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Method for making hot plug application gold finger

A manufacturing method and technology of golden fingers, which are applied in chemical/electrolytic methods to remove conductive materials, reinforce conductive patterns, and form electrical connections of printed components. Liquid penetration and other problems, to achieve the effect of sufficient dwell time, short curing time, and low residual glue rate

Active Publication Date: 2022-01-21
CHANGSHU MUTUAL TEK CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the existing technology, due to the selection and improper operation of anti-plating ink or blue glue, and the problem of liquid infiltration during etching, it often leads to uneven pitch between gold fingers or bleed-through phenomenon, which leads to an increase in product defect rate

Method used

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  • Method for making hot plug application gold finger
  • Method for making hot plug application gold finger
  • Method for making hot plug application gold finger

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Such as figure 1 As shown, a method for making a gold finger for hot insertion in the present invention includes the following steps:

[0041] 1) Pre-treatment of the PCB board, setting a solder mask and sandblasting treatment on the PCB board;

[0042] 2) Silk-screen anti-plating ink, silk-screen anti-plating ink on the gold finger area and after exposure and development, cover the gold finger guide line part in the circuit board;

[0043] 3) The gold finger is gold-plated, the whole board is attached with blue glue and the window is opened in the gold finger area for gold-plated treatment;

[0044] 4) The inner layer is removed to remove the wet film formed by the anti-plating ink;

[0045] 5) Inner layer etching, etch to remove the gold finger wires.

[0046] Wherein, the blue glue includes the following components by weight: 35 parts of vinyl acetate resin, 16 parts of alkyd resin, 20 parts of epoxy resin, 9 parts of acrylate monomer, 2.5 parts of light curing ag...

Embodiment 2

[0049] The difference between this embodiment and Embodiment 1 is that the blue glue includes the following components by weight: 40 parts of vinyl acetate resin, 14 parts of alkyd resin, 18 parts of epoxy resin, 9 parts of acrylate monomer, and 2.8 parts of curing agent, 1.5 parts of thixotropic agent, 4.5 parts of pigment, 0.4 part of cellulose acetate butyrate, 8 parts of nano calcium sulfate whiskers, 2 parts of butyl benzyl phthalate; the rest are the same as in Example 1.

Embodiment 3

[0051] The difference between this embodiment and Embodiment 1 is that the blue glue includes the following components by weight: 38 parts of vinyl acetate resin, 15 parts of alkyd resin, 19 parts of epoxy resin, 10 parts of acrylate monomer, light 2.7 parts of curing agent, 1.4 parts of thixotropic agent, 4.0 parts of pigment, 0.45 parts of cellulose acetate butyrate, 9 parts of nano-calcium sulfate whiskers, 1.5 parts of butyl benzyl phthalate, and the light curing agent is isopropyl Thioxanthone; All the other are identical with embodiment one.

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Abstract

The invention discloses a method for making a gold finger for hot insertion, which comprises the following steps: 1) pre-treatment of a PCB board, setting a solder resist layer and sandblasting on the PCB board; 2) silk screen printing anti-plating ink; 3) gold finger Gold plating; 4) removing the inner layer, removing the wet film formed by the anti-plating ink; 5) etching the inner layer. After the anti-plating ink in the present invention is used to form a wet film and then exposed and developed, the average value of the Pitch between the gold fingers obtained is closer to the design requirements, and the standard deviation is smaller from a statistical point of view, that is, the pitch between the gold fingers is better; In addition, the blue glue in the present invention is used, the curing time is shorter, the residual glue rate is lower, and the blue glue is subsidized at the pinch point of the electroplating gold after the gold finger gold plating is completed, and it is ensured that the inner layer is etched until the inner layer removes the film. Sufficient setting time can prevent the electroplating liquid from penetrating from the pinch point, thereby further reducing the defective rate of products.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a method for manufacturing gold fingers for hot insertion applications. Background technique [0002] Gold finger refers to the connection part formed on the circuit board to connect the slot. It is generally composed of many golden-yellow conductive contacts. Because the surface is gold-plated and the conductive contacts are arranged like fingers, they are also called gold fingers. In practical applications, the gold fingers are generally formed by coating a layer of gold on the copper clad board through an electroplating or chemical plating process. However, in the prior art, due to the selection and improper operation of anti-plating ink or blue glue, as well as the problem of liquid infiltration during etching, it often leads to uneven pitch between gold fingers or seepage phenomenon, resulting in an increase in product defect rate. Contents of the invention [0003] ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/40H05K3/24H05K3/06
Inventor 林睦群
Owner CHANGSHU MUTUAL TEK CO LTD
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