Unlock instant, AI-driven research and patent intelligence for your innovation.

Method for electroplating metal on the surface of insulating substrate

A technology of insulating substrates and electroplating metals, which is applied in the fields of printed circuits, electrical components, and printed circuit manufacturing, and can solve problems such as poor response, affecting the conductivity and stability of circuit boards, and weak conductivity of organic conductive polymers.

Active Publication Date: 2022-08-05
GUANGDONG TONESET SCI & TECH
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But this process also has an Achilles' heel. Due to the charge characteristics of the treated substrate surface (such as the hole wall), if the substrate is directly treated with a permanganate-containing solution, the secondary particles deposited on the substrate surface, especially the hole wall surface The amount of manganese oxide will be very small, so that the organic conductive film formed on the surface of the substrate will be relatively thin, and the conductivity of the organic conductive polymer is weak, especially in the glass fiber site in the hole of the circuit board. The generation of voids, commonly known as "broken copper", will appear light transmission and voids in the backlight test
In addition, even if no light transmission and voids are produced in the backlight test, if the copper thickness in a certain position in the hole is extremely thin, it will still affect the conductivity and stability of the circuit board

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Substrate surface modification: Take two plastic substrates with a thickness of 1.6 mm, and use a laser to generate through holes with a diameter of 0.2 mm and blind holes with a thickness of 75 μm and a diameter of 100 μm on them. At 50°C, immerse in 1g / L sodium allylsulfonate aqueous solution for 4.5 minutes, after washing, at 80°C, immerse in 60g / L, pH=6 (adjusted with 10g / L boric acid) permanganic acid Treated in potassium aqueous solution for about 1.5 minutes, washed with water after the treatment, and set aside.

[0036] Manganese dioxide adsorption test: take one of the treated substrates, use a sufficient amount of mixed solution containing 3% (volume fraction) sulfuric acid and 3% (volume fraction) hydrogen peroxide to elute the manganese dioxide on the substrate, and calculate The adsorption amount (density) of manganese dioxide on the substrate is 38.18 μg / cm 2 .

[0037]Copper electroplating: Immerse another treated substrate into a mixed solution of 10ml...

Embodiment 2

[0039] Substrate surface modification: Take two pieces of glass fiber cloth with a thickness of 1.6mm, use a laser on them to generate through holes with a diameter of 0.2mm and blind holes with a medium thickness of 75μm and a diameter of 100μm. At 30°C, immerse in 5g / L sodium dodecylbenzenesulfonate aqueous solution for about 2 minutes, after washing with water, at 80°C, immerse in 60g / L, pH=6 (adjust with 10g / L boric acid ) in an aqueous solution of potassium permanganate for about 1.5 minutes, washed with water after the treatment, and used for subsequent use.

[0040] Manganese dioxide adsorption test: take one of the treated glass fiber cloths, and use a sufficient amount of mixed solution containing 3% (volume fraction) sulfuric acid and 3% (volume fraction) hydrogen peroxide to elute the manganese dioxide on the substrate, The adsorption amount (density) of manganese dioxide on the glass fiber cloth was calculated to be 119.29 μg / cm 2 .

[0041] Copper electroplating...

Embodiment 3

[0043] Substrate surface modification: Take two epoxy resin substrates with a thickness of 1.6mm, and use a laser to generate through holes with a diameter of 0.2mm and blind holes with a thickness of 75μm and a diameter of 100μm. Then at 35°C, immersed in 10g / L sodium oleate aqueous solution for about 1.5 minutes, after washing, at 80°C, immersed in 60g / L, pH=6 (adjusted with 10g / L boric acid) permanganic acid Treated in potassium aqueous solution for about 1.5 minutes, washed with water after the treatment, and set aside.

[0044] Manganese dioxide adsorption test: use the same method in Example 1 to treat one of the above epoxy resin substrates, and calculate the adsorption amount of manganese dioxide on the substrate to be 64.47 μg / cm 2 .

[0045] Copper electroplating: Using the same electroplating copper solution in Example 1, under the same conditions, another modified substrate was electroplated with copper. The backlight test showed that the backlight level reached 9...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
concentrationaaaaaaaaaa
adsorption capacityaaaaaaaaaa
adsorption capacityaaaaaaaaaa
Login to View More

Abstract

The invention relates to a method for electroplating metal on the surface of an insulating base material, comprising the following steps: contacting the surface of the insulating base material with a water-soluble anionic compound to generate a modified surface; The aqueous solution is contacted to form a manganese dioxide adsorption layer on the modified surface; a conductive polymer layer is formed on the surface of the manganese dioxide adsorption layer; and a metal layer is formed by electroplating on the surface of the conductive polymer layer. The above-mentioned method utilizes the deposition of anionic compounds on the surface of the insulating substrate to form a tightly bound coating layer with the surface of the substrate. After such modification and adsorption, a uniform film with a certain thickness is formed on the surface. Under the condition of electroplating solution and electroplating solution, the deep plating ability and dispersing ability of the electroplating solution will be greatly improved, and the obtained metal coating has the characteristics of flatness, uniformity and good backlight effect, avoiding hole breakage and excessive thinning of the electroplated metal layer at individual sites in the hole. production.

Description

technical field [0001] The invention relates to the technical field of surface treatment, in particular to a method for electroplating metal on the surface of an insulating substrate. Background technique [0002] With the rapid development of the electronic information industry, the printed circuit board (PCB) industry, which is an electronic interconnection carrier, also develops rapidly. From the previous double-sided multi-layer to the high-density interconnect board HDI (High Density Interconnector), to the current SLPCB (Substratelike-PCB), the process requirements are getting higher and higher. In the past, formaldehyde was used as a reducing agent in the electroless copper plating of interlayer conduction in this process. Formaldehyde is a highly toxic carcinogen that poses a great threat to the health of operators. In addition, the process involves the use and discharge of metal ions such as copper ions, nickel ions and palladium ions, and more importantly, the was...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C25D5/54C25D5/56H05K3/00
CPCH05K3/0094C25D5/54C25D5/56
Inventor 刘彬云肖亮何雄斌宋兴文
Owner GUANGDONG TONESET SCI & TECH