Chemical palladium plating solution, and preparation method, application method and applications thereof

An electroless plating, palladium ion technology, applied in liquid electroless plating, metal material coating process, coating and other directions, can solve the problems of electrochemical corrosion of circuit boards, unfavorable production operations, easy precipitation of Pd, etc., to avoid corrosion, The appearance is flat, easy to store and transport

Active Publication Date: 2018-11-16
深圳市化讯半导体材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The prior art mainly uses water-soluble compounds such as palladium chloride, diammonium palladium chloride, tetraammonium palladium chloride, palladium sulfate as main palladium salts, and uses chlorine such as palladium chloride, diammonium palladium chloride, tetraammonium palladium chloride, etc. As the main salt, the chemical compound must be stored and transported in a liquid state, and

Method used

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  • Chemical palladium plating solution, and preparation method, application method and applications thereof
  • Chemical palladium plating solution, and preparation method, application method and applications thereof
  • Chemical palladium plating solution, and preparation method, application method and applications thereof

Examples

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preparation example 1

[0044] A kind of electroless palladium plating solution, by the total volume of electroless palladium plating solution, comprises following component:

[0045]

[0046]

[0047] Among them, the palladium ion is provided by palladium tetraammonium sulfate, the reducing agent is sodium hypophosphite, the main complexing agent is ethylenediamine, the auxiliary complexing agent is acrylic acid, the stabilizing agent is thiourea, the pH buffering agent is borax and boric acid, and the pH buffering agent is The pH value of the electroless palladium plating solution is 7.5.

[0048] The preparation method is as follows:

[0049] Add tetraammine palladium sulfate, main complexing agent, auxiliary complexing agent, reducing agent, stabilizing agent and pH buffering agent into water in a formulated amount, and mix uniformly to obtain an electroless palladium plating solution.

preparation example 2

[0051] A kind of electroless palladium plating solution, by the total volume of electroless palladium plating solution, comprises following component:

[0052]

[0053] Among them, the palladium ion is provided by palladium tetraammonium sulfate, the reducing agent is sodium hypophosphite, the main complexing agent is ethylenediamine, the auxiliary complexing agent is oxalic acid, the stabilizing agent is thiourea, and the pH buffering agent is sodium dihydrogen phosphate and phosphoric acid Sodium hydrogen disodium, a pH buffering agent to adjust the pH value of the electroless palladium plating solution to 6.9.

[0054] The preparation method is as follows:

[0055] Add tetraammine palladium sulfate, main complexing agent, auxiliary complexing agent, reducing agent, stabilizing agent and pH buffering agent into water in a formulated amount, and mix uniformly to obtain an electroless palladium plating solution.

preparation example 3

[0057] A kind of electroless palladium plating solution, by the total volume of electroless palladium plating solution, comprises following component:

[0058]

[0059] Wherein, the palladium ion is provided by palladium tetraammonium sulfate, the reducing agent is a composition composed of sodium hypophosphite and formic acid in any ratio, the main complexing agent is sodium edetate, the auxiliary complexing agent is malic acid, and the stabilizer is Bismuth nitrate, the pH buffering agent is sodium dihydrogen phosphate and disodium hydrogen phosphate, and the pH buffering agent stabilizes the pH value of the electroless palladium plating solution to 6.5.

[0060] The preparation method is as follows:

[0061] Add tetraammine palladium sulfate, main complexing agent, auxiliary complexing agent, reducing agent, stabilizing agent and pH buffering agent into water in a formulated amount, and mix uniformly to obtain an electroless palladium plating solution.

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Abstract

The invention provides a chemical palladium plating solution, and a preparation method, an application method and applications thereof. The chemical palladium plating solution comprises palladium ions(0.5-5 g/L) and a reducing agent (1-20 g/L); wherein the palladium ions are provided by palladium tetramminosulfate. Palladium tetramminosulfate in provided chemical palladium plating solution is a solid soluble palladium salt; palladium exists in a tetra-amine palladium complex form; at a room temperature, palladium can be stably stored in a solid form, the storage and transportation are easy; moreover, compared with palladium sulfate or other palladium salts, palladium tetramminosulfate is very stable, and the problem of easy precipitation of palladium is solved.

Description

technical field [0001] The invention belongs to the technical field of surface treatment, and relates to an electroless palladium plating solution, its preparation method, its use method and application. Background technique [0002] In the electronic packaging industry, including surface treatment processes such as wafer-level packaging, IC substrates, PCBs, and FPCs, the chemical nickel-gold process proposed in the 1980s, the coating formed by gold has good oxidation resistance and electrical conductivity, nickel As a barrier layer to prevent the interdiffusion of copper and gold, but chemical nickel and gold often have quality problems such as missed plating, gold penetration, black nickel and white gold layer. [0003] In order to solve the above problems, the chemical nickel-palladium-gold surface treatment process is proposed, which is a further development of the chemical nickel-gold process. An electroless palladium layer is added between the chemical nickel plating ...

Claims

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Application Information

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IPC IPC(8): C23C18/44
CPCC23C18/44
Inventor 苏星宇黄明起夏建文刘强陈元甫
Owner 深圳市化讯半导体材料有限公司
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