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Method for quickly preparing metallic oxide film with high smoothness

An oxide film, flatness technology, applied in metal material coating process, liquid chemical plating, device for coating liquid on the surface, etc. problems, to achieve the effect of shortening the preparation time, improving the preparation efficiency and reducing the preparation cost

Active Publication Date: 2018-08-14
DONGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Researchers generally prepare metal oxide films by magnetron sputtering, but this preparation method not only requires expensive instruments, but also takes a very long time to achieve a vacuum environment, which greatly increases the preparation cost
Researchers have also proposed solution method preparation methods, such as spin coating method, scrape coating method and spray coating method, etc., but in the preparation process of the solution method represented by spin coating method, the precursor liquid is seriously wasted, and it is difficult to realize large-scale devices. preparation of
In addition, in order to ensure the performance of thin film field effect transistor devices, the above two types of preparation methods need to anneal the metal oxide film for a long time, and the treatment time is generally not less than 2 hours, which not only increases the preparation cost of the device, but also reduces device fabrication efficiency

Method used

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  • Method for quickly preparing metallic oxide film with high smoothness
  • Method for quickly preparing metallic oxide film with high smoothness
  • Method for quickly preparing metallic oxide film with high smoothness

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] (1) Dissolve indium nitrate, gallium nitrate and zinc nitrate with a molar ratio of 72.5:7.5:20 in ultrapure water with a resistivity of 18.2 MΩ, stir at room temperature for 10 hours in the dark, and obtain a mixture aqueous solution with a concentration of 0.2 mol / L , using a syringe equipped with a hydrophobic polytetrafluoroethylene filter head with a pore size of 0.22 μm to filter the aqueous solution of the mixture to obtain a filtered aqueous solution of the mixture.

[0034] (2) The thermally grown silicon dioxide insulating substrate with a thickness of 300 nm was ultrasonically cleaned with ultrapure water, acetone, and isopropanol for 20 minutes, and then dried with ultrapure argon gas with a purity of 99.999%, and a radio frequency power of 40W was used. Oxygen plasma was treated for 5 minutes, then placed on a hot stage, heated to 70°C, and kept at the temperature for later use.

[0035] (3) Dip the filtered mixture aqueous solution obtained in step (1) wit...

Embodiment 2

[0037] (1) Dissolve indium nitrate, gallium nitrate and zinc nitrate with a molar ratio of 72.5:7.5:20 in ultrapure water with a resistivity of 18.2 MΩ, stir at room temperature for 10 hours in the dark, and obtain a mixture aqueous solution with a concentration of 0.2 mol / L , using a syringe equipped with a hydrophobic polytetrafluoroethylene filter head with a pore size of 0.22 μm to filter the aqueous solution of the mixture to obtain a filtered aqueous solution of the mixture.

[0038] (2) The thermally grown silicon dioxide insulating substrate with a thickness of 300 nm was ultrasonically cleaned with ultrapure water, acetone, and isopropanol for 20 minutes, and then dried with ultrapure argon gas with a purity of 99.999%, and a radio frequency power of 40W was used. Oxygen plasma was treated for 5 minutes, then placed on a hot stage, heated to 80°C, and kept at the temperature for later use.

[0039] (3) Dip the filtered mixture aqueous solution obtained in step (1) wit...

Embodiment 3

[0041] (1) Dissolve indium nitrate, gallium nitrate and zinc nitrate with a molar ratio of 72.5:7.5:20 in ultrapure water with a resistivity of 18.2 MΩ, stir at room temperature for 10 hours in the dark, and obtain a mixture aqueous solution with a concentration of 0.2 mol / L , using a syringe equipped with a hydrophobic polytetrafluoroethylene filter head with a pore size of 0.22 μm to filter the aqueous solution of the mixture to obtain a filtered aqueous solution of the mixture.

[0042] (2) The thermally grown silicon dioxide insulating substrate with a thickness of 300 nm was ultrasonically cleaned with ultrapure water, acetone, and isopropanol for 20 minutes, and then dried with ultrapure argon gas with a purity of 99.999%, and a radio frequency power of 40W was used. Oxygen plasma was treated for 5 minutes, then placed on a hot stage, heated to 70°C, and kept at the temperature for later use.

[0043] (3) Dip the filtered mixture aqueous solution obtained in step (1) wit...

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Abstract

The invention relates to a method for quickly preparing a metallic oxide film with the high smoothness. The method for quickly preparing the metallic oxide film with the high smoothness comprises thesteps of (1) dissolving indium salt, gallium salt and zinc salt into ultrapure water, conducting stirring in a dark place at the room temperature, filtering, and obtaining a filtered mixture water solution; (2) after thoroughly cleaning an insulation substrate, blow-drying through a high-pure argon gas, carrying out plasma treatment through an oxygen gas, heating to 70 DEG C to 90 DEG C, and keeping constant temperature for standby use; and (3) adopting a hairbrush to dip the filtered mixture water solution so as to coat the constant-temperature insulation substrate, obtaining a gel film, quickly transferring, carrying out heat treatment at 280 DEG C to 320 DEG C, and obtaining the metallic oxide film with the high smoothness. According to the method provided by the invention, the preparation duration of the metallic oxide film is effectively reduced, the smoothness of the surface of the metallic oxide film is improved, and the preparation cost of the metallic oxide film is reduced.

Description

technical field [0001] The invention belongs to the technical field of metal oxide thin films, and in particular relates to a method for quickly preparing high-flatness metal oxide thin films. Background technique [0002] Transparent Inorganic Semiconductor Material Indium Oxide In 2 o 3 , zinc oxide ZnO, indium zinc oxide IZO, indium gallium zinc oxide IGZO and other metal oxides and organic semiconductor materials are new materials that the next generation of electronic devices seek to replace inorganic silicon. Compared with silicon materials, metal oxides, which are also inorganic materials, not only have the same carrier mobility as silicon materials, but also have strong stability, can be prepared at low temperature, and have certain flexibility. The most important thing is that metal oxide semiconductors The layer has excellent transparency in the visible light region and is expected to be the active layer material of transistors in next-generation display technolo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/12B05D1/28
CPCB05D1/28C23C18/1216C23C18/1245C23C18/1254C23C18/1295
Inventor 王宏志陈彦平王刚何中媛李耀刚张青红侯成义
Owner DONGHUA UNIV