High-temperature-resistant dual-curing three-proof glue composition and application thereof

Abstract

The invention relates to high-temperature-resistant dual-curing three-proof glue. Based on 100 parts by weight of adhesive composition, the high-temperature-resistant dual-curing three-proof glue mainly comprises the following components in parts by weight: component A: 60-99 parts of one or more polydimethylsiloxane with the terminal group containing bialkoxy groups and mono(methyl) acrylate groups simultaneously; component B: 0.5-10 parts of one or more silane coupling agent; component C: 0.5-8 parts of one or more cracking type photoinitiator; component D: 0.01-3.0 parts of organic-tin or organic-titanium condensation catalyst. The adhesive composition is especially applicable to three-proof application of the electronic industry, i.e., water proof, dust-proof and shock-proof, and has excellent bonding property for PCB plastic substrates; in a formula, an organic-silicon structure is designed as the main body, and has excellent heat resistance, and the heat-resistant temperature canreach 250 DEG C in a short time.

Description

technical field [0001] The invention relates to the technical field of three anti-adhesive compositions, in particular to a high temperature resistant dual-curing three anti-adhesive composition and its application. Background technique [0002] As electronic products gradually turn to miniaturization, integration, and multi-function, the electronic assembly industry is also developing at a high speed, and the requirements for the safety performance and reliability of assembled products are also getting higher and higher. The application of three-proof glue in electronic assembly can enable manufacturers to effectively improve product quality and reduce expensive maintenance costs during the warranty period. Most of the early conformal adhesives were solvent-based products. Due to the use of a large amount of toxic benzene solvents, the health of operators was affected by the hazards of solvents. Long-term exposure to and working in this environment is likely to induce occup...

AI Technical Summary

Problems solved by technology

However, the existing UV-curable glue cannot provide effective protection on complex types of circuit boards: for example, the glue cannot be cured in the shadow area; in some electronic fields, this kind of glue is required to have excellent temperature resistance and bonding stability, so as to implement Protection of various complex types of circuit boards

[0004] Publication (announcement) number: CN104804491A discloses a kind of high-temperature-resistant UV moisture dual-curing three-proof paint, which is obtained by the following preparation method: take organic silicon resin, reactive diluent monomer, acrylate monomer, photoinitiated Pour the agent and silane coupling agent into the reaction kettle, heat up to 100 degrees and stir for 60 minutes at a speed of 300 rpm. After cooling, add a catalyst, a flame retardant, and a defoamer and stir for 60 minutes at a speed of 300 rpm. A high-temperature-resistant UV moisture dual-curing conformal paint of the present invention has been obtained. The disclosed technology has the following defects: 1. The hardness of the formula is too large after curing, which is not suitable for the development of flexible products, and the adhesive is prone to defects such as cracks in high-temperature environments; 2. There are more active diluent monomers and acrylates in the formula, instead of 100% main silicone, and the high temperature resistance is limited and can only reach 150 degrees

[0005] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art, and provide an environmentally friendly and efficient high-temperature resistant UV moisture double-cured three-proof glue, which can solve the curing problem in the shadow area; at the same time, the glue has excellent high temperature resistance and adhesion knot stability

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