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Preparation method of zirconium-plated diamond particle-reinforced aluminum matrix composite

A technology of diamond particles and reinforced aluminum base, which is applied in metal material coating process, sputtering plating, ion implantation plating, etc. , complex process flow and other problems, to achieve the effect of being beneficial to use and storage, improving interface bonding, and improving thermal conductivity

Active Publication Date: 2018-10-26
UNIV OF SCI & TECH BEIJING +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The processes of spark plasma sintering and vacuum hot pressing sintering are complicated and costly, and it is difficult to prepare high-density and complex-shaped composite parts; although extrusion impregnation is simple in process and low in cost, the prepared composite Material thermal conductivity is not ideal

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Zirconium-coated diamond particles with a thickness of 500 nm were obtained by magnetron sputtering, and the zirconium-coated diamond particles were heat-treated at 950 °C for 1 h. Fill the mold with zirconium-coated diamond particles after heat treatment, put the filled mold in the graphite sleeve and put the pure aluminum block on the upper part of the mold, and then place the whole filled mold in the induction furnace Heated zone, connected to vacuum system and pressurized air system. Turn on the vacuum system and evacuate the furnace body until the vacuum degree is better than 0.1 Pa. Turn on the circulating water, start the induction heater, heat the mold to 800 °C and keep it warm for 30 min. Turn on the pressurized gas system to inject high-purity argon into the furnace. When the gas pressure in the furnace reaches 1.0 MPa, turn off the booster gas system and keep the pressure at 800 °C for 30 min. Stop heating, turn off the circulating water when the furnace t...

Embodiment 2

[0025] Zirconium-coated diamond particles with a thickness of 500 nm were obtained by magnetron sputtering, and the zirconium-coated diamond particles were heat-treated at 1050 °C for 1 h. Fill the mold with zirconium-coated diamond particles after heat treatment, put the filled mold in the graphite sleeve and put the pure aluminum block on the upper part of the mold, and then place the whole filled mold in the induction furnace Heated zone, connected to vacuum system and pressurized air system. Turn on the vacuum system and evacuate the furnace body until the vacuum degree is better than 0.1 Pa. Turn on the circulating water, start the induction heater, heat the mold to 800 °C and keep it warm for 30 min. Turn on the pressurized gas system to inject high-purity argon into the furnace. When the gas pressure in the furnace reaches 1.0 MPa, turn off the booster gas system and keep the pressure at 800 °C for 30 min. Stop heating, turn off the circulating water when the furnace ...

Embodiment 3

[0027] Zirconium-coated diamond particles with a thickness of 100 nm were obtained by vacuum micro-evaporation, and the zirconium-coated diamond particles were filled in the mold, and the filled mold was placed in the graphite sleeve and the pure aluminum block was placed on the upper part of the mold. Then place the whole filled mold in the induction heating zone in the furnace, and connect the vacuum system and the pressurized gas filling system. Turn on the vacuum system and evacuate the furnace body until the vacuum degree is better than 0.1 Pa. Turn on the circulating water, start the induction heater, heat the mold to 800 °C and keep it warm for 30 min. Turn on the pressurized gas filling system to inject high-purity argon into the furnace. When the gas pressure in the furnace reaches 1.0 MPa, turn off the booster gas filling system and keep the pressure at 800 °C for 5 min. Stop heating, turn off the circulating water when the furnace temperature drops to room temperat...

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Abstract

The invention belongs to the technical field of composites and provides a preparation method of a zirconium-plated diamond particle-reinforced aluminum matrix composite. The preparation method specifically comprises the steps that the surfaces of diamond particles are plated with zirconium through magnetron sputtering or vacuum micro-evaporation; heat treatment is conducted on the zirconium-plateddiamond particles obtained through magnetron sputtering, wherein the heating temperature is 950-1050 DEG C, and the heat preservation time is 0.5-2h; a mold filled with the zirconium-plated diamond particles and a pure aluminum block is placed in an inductive heating area in a furnace; the mold is heated after a furnace body is vacuumized; high-purity argon is injected into the furnace, and the temperature and pressure are maintained; and the composite is obtained after the furnace is cooled to the room temperature. The diamond / aluminum composite prepared through the method has excellent heatconductivity and a small specific gravity, the heat conductivity of the composite can reach 622W / mK, the density of the composite is smaller than or equal to 3.3g / cm<3>, and the composite can meet the urgent requirement for high-conductivity lightweight heat management materials for heat dissipation of high-power devices in the aerospace field; and the generation of aluminum carbide boundary phases prone to hydrolysis is reduced, and the composite can be used and stored in a humid environment.

Description

technical field [0001] The invention belongs to the technical field of composite materials, and in particular relates to a preparation method of a zirconium-coated diamond particle-reinforced aluminum-based composite material. Background technique [0002] The electronic information industry is one of the leading and pillar industries of today's world economic development. With the development of electronic devices in the direction of high performance, high reliability and light weight, power devices put forward higher requirements for the performance of electronic packaging materials. With the continuous improvement of the integration level and power density of electronic devices, the problem of heat dissipation has become a bottleneck restricting the further development of electronic devices. Traditional electronic packaging materials such as Kovar, Invar, W-Cu alloy and SiC P The thermal conductivity of / Al composite materials is lower than 300 W / mK, which cannot meet t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C1/10C22C1/02C22C21/00C22C26/00C23C14/18
CPCC22C1/101C22C1/1036C22C21/00C22C26/00C23C14/18C23C14/223C22C1/1073
Inventor 张海龙李宁王西涛戴景杰宋为
Owner UNIV OF SCI & TECH BEIJING
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