Preparation method for insulating and heat-dissipating composition, insulating and heat-dissipating film and insulating and heat-dissipating shielding hood
A composition and film technology, applied in the fields of magnetic field/electric field shielding, cooling/ventilation/heating transformation, modification by conduction heat transfer, etc. Heat concentration and other problems, to achieve the effect of improving heat dissipation performance, excellent heat dissipation performance, and excellent electrical insulation performance
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Embodiment 1
[0046] An insulating and heat-dissipating composition, comprising the following raw materials in parts by weight: 60 parts of epoxy resin, 20 parts of tung oil, 40 parts of cross-linked polyethylene resin, 10 parts of polyurethane resin, 30 parts of thermally conductive insulating fillers, 10 parts of moisturizing additives, 11 parts of dioctyl phthalate plasticizer, 12 parts of silicon dioxide, 11 parts of sericite powder, 9 parts of curing agent, 5 parts of vinyltriethoxysilane coupling agent, and 25 parts of co-solvent.
[0047] Among them, the thermally conductive insulating filler is a mixture of nanoscale acicular alumina filler, nanoscale granular alumina filler, nanoscale fibrous alumina filler and nanoscale columnar alumina filler in a weight ratio of 1:2.5:1.5:0.8 . The curing agent is made by blocking hexamethylene diisocyanate with butanone oxime as a blocking agent.
[0048] The moisturizing auxiliary agent is a mixture of glycerin and polyacrylamide water retain...
Embodiment 2
[0057] An insulating and heat-dissipating composition, comprising the following raw materials in parts by weight: 70 parts of epoxy resin, 27.5 parts of tung oil, 45 parts of cross-linked polyethylene resin, 12.5 parts of polyurethane resin, 35 parts of thermally conductive insulating fillers, 15 parts of moisturizing additives, 15 parts of dibutyl phthalate plasticizer, 16 parts of silicon dioxide, 13.5 parts of sericite powder, 10.5 parts of curing agent, 7.5 parts of anilinomethyltriethoxysilane coupling agent, and 30.5 parts of cosolvent.
[0058] Among them, the thermally conductive insulating filler is a mixture of nano-scale acicular magnesium oxide filler, nano-scale granular magnesium oxide filler, nano-scale fibrous magnesium oxide filler and nano-scale columnar magnesium oxide filler in a weight ratio of 1:2.5:1.5:0.8 , The curing agent is made of phenol as a blocking agent to block hexamethylene diisocyanate.
[0059] The moisturizing auxiliary agent is a mixture o...
Embodiment 3
[0068] An insulating and heat-dissipating composition, comprising the following raw materials in parts by weight: 80 parts of epoxy resin, 35 parts of tung oil, 50 parts of cross-linked polyethylene resin, 15 parts of polyurethane resin, 40 parts of thermally conductive insulating filler, 20 parts of moisturizing additive, 19 parts of diheptyl phthalate plasticizer, 20 parts of silicon dioxide, 16 parts of sericite powder, 12 parts of curing agent, 10 parts of γ-methacryloxypropyl trimethoxysilane coupling agent, auxiliary 36 parts of solvent.
[0069]Among them, the thermally conductive insulating filler is a mixture of nanoscale needle-shaped zinc oxide filler, nanoscale granular zinc oxide filler, nanoscale fibrous zinc oxide filler and nanoscale columnar zinc oxide filler in a weight ratio of 1:2.5:1.5:0.8 , The curing agent is made of ethylene glycol as a blocking agent to block hexamethylene diisocyanate.
[0070] The moisturizing auxiliary agent is a mixture of glyceri...
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