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Preparation method for insulating and heat-dissipating composition, insulating and heat-dissipating film and insulating and heat-dissipating shielding hood

A composition and film technology, applied in the fields of magnetic field/electric field shielding, cooling/ventilation/heating transformation, modification by conduction heat transfer, etc. Heat concentration and other problems, to achieve the effect of improving heat dissipation performance, excellent heat dissipation performance, and excellent electrical insulation performance

Active Publication Date: 2019-01-11
GUANGDONG HERUN PRECISION METAL MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The material of the shielding cover is generally made of 0.2mm thick stainless steel and nickel-nickel copper. Among them, nickel-nickel copper is not only a metal shielding material that is easy to tin, but also has a certain degree of conductivity. The shielding cover made of nickel-nickel copper may be incompatible with Electronic components or PCB boards are electrically connected, causing electronic components to be disconnected or circuit boards to be short-circuited, affecting the normal and stable operation of electronic products
At the same time, the components of electronic products will generate heat when they are working. When the heat inside the electronic product cannot be diffused to the outside of the electronic product in time through the shielding cover, it may cause the internal heat concentration of the electronic product, which will increase the temperature of the electronic component and cause a crash or The problem of burning components

Method used

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  • Preparation method for insulating and heat-dissipating composition, insulating and heat-dissipating film and insulating and heat-dissipating shielding hood

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] An insulating and heat-dissipating composition, comprising the following raw materials in parts by weight: 60 parts of epoxy resin, 20 parts of tung oil, 40 parts of cross-linked polyethylene resin, 10 parts of polyurethane resin, 30 parts of thermally conductive insulating fillers, 10 parts of moisturizing additives, 11 parts of dioctyl phthalate plasticizer, 12 parts of silicon dioxide, 11 parts of sericite powder, 9 parts of curing agent, 5 parts of vinyltriethoxysilane coupling agent, and 25 parts of co-solvent.

[0047] Among them, the thermally conductive insulating filler is a mixture of nanoscale acicular alumina filler, nanoscale granular alumina filler, nanoscale fibrous alumina filler and nanoscale columnar alumina filler in a weight ratio of 1:2.5:1.5:0.8 . The curing agent is made by blocking hexamethylene diisocyanate with butanone oxime as a blocking agent.

[0048] The moisturizing auxiliary agent is a mixture of glycerin and polyacrylamide water retain...

Embodiment 2

[0057] An insulating and heat-dissipating composition, comprising the following raw materials in parts by weight: 70 parts of epoxy resin, 27.5 parts of tung oil, 45 parts of cross-linked polyethylene resin, 12.5 parts of polyurethane resin, 35 parts of thermally conductive insulating fillers, 15 parts of moisturizing additives, 15 parts of dibutyl phthalate plasticizer, 16 parts of silicon dioxide, 13.5 parts of sericite powder, 10.5 parts of curing agent, 7.5 parts of anilinomethyltriethoxysilane coupling agent, and 30.5 parts of cosolvent.

[0058] Among them, the thermally conductive insulating filler is a mixture of nano-scale acicular magnesium oxide filler, nano-scale granular magnesium oxide filler, nano-scale fibrous magnesium oxide filler and nano-scale columnar magnesium oxide filler in a weight ratio of 1:2.5:1.5:0.8 , The curing agent is made of phenol as a blocking agent to block hexamethylene diisocyanate.

[0059] The moisturizing auxiliary agent is a mixture o...

Embodiment 3

[0068] An insulating and heat-dissipating composition, comprising the following raw materials in parts by weight: 80 parts of epoxy resin, 35 parts of tung oil, 50 parts of cross-linked polyethylene resin, 15 parts of polyurethane resin, 40 parts of thermally conductive insulating filler, 20 parts of moisturizing additive, 19 parts of diheptyl phthalate plasticizer, 20 parts of silicon dioxide, 16 parts of sericite powder, 12 parts of curing agent, 10 parts of γ-methacryloxypropyl trimethoxysilane coupling agent, auxiliary 36 parts of solvent.

[0069]Among them, the thermally conductive insulating filler is a mixture of nanoscale needle-shaped zinc oxide filler, nanoscale granular zinc oxide filler, nanoscale fibrous zinc oxide filler and nanoscale columnar zinc oxide filler in a weight ratio of 1:2.5:1.5:0.8 , The curing agent is made of ethylene glycol as a blocking agent to block hexamethylene diisocyanate.

[0070] The moisturizing auxiliary agent is a mixture of glyceri...

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Abstract

The invention relates to the technical field of insulating and heat-dissipating materials, in particular to a preparation method for an insulating and heat-dissipating composition, an insulating and heat-dissipating film and an insulating and heat-dissipating shielding hood. The insulating and heat-dissipating composition is prepared from the following raw materials in parts by weight: 60-80 partsof epoxy resin, 20-35 parts of tung oil, 40-50 parts of crosslinked polyethylene resin, 10-15 parts of polyurethane resin, 30-40 parts of heat conducting insulating filler, 10-20 parts of a moisturizing auxiliary agent, 5-10 parts of a coupling agent and 25-36 part of a cosolvent. The insulating and heat-dissipating composition has excellent electric insulating property and loading performance, and has the characteristics of being good in flame retardant effect and smoke suppression property in a high-temperature environment.

Description

technical field [0001] The invention relates to the technical field of insulation and heat dissipation materials, in particular to an insulation and heat dissipation composition, an insulation and heat dissipation film, and a preparation method for an insulation and heat dissipation shield. Background technique [0002] The shielding cover is a tool used to shield the influence of external electromagnetic waves on the internal circuit and the external radiation of electromagnetic waves generated inside. It is mainly used in mobile phones, GPS and other fields. The material of the shielding cover is generally made of 0.2mm thick stainless steel and nickel-nickel copper. Among them, nickel-nickel copper is not only a metal shielding material that is easy to tin, but also has a certain degree of conductivity. The shielding cover made of nickel-nickel copper may be incompatible with Electronic components or PCB boards are electrically connected, resulting in open circuit of elec...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L91/00C08L23/26C08L75/04C08K13/04C08K7/08C08K3/22C08K3/36C08K3/34C08K13/02C08K3/28C08K3/38H05K7/20H05K9/00
CPCC08K2003/222C08K2003/2227C08K2003/2296C08K2003/282C08K2003/385C08K2201/011C08K2201/014C08L63/00C08L2023/44C08L2201/02C08L2203/20C08L2205/035H05K7/2039H05K9/0007C08L91/00C08L23/26C08L75/04C08K13/04C08K7/08C08K3/22C08K3/36C08K3/34C08K13/02C08K3/28C08K3/38
Inventor 刘声金
Owner GUANGDONG HERUN PRECISION METAL MATERIALS CO LTD