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Low-temperature lead-free solder alloy and vacuum casting method thereof

A lead-free solder alloy, vacuum casting technology, used in welding/cutting media/materials, welding media, manufacturing tools, etc., can solve the problems of lead and its compounds being toxic, health damage, etc., and achieve good wettability and anti-oxidation. properties, improved oxidation resistance, and high yield strength

Active Publication Date: 2019-06-25
云南锡业集团(控股)有限责任公司研发中心 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, lead and its compounds are toxic and will cause damage to the environment and human health. Therefore, countries have legislated to restrict the use of lead, which has promoted the development of lead-free electronic products.

Method used

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  • Low-temperature lead-free solder alloy and vacuum casting method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Example 1: The composition and mass percentage of this high-reliability low-temperature lead-free solder alloy are: Zn 11%, Bi8.5%, In 7%, Ag 0.8%, Mg 0.5%, V 0.3%, Zr 0.3%, Ga 0.3%, Ge 0.3%, the balance is Sn and inevitable impurities.

[0022] The preparation method is (1) industrial pure tin (Sn: 99.95wt%), industrial pure bismuth (Bi: 99.95wt%), industrial pure zinc (Zn: 99.9wt%) and indium, silver, magnesium, vanadium, zirconium , Gallium and germanium metals were polished with 320 grit sandpaper to remove the oxide layer, and put them in a blast drying oven (40℃) for drying and preheating; (2) using graphite crucible for alloy casting, before using crucible and slagging tools The surface of the bell jar, etc. is cleaned to remove impurities, and then placed in an oven at 40℃ to remove moisture before use. The temperature of the vacuum melting furnace is increased to 250℃, and the pure tin, which accounts for 30% of the total mass of pure tin, is placed at 245℃. Afte...

Embodiment 2

[0025] Example 2: The composition and mass percentage of the high-reliability lead-free solder alloy are: Zn 8%, Bi 5%, In4%, Ag 0.1%, Mg 0.05%, V 0.01%, and the balance is Sn and unavoidable 的impurities.

[0026] The preparation method is (1) industrial pure tin (Sn: 99.95wt%), industrial pure bismuth (Bi: 99.95wt%) and industrial pure zinc (Zn: 99.9wt%), and indium, silver, magnesium, vanadium metal Grind and remove the oxide layer with 320 grit sandpaper, respectively, and put them in a blast drying box (40℃) for drying and preheating; (2) Use graphite crucible for alloy casting, use the front crucible, slagging tool, bell jar and other surfaces Clean and remove impurities, and then put it in a 40℃ oven to bake to remove moisture before use. The vacuum melting furnace temperature gradient is raised to 250℃, and 20% of the total mass of pure tin is melted into a molten pool at 240℃ , Add the remaining pure tin; after the pure tin is completely melted, heat up to 270°C; (3) Add ...

Embodiment 3

[0029] Embodiment 3: The composition and mass percentage of the high-reliability lead-free solder alloy are: Zn 15%, Bi 12%, In10%, Ag 1.5%, Mg 1%, V 0.5%, Zr 0.5%, Ga 0.5% , Ge 0.5%, the balance is Sn and unavoidable impurities.

[0030] The preparation method is (1) industrial pure tin (Sn: 99.95wt%), industrial pure bismuth (Bi: 99.95wt%) and industrial pure zinc (Zn: 99.9wt%), as well as indium, silver, magnesium, vanadium, The zirconium, gallium, and germanium metals were polished with 320 grit sandpaper to remove the oxide layer, and placed in a blast drying oven (40°C) for drying and preheating; (2) Using graphite crucible for alloy casting, crucible and slag removal before use The surface of tools, bell jars, etc. are cleaned to remove impurities, and then placed in an oven at 40℃ to remove moisture before use. The temperature gradient of the vacuum melting furnace is raised to 250℃, and 40% of the total mass of pure tin is put at 250℃. After melting into a molten pool, ...

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Abstract

The invention discloses a low-temperature lead-free solder alloy which is characterized by being prepared from the following components in percent by mass: 8-15% of Zn, 5-12% of Bi, 4-10% of In, 0.1-1.5% of Ag, 0.05-1% of Mg, 0.01-2% of M and the balance Sn and inevitable impurities, wherein the mass percent of Sn is not smaller than 58.5%, and M is RE or at least one of V, Zr, Ga and Ge. The Sn-based low-temperature alloy solder provided by the invention has excellent wettability and good mechanical properties, and the reliability of welding spots is enhanced. Meanwhile, by smelting the components in a vacuum condition, influence of oxidative burning loss and oxidizing slag in the smelting process of metals to reliability of the welding spots can be avoided. The low-temperature lead-freesolder alloy can be applied to welding electronic parts and components with the not high heating temperature, so that the demand on light and thin development of electronic products is met.

Description

Technical field [0001] The invention relates to a high-reliability lead-free solder alloy and a vacuum casting preparation method thereof, belonging to the field of electronic product connection materials. Background technique [0002] With the continuous development and innovation of electronic manufacturing technology, electronic products are becoming thinner and thinner and smaller and smaller. Due to the shortness of the substrate, the solder joint pitch is getting narrower and narrower, and the requirements for electronic packaging technology are gradually increasing. The reliability of the solder joints is very important, and people are paying more attention to high-performance electronic packaging technology. In the process of manufacturing electronic products, the method of connecting components and substrates is brazing. The quality of brazing directly affects the quality of welding, which is a very important link. However, lead and its compounds are toxic and can cause...

Claims

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Application Information

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IPC IPC(8): B23K35/26B22D18/06
Inventor 彭巨擘唐芸生鲍庆煌张家涛普友福陈光云罗晓斌贾元伟梁华鑫郭绍雄
Owner 云南锡业集团(控股)有限责任公司研发中心
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