Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Anti-oxidation copper-based bonding wire and preparation method thereof

A bonding wire, anti-oxidation technology, applied in manufacturing tools, heat treatment equipment, semiconductor/solid-state device manufacturing, etc., can solve the problems of increased process complexity by electroplating Pd, difficulty in packaging integrated circuits, and increased operational risks, and achieve improved Antioxidant performance, environmental protection and good safety, the effect of improving arc shape characteristics

Inactive Publication Date: 2019-03-15
UNIV OF SHANGHAI FOR SCI & TECH
View PDF5 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, most of the research applications for replacing gold bonding wires focus on copper-based bonding wires, but this type of bonding wires also has its disadvantages: 1, copper wires are difficult to draw due to work hardening in the drawing process 2. Because the copper wire is too hard, it will cause the first solder joint to escape easily, so that the bonding operation will be interrupted frequently, which will cause great difficulties to the integrated circuit packaging in the next process.
3. Because copper wire is easy to oxidize, it is easy to oxidize during storage and welding. After opening the package, it must be used up as soon as possible, and nitrogen and hydrogen mixture must be added to protect it, which increases the risk of operation.
However, electroplating Pd increases the complexity of the process, especially the problem of environmental protection

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] An anti-oxidation copper-based bonding wire, comprising the following components: zirconium, zinc, rare earth and copper; wherein, the content of the above components is according to the following weight ratio: zirconium 0.0008%, zinc 0.001%, rare earth 0.0002%, and the balance is copper. The purity of copper is ≥99.996, and the purity of zirconium is >99.9%. The rare earth is a mixed rare earth, and the copper-based bonding wire has a single crystal structure.

[0038] The preparation method of the anti-oxidation copper-based bonding wire includes: preparing copper alloy ingot, preparing cast single crystal bus bar, rough drawing, heat treatment, fine drawing, surface cleaning, coiling and packaging; details are as follows:

[0039] 1) Prepare copper alloy ingots; mix zirconium, zinc, rare earth and copper according to mass percentages, put them into a graphite crucible, melt them in an induction furnace under inert gas protection conditions, and obtain copper alloy i...

Embodiment 2

[0047] An anti-oxidation copper-based bonding wire, comprising the following components: zirconium, zinc, rare earth and copper; wherein, the content of the above components is according to the following weight ratio: zirconium 0.0025%, zinc 0.015%, rare earth 0.0010%, and the balance is copper. The purity of copper is ≥99.996, and the purity of zirconium is >99.9%. The rare earth is a mixed rare earth, and the copper-based bonding wire has a single crystal structure.

[0048] The preparation method of the anti-oxidation copper-based bonding wire includes: preparing copper alloy ingot, preparing cast single crystal bus bar, rough drawing, heat treatment, fine drawing, surface cleaning, coiling and packaging; details are as follows:

[0049] 1) Prepare copper alloy ingots; mix zirconium, zinc, rare earth and copper according to mass percentages, put them into a graphite crucible, melt them in an induction furnace under inert gas protection conditions, and obtain copper alloy i...

Embodiment 3

[0057] An anti-oxidation copper-based bonding wire, comprising the following components: zirconium, zinc, rare earth and copper; wherein, the content of the above components is according to the following weight ratio: 0.0015% of zirconium, 0.008% of zinc, 0.0006% of rare earth, and the balance is copper. The purity of copper is ≥99.996, and the purity of zirconium is >99.9%. The rare earth is a mixed rare earth, and the copper-based bonding wire has a single crystal structure.

[0058] The preparation method of the anti-oxidation copper-based bonding wire includes: preparing copper alloy ingot, preparing cast single crystal bus bar, rough drawing, heat treatment, fine drawing, surface cleaning, coiling and packaging; details are as follows:

[0059] 1) Prepare copper alloy ingots; mix zirconium, zinc, rare earth and copper according to mass percentages, put them into a graphite crucible, melt them in an induction furnace under inert gas protection conditions, and obtain coppe...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Diameteraaaaaaaaaa
Login to View More

Abstract

The invention provides an anti-oxidation copper-based bonding wire. The bonding wire comprises the following components in percentage: 0.0008-0.0025 wt% of zirconium, 0.001-0.015 wt% of zinc, 0.0002-0.0010 wt% of rare earth and the balance of copper. By adding trace elements, the recrystallization temperature, the mechanical property and the bonding process performance of copper can be improved, so that the oxidation resistance of the copper can be effectively improved; and meanwhile, the oxidation of the copper is inhibited by selective oxidation of the Zn, so that the oxidation resistance ofa copper wire is improved, and the strength and conductivity of the copper wire can be ensured. The invention further provides a preparation method of the antioxidant copper-based bonding wire.

Description

technical field [0001] The invention belongs to the technical field of the subsequent packaging process of microelectronics, and in particular relates to an oxidation-resistant copper-based bonding wire and a preparation method thereof. Background technique [0002] Bonding wire is one of the four essential basic materials for semiconductor discrete devices and integrated circuit packaging industries. It is used as an inner wire between the chip and the frame to achieve a stable and reliable electrical connection. Packaging of light-emitting diodes (LEDs) and integrated circuits. Bonding wires are mostly made of pure gold. With the increasing scarcity of gold and precious metal resources, the price continues to rise, and the cost of microelectronic packaging has risen sharply, which has brought unbearable cost pressures to manufacturers and users. Therefore, the industry is actively seeking , a new type of bonding wire material with relatively low research and development c...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L23/49H01L21/48B22D11/00C21D9/52C22C9/04C22F1/08
CPCH01L24/43H01L24/45C21D9/525C22C9/04C22F1/08B22D11/004H01L2224/4381H01L2224/4321H01L2224/45147H01L2924/0104H01L2924/0103H01L2224/43848
Inventor 王娟曹凯刘实瞿晓春陈洲刘新宽陈小红
Owner UNIV OF SHANGHAI FOR SCI & TECH
Features
  • Generate Ideas
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com