Hall sensor possessing two-dimensional electron gas channel barrier layer local groove structure and manufacturing method
A Hall sensor, two-dimensional electronic technology, applied in the direction of Hall effect devices, electromagnetic device manufacturing/processing, electromagnetic equipment components, etc. Increase voltage drop, improve device sensitivity, and improve the effect of electrode sensing signals
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Embodiment 1
[0028] The structural schematic diagram of the technical solution of the present invention is as follows: figure 1 . Grow buffer layer, epitaxial layer and barrier layer respectively on a semiconductor substrate, the substrate is semiconductor or any other common substrate that can support semiconductor epitaxial growth, especially including Si, InAs, GaAs, SiC, GaN, ZnO, gallium oxide , boron nitride, diamond, sapphire, or any one of quartz, without special limitation; the epitaxial layer can be GaAs, GaN or SiC, without special limitation; the barrier layer can be AlGaAs, There is no special limitation on AlGaN (or InAlN or AlN), or AlN, and the material composition in the barrier layer is not particularly limited. All material combinations and parameter selections for semiconductor heterojunction structures that can generate two-dimensional electron gas are included in this paper. The scope of the patent is limited. The background carrier concentration range of epitaxial ...
Embodiment 2
[0032] figure 2 The basic process of making Hall sensor proposed in the present invention is shown:
[0033] Step 1: Preparation of device chip material with heterojunction structure:
[0034] Device base materials include substrates, buffer layers, epitaxial layers, and barrier layers. The device materials were ultrasonically cleaned with acetone, ethanol, and deionized water, respectively, with an ultrasonic time of 10 min in each step, and then dried with nitrogen and baked at 110 °C for 10 min in an oven for use.
[0035] The second step: device mesa etching isolation:
[0036] The device mesa is defined by photolithography technology, and a good etching window is formed through the steps of gluing, uniform glue, photolithography, and development, and then wet or dry etching technology is used to etch the material barrier layer and epitaxial layer. The etching depth is generally 20 to 2000 nm.
[0037] Step 3: Shallow etching of the selected area of the barrier laye...
Embodiment 3
[0046] 1. Device structure parameters
[0047] A GaN material epitaxial wafer with Si substrate AlN as the buffer layer is used, wherein the epitaxial layer is unintentionally doped GaN, the thickness is 6 μm, and the background electron concentration is 1×10 16 cm -3 , the barrier layer is AlGaN, the thickness is 30nm, and the Al composition is 0.25. The three main electrodes C of the chip 0 , C 1 and C 2 and the Hall sensing electrode S on the groove 1 and S 2 width is 2μm, where electrode C 0 with electrode C 1 , C 2 The pitch is 8μm, the electrode C 0 with electrode S 1 , S 2 The pitches are both 3.5 μm.
[0048] 2. Device manufacturing process
[0049] Step 1: Preparation of device chip material with heterojunction structure:
[0050] The device materials were ultrasonically cleaned with acetone, ethanol, and deionized water, respectively, with an ultrasonic time of 10 min in each step, and then dried with nitrogen and baked at 110 °C for 10 min in an oven f...
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