, alumina powder, 3-glycidyloxypropyltrimethoxysilane, BYK A-550 and stir in vacuum for 60min at a stirring speed of 60rpm. Cool down to 25°C, add dicyandiamide and 2-ethyl-4-methylimidazole, stir in vacuum for 40 minutes, and set aside.

[0066] (2) Grinding: Grind the mixture in step (1) on a three-roll machine for ...

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Abstract

The invention discloses single-component high-temperature glue and a preparation method thereof. The single-component high-temperature glue is prepared from the following raw materials in percentage by weight: 0 to 40 percent of modified maleic imide resin, 20 to 60 percent of liquid epoxy resin, 5 to 15 percent of latent curing agent, 1 to 10 percent of accelerant, 0 to 10 percent of active diluting agent, 15 to 40 percent of pigment and filler and 0 to 5 percent of auxiliary agent. The product is composed of a single component and has a good adhering effect on metal materials including an aluminum alloy, stainless steel, casting iron, a nickel-plated layer and the like after being heated and cured; an adhered part can work for a long period under the working condition of 300 DEG C and the service life can reach 1000h or more; meanwhile, the product disclosed by the invention also has the characteristic of rapid curing speed.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and in particular relates to a single-component high-temperature adhesive widely used in production and life and a preparation method thereof. Background technique [0002] Epoxy adhesives are one of the most widely used structural adhesives due to their excellent bonding strength, corrosion resistance and wide material applicability. High temperature resistant epoxy adhesive can be applied to packaging and bonding between various ceramics, glass, metal, crystal, jade, jewelry, granite, wood and hard plastic, with excellent bonding strength; widely used in high-efficiency filters, Bonding of high-temperature instruments, electronic measuring elements, high-temperature metal parts and sealing of high-temperature pipes; production bonding and sealing of industrial products such as automotive lamps, sensors, high-temperature ovens, steam irons; sealing of electric heating pipes, fixing and bonding...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J179/08C09J11/06C09J11/04
CPCC08K2003/0812C08K2003/2227C08L2201/08C08L2205/025C08L2205/03C09J11/04C09J11/06C09J163/00C08L63/00C08L79/08C08K13/02C08K3/36C08K3/08C08K5/548C08K3/22C08K5/5435
Inventor 贺超刘行袁海宾程相宾贺珍
Owner SHENZHEN PROSPER DOBOND TECH
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