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Graphene heat-dissipation coating material, preparation method and applications thereof

A heat-dissipating coating and graphene technology, applied in polyester coatings, anti-corrosion coatings, cellulose coatings, etc., can solve the problems of poor stability and dispersibility of thermally conductive metal powder, further improvement of heat dissipation effect, and increased cost. Excellent heat conduction and heat dissipation effect, good weather resistance, easy to play effect

Active Publication Date: 2018-10-23
SHANDONG SHENGQUAN NEW MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the addition of heat-conducting metal powder, the stability and dispersion of heat-conducting metal powder are not good, and this defect is overcome by coating heat-conducting metal powder, which increases the cost, and its heat dissipation effect needs to be further improved

Method used

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  • Graphene heat-dissipation coating material, preparation method and applications thereof

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Experimental program
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Effect test

Embodiment 1

[0049] In parts by weight, the following raw materials are obtained:

[0050] 100 parts of epoxy resin, 10 parts of biomass graphene powder (5 parts with particle size of 8 μm, 5 parts with particle size of 50 μm), 10 parts of mica flake powder (radial size of 100 μm-200 μm, thickness of 1 μm-3 μm), α - 5 parts of alumina, 5 parts of aluminum nitride, 3 parts of talc, 3 parts of dispersant, 1 part of defoamer, 2 parts of leveling agent, 14 parts of xylene, 4 parts of n-butanol, 2 parts of diacetone alcohol .

[0051] (1) Get the biomass graphene powder with a particle size of 8 μm, add water to disperse, and prepare a graphene material dispersion, and then add mica flake powder, α-alumina, aluminum nitride and talcum powder to it, in water Ultrasonic dispersion for 2 hours, drying at 90°C for 6 hours to obtain graphene-mica composite powder;

[0052] (2) After mixing epoxy resin, graphene-mica composite powder, xylene, n-butanol, diacetone alcohol, dispersant, defoamer and l...

Embodiment 2

[0060] In parts by weight, the following raw materials are obtained:

[0061] 75 parts of silicone acrylic resin, 25 parts of amino resin, 10 parts of biomass graphene powder (1 part of particle size 10 μm, 9 parts of particle size of 100 μm), 10 parts of mica flake powder, 5 parts of carbon fiber powder, 5 parts of aluminum nitride 5 parts, 5 parts of talcum powder, 3 parts of dispersant, 1 part of defoamer, 2 parts of anti-settling agent, 14 parts of xylene, 4 parts of n-butanol, 2 parts of diacetone alcohol;

[0062] (1) Take biomass graphene powder with a particle size of 10 μm, add water to disperse it, and prepare a graphene material dispersion, then add mica flake powder, carbon fiber powder, aluminum nitride and talcum powder to it, and ultrasonically disperse in water for 3 hours , and dried at 90°C for 6 hours to obtain graphene-mica composite powder;

[0063] (2) Mix silicone acrylic resin, amino resin, graphene mica composite powder, xylene, n-butanol, diacetone a...

Embodiment 3

[0068] In parts by weight, the following raw materials are obtained:

[0069] 50 parts of phenolic resin, 20 parts of graphene oxide powder (4 parts of particle size 7 μm, 16 parts of particle size of 60 μm), 1 part of mica flake powder, 3 parts of carbon black, 1 part of diamond powder, 1 part of carbon fiber, 2 parts of graphite , 2 parts of copper powder, 2 parts of boron nitride, 2 parts of dispersant, 1 part of defoamer, 2 parts of leveling agent, 3 parts of water, 2 parts of ethanol, 4 parts of acetone, 3 parts of N-methylpyrrolidone, N , 3 parts of N-dimethylformamide, 3 parts of n-hexane, 2 parts of cyclohexane;

[0070] (1) Take graphene oxide powder with a particle size of 7 μm, add water to disperse, and prepare a graphene material dispersion, and then add mica flake powder, carbon black, diamond powder, carbon fiber, graphite, copper powder and boron nitride to it , ultrasonically dispersed in water for 4 hours, and dried at 90°C for 3 hours to obtain graphene-mic...

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Abstract

The invention relates to the field of heat dissipation coating materials, particularly to a graphene heat-dissipation coating material, a preparation method and applications thereof, wherein the graphene heat-dissipation coating material mainly comprises, by weight, 5-20 parts of a graphene material, 10-30 parts of a filler, 50-150 parts of a polymer binder, 20-50 parts of a solvent, and 5-10 parts of a coating material aid, wherein the graphene material exists in the heat-dissipation coating material mainly in the two forms, the graphene material having a particle size of not more than 5 [mu]m is mainly combined with the filler in an adsorption manner, and the graphene material having a particle size of 5-15 [mu]m exists in the heat-dissipation coating material mainly in a dispersed manner. According to the present invention, the cost of the graphene heat-dissipation coating material is low; and the graphene material exists in the heat-dissipation coating material mainly in the two forms, such that the dispersion is uniform and stable, the intrinsic characteristics of the graphene are easily achieved, and the heat dissipating effect of the obtained coating material is obvious.

Description

technical field [0001] The invention relates to the field of heat-dissipating coatings, in particular to a graphene heat-dissipating coating and its preparation method and application. Background technique [0002] With the continuous development of the modern electronics industry, electronic products continue to develop towards miniaturization, light weight, and high power. Electronic products will generate a lot of heat during use. The temperature will continue to rise, which greatly affects the reliability and service life of the electronic devices in it. At present, in order to strengthen the heat dissipation effect of the radiator of electronic products, the purpose of improving the heat dissipation effect is mainly achieved by designing the structure of the radiator of electronic products, increasing the area of ​​the radiator, and changing the material of the radiator, but these methods generally have processing technology. Complexity, high processing costs, strict e...

Claims

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Application Information

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IPC IPC(8): C09D163/00C09D5/08C09D7/61C09D133/04C09D161/20C09D161/06C09D161/02C09D133/00C09D175/04C09D167/00C09D167/08C09D127/12C09D163/10C09D101/02
CPCC08K3/04C08K3/34C08K7/00C08K7/06C08K9/12C08K13/06C08K2003/085C08K2003/2227C08K2003/282C08K2003/385C08K2201/011C08K2201/014C09D5/08C09D101/02C09D127/12C09D133/00C09D143/04C09D161/02C09D161/06C09D163/00C09D163/10C09D167/08C09D175/04C08L61/20C08L83/04
Inventor 韩东张娟娟刘顶王海龙
Owner SHANDONG SHENGQUAN NEW MATERIALS CO LTD
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