Anti-oxidation copper-based bonding wire and preparation method thereof
A bonding wire, anti-oxidation technology, applied in manufacturing tools, heat treatment equipment, semiconductor/solid-state device manufacturing, etc., can solve the problems of increased process complexity by electroplating Pd, difficulty in packaging integrated circuits, and increased operational risks, and achieve improved Antioxidant performance, environmental protection and good safety, the effect of improving arc shape characteristics
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[0036] Example 1
[0037] An oxidation-resistant copper-based bonding wire, comprising the following components: zirconium, zinc, rare earth and copper; wherein the content of the above components is in the following weight ratios: zirconium 0.0008%, zinc 0.001%, rare earth 0.0002%, and the balance is copper. The purity of copper≥99.996, the purity of zirconium> 99.9%. The rare earth is a mixed rare earth, and the copper-based bonding wire has a single crystal structure.
[0038] The preparation method of the oxidation-resistant copper-based bonding wire includes: preparing copper alloy ingots, preparing as-cast single crystal bus bars, rough drawing, heat treatment, fine drawing, surface cleaning, winding and packaging; the details are as follows:
[0039] 1) Prepare a copper alloy ingot; mix zirconium, zinc, rare earth and copper in a graphite crucible according to the mass percentage, and use an induction electric furnace to melt under inert gas protection to obtain a copper all...
Example Embodiment
[0046] Example 2
[0047] An anti-oxidation copper-based bonding wire, comprising the following components: zirconium, zinc, rare earth and copper; wherein the content of the above components is in the following weight ratio: zirconium 0.0025%, zinc 0.015%, rare earth 0.0010%, and the balance is copper. The purity of copper≥99.996, the purity of zirconium> 99.9%. The rare earth is a mixed rare earth, and the copper-based bonding wire has a single crystal structure.
[0048] The preparation method of the oxidation-resistant copper-based bonding wire includes: preparing copper alloy ingots, preparing as-cast single crystal bus bars, rough drawing, heat treatment, fine drawing, surface cleaning, winding and packaging; the details are as follows:
[0049] 1) Prepare a copper alloy ingot; mix zirconium, zinc, rare earth and copper in a graphite crucible according to the mass percentage, and use an induction electric furnace to melt under inert gas protection to obtain a copper alloy ing...
Example Embodiment
[0056] Example 3
[0057] An oxidation-resistant copper-based bonding wire, comprising the following components: zirconium, zinc, rare earth and copper; wherein the content of the above components is in the following weight ratios: zirconium 0.0015%, zinc 0.008%, rare earth 0.0006%, and the balance is copper. The purity of copper≥99.996, the purity of zirconium> 99.9%. The rare earth is a mixed rare earth, and the copper-based bonding wire has a single crystal structure.
[0058] The preparation method of the oxidation-resistant copper-based bonding wire includes: preparing copper alloy ingots, preparing as-cast single crystal bus bars, rough drawing, heat treatment, fine drawing, surface cleaning, winding and packaging; the details are as follows:
[0059] 1) Prepare a copper alloy ingot; mix zirconium, zinc, rare earth and copper in a graphite crucible according to the mass percentage, and use an induction electric furnace to melt under inert gas protection to obtain a copper all...
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