Integrated photovoltaic encapsulation material with high reflectivity and application thereof

A packaging material, high reflectivity technology, applied in photovoltaic power generation, semiconductor devices, electrical components, etc., can solve the problems of high cross-linking degree of packaging materials, cell splits, and high surface hardness.

Active Publication Date: 2018-12-07
HANGZHOU FIRST APPLIED MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the encapsulation material prepared by this scheme has a high degree of crosslinking and high surface hardness, which will lead to

Method used

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  • Integrated photovoltaic encapsulation material with high reflectivity and application thereof
  • Integrated photovoltaic encapsulation material with high reflectivity and application thereof
  • Integrated photovoltaic encapsulation material with high reflectivity and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0072] Layer thickness:

[0073]

[0074] Weather Resistant Outer Formula:

[0075]

[0076] Support Layer Recipe:

[0077]

[0078] Primer formulation:

[0079]

[0080] Buffer layer recipe:

[0081]

[0082]

[0083] Encapsulation layer formula:

[0084]

[0085] in,

[0086] The interlayer is a glass fiber grid membrane, and the grid area is 50 μm 2 of round shape.

[0087] The modified resin in the primer layer is prepared through the following steps:

[0088] 1) N-(β-aminoethyl)-γ-aminopropylmethyldimethoxysilane with a mass fraction of 0.05%, 5% carbodiimide UN150 (Euen Chemical), 40% acrylic acid Add resin HK77010 (Haoren International) and 54.95% polyester resin GK110 (Toyobo) into an anhydrous reactor and mix evenly;

[0089] 2) Raise the temperature of the reactor to 100°C and stir for 180 minutes to obtain the solute; 3) After cooling down to 80°C naturally, add ethyl acetate solvent equal to the mass of the solute to dilute while stirri...

Embodiment 2

[0092] Layer thickness:

[0093]

[0094]

[0095] Weather Resistant Outer Formula:

[0096]

[0097] Support Layer Recipe:

[0098]

[0099] Primer formulation:

[0100]

[0101] Buffer layer recipe:

[0102]

[0103] Encapsulation layer formula:

[0104]

[0105]

[0106] in,

[0107] The interlayer is a glass fiber grid membrane, and the grid area is 10 μm 2 rectangle.

[0108] The modified resin in the primer layer is prepared through the following steps:

[0109] 1) The mass fraction is 0.1% of isopropyl tris (dioctyl pyrophosphate acyloxy) titanate, 4% of carbodiimide AS4 (Rhine Chemical), 10.9% of acrylic resin HU57024 (Haoren International) ) and 85% polyester resin 220# (Toyobo), add in anhydrous reactor and mix evenly;

[0110] 2) Raise the temperature of the reactor to 150°C and stir for 120 minutes to obtain the solute;

[0111] 3) After natural cooling to 80°C, slowly stir while adding methyl ethyl ketone solvent equal to the mass ...

Embodiment 3

[0114] Layer thickness:

[0115]

[0116] Weather Resistant Outer Formula:

[0117]

[0118]

[0119] Support Layer Recipe:

[0120]

[0121] Primer formulation:

[0122]

[0123] Buffer layer recipe:

[0124]

[0125] Encapsulation layer formula:

[0126]

[0127] in,

[0128] The interlayer is a polyamide grid membrane, and the grid area is 30mm 2 of hexagons.

[0129] The modified resin in the primer layer is prepared through the following steps:

[0130] 1) N-(β-aminoethyl)-γ-aminopropylmethyldimethoxysilane, 5% carbodiimide AS1 (Rhine Chemical), 38% acrylic resin with a mass fraction of 5% Add LR7664 (Mitsubishi Rayon) and 52% polyester resin GK680 (Toyobo) into an anhydrous reactor and mix evenly;

[0131] 2) Raise the temperature of the reactor to 260°C and stir for 10 minutes to obtain the solute; 3) After cooling down to 80°C naturally, add butyl acetate solvent equal to the mass of the solute to dilute while stirring slowly and set aside ...

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Abstract

The invention relates to an integrated photovoltaic encapsulation material with high reflectivity and applications thereof. The integrated photovoltaic encapsulation material is sequentially composedof a weather-resistant outer layer, a support layer, a primer layer, a buffer layer, a sandwich layer and an encapsulation layer. The integrated photovoltaic encapsulation material prepared by the invention is applied to the back surface of a crystal silicon module battery chip, and can replace the combination of a conventional back layer encapsulation adhesive film and a photovoltaic backplane material. The integrated photovoltaic encapsulation material exhibits excellent thermal stability and is convenient to use during lamination of component manufacture. Problems of whitening, flanging andwrinkling are eliminated, and the manufacturing process cost and the defective product rate of components are greatly reduced. Meanwhile, the integrated encapsulation material has high reflectivity,is beneficial to the solar light utilization rate of a photovoltaic module and has an obvious gain effect on power, so the material is a high-reliability integrated encapsulation material suitable forcrystal silicon modules.

Description

technical field [0001] The invention belongs to the field of photovoltaic encapsulation materials, and relates to an integrated photovoltaic encapsulation material with high reflectivity. Background technique [0002] A photovoltaic power generation system is a power generation system that uses solar cells to directly convert solar energy into electrical energy. Because of its high reliability, long service life, no pollution to the environment, independent power generation and grid-connected operation, it has been favored by enterprises and organizations in various countries. [0003] For the component side, increasing the power generation capacity of components and reducing costs are the main solutions to support grid parity solutions. For auxiliary materials for components, materials that can increase the power of components and reduce process costs are currently the preferred standards for auxiliary materials. From the perspective of the structure of traditional compon...

Claims

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Application Information

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IPC IPC(8): H01L31/048
CPCH01L31/0481Y02E10/50
Inventor 林维红卢稳詹志英周光大林建华
Owner HANGZHOU FIRST APPLIED MATERIAL CO LTD
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